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1. 发明申请

US20090127695A1 SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT 审中-公开
标题翻译：表面安装包与增强强度焊接接头
公开(公告)号：US20090127695A1
公开(公告)日：2009-05-21
申请号：US11942404
申请日：2007-11-19
申请人： Patrick Kim , Mark A. Kuhlman , Yifan Guo , Anthony LoBianco , Robert W. Warren
发明人： Patrick Kim , Mark A. Kuhlman , Yifan Guo , Anthony LoBianco , Robert W. Warren
IPC分类号： H01L23/48 , H01L23/52 , H01L21/02
CPC分类号： H01L23/49811 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead-free solder is used.
摘要翻译：具有几何形状和结构的半导体封装中的衬底焊盘，其有助于提供具有增强的结构完整性和抗机械冲击的焊盘的焊接接头。焊盘可以包括电镀金属螺柱，其将焊料锚固到焊盘接口，即使当使用无铅焊料时，也提供更柔顺的焊接接头。

2. 发明申请

US20060220173A1 Wafer level package including a device wafer integrated with a passive component 有权
公开(公告)号：US20060220173A1
公开(公告)日：2006-10-05
申请号：US11097646
申请日：2005-04-01
申请人： Qing Gan , Robert Warren , Anthony Lobianco , Steve Liang
发明人： Qing Gan , Robert Warren , Anthony Lobianco , Steve Liang
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/49822 , B81C1/00269 , H01L21/4857 , H01L21/6835 , H01L23/49816 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/68345 , H01L2224/0401 , H01L2224/04026 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/1146 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/16235 , H01L2224/2746 , H01L2224/29011 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/32235 , H01L2224/73103 , H01L2224/81005 , H01L2224/81192 , H01L2224/81801 , H01L2224/83005 , H01L2224/83192 , H01L2224/9211 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , H01L2924/1461 , H01L2924/15151 , H01L2924/15159 , H01L2924/15184 , H01L2924/15311 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2224/81 , H01L2224/83 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.

3. 发明申请

US20070241440A1 Overmolded semiconductor package with a wirebond cage for EMI shielding 有权
标题翻译：包覆半导体封装，具有用于EMI屏蔽的引线键盘
公开(公告)号：US20070241440A1
公开(公告)日：2007-10-18
申请号：US11499285
申请日：2006-08-04
申请人： Dinhphuoc Hoang , Thomas Noll , Anil Agarwal , Robert Warren , Matthew Read , Anthony LoBianco
发明人： Dinhphuoc Hoang , Thomas Noll , Anil Agarwal , Robert Warren , Matthew Read , Anthony LoBianco
IPC分类号： H01L23/49
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

4. 发明授权

US09041168B2 Overmolded semiconductor package with wirebonds for electromagnetic shielding 有权
标题翻译：包覆半导体封装，具有用于电磁屏蔽的引线
公开(公告)号：US09041168B2
公开(公告)日：2015-05-26
申请号：US13311493
申请日：2011-12-05
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

5. 发明授权

US08399972B2 Overmolded semiconductor package with a wirebond cage for EMI shielding 有权
标题翻译：包覆半导体封装，具有用于EMI屏蔽的引线键盘
公开(公告)号：US08399972B2
公开(公告)日：2013-03-19
申请号：US11499285
申请日：2006-08-04
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L23/49
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

6. 发明申请

US20120146178A1 OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING 有权
标题翻译：具有电磁屏蔽线的超模半导体封装
公开(公告)号：US20120146178A1
公开(公告)日：2012-06-14
申请号：US13311493
申请日：2011-12-05
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L27/06 , H01L23/48
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

7. 发明申请

US20110084368A1 OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING 有权
标题翻译：带有用于EMI屏蔽的线束的超模半导体封装
公开(公告)号：US20110084368A1
公开(公告)日：2011-04-14
申请号：US12970705
申请日：2010-12-16
申请人： Dinphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

8. 发明授权

US06596212B1 Method and apparatus for increasing thickness of molded body on semiconductor package 有权
标题翻译：用于增加半导体封装上的成型体厚度的方法和装置
公开(公告)号：US06596212B1
公开(公告)日：2003-07-22
申请号：US09528884
申请日：2000-03-20
申请人： Anthony LoBianco , Jonathon Greenwood
发明人： Anthony LoBianco , Jonathon Greenwood
IPC分类号： B29C4502
CPC分类号： B29C45/14655 , B29C45/2673 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A simple, inexpensive method and apparatus are provided for increasing the thickness of a body molded on a semiconductor package without the need for a new mold, or for reworking the parts of an existing mold. The method includes providing a mold having parts that engage each other at respective interfacial surfaces, and a shim having a selected thickness and an opening through an interior portion thereof. The shim is interposed between the interfacial surfaces of the mold parts such that the mold parts are spaced apart by the thickness of the shim, and such that the mold parts and the shim opening define a cavity in the mold. The length and width of the cavity of the mold thus remain the same, while the height of the cavity, and hence, the thickness of the molded body, is increased by the thickness of the shim.
摘要翻译：提供了一种简单，便宜的方法和装置，用于增加模制在半导体封装上的主体的厚度，而不需要新的模具，或用于对现有模具的零件进行重新加工。该方法包括提供具有在相应界面处彼此接合的部分的模具，以及具有选定厚度的垫片和通过其内部部分的开口。垫片位于模具部件的界面之间，使得模具部件间隔开垫片的厚度，并且使得模具部件和垫片开口限定模具中的空腔。因此，模具的空腔的长度和宽度保持相同，而空腔的高度以及因此的模制体的厚度增加了垫片的厚度。

9. 发明申请

US20120137514A1 METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING 审中-公开
标题翻译：用于制造用于电磁屏蔽的带有绕线的超模半导体封装的方法
公开(公告)号：US20120137514A1
公开(公告)日：2012-06-07
申请号：US13311436
申请日：2011-12-05
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H05K3/36 , H01L21/56
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

10. 发明授权

US08071431B2 Overmolded semiconductor package with a wirebond cage for EMI shielding 有权
标题翻译：包覆半导体封装，具有用于EMI屏蔽的引线键盘
公开(公告)号：US08071431B2
公开(公告)日：2011-12-06
申请号：US12970705
申请日：2010-12-16
申请人： Dinphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L21/44
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

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