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1. 发明授权

US09054115B2 Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding 有权
标题翻译：用于制造具有用于电磁屏蔽的引线的包覆成型的半导体封装的方法
公开(公告)号：US09054115B2
公开(公告)日：2015-06-09
申请号：US13311436
申请日：2011-12-05
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L21/56 , H05K3/36 , H01L23/552 , H01L23/00 , H01L23/31
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

2. 发明申请

US20130021219A1 RADIO-FREQUENCY MODULES HAVING TUNED SHIELDING-WIREBONDS 有权
标题翻译：具有调谐屏蔽线的无线电频率模块
公开(公告)号：US20130021219A1
公开(公告)日：2013-01-24
申请号：US13543084
申请日：2012-07-06
申请人： Anil K. Agarwal , Dinhphuoc Vu Hoang , Howard E. Chen , Anthony James LoBianco , Matthew Sean Read , Hoang Mong Nguyen , Guohao Zhang
发明人： Anil K. Agarwal , Dinhphuoc Vu Hoang , Howard E. Chen , Anthony James LoBianco , Matthew Sean Read , Hoang Mong Nguyen , Guohao Zhang
IPC分类号： H01Q1/52 , H05K3/30 , H05K9/00
CPC分类号： H05K9/0064 , H01L23/552 , H01L2224/48227 , H01L2924/1421 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H04B1/3838 , H05K3/30 , H05K9/0028 , Y10T29/4913 , H01L2924/00
摘要： Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding-wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.
摘要翻译：公开了与RF模块的射频（RF）屏蔽有关的设备和方法。在一些实施例中，调谐屏蔽可以通过利用不同的屏蔽线结构和/或布置来实现，以增加需要的区域中的屏蔽，并且在不需要的地方减少屏蔽。通过测量具有给定设计的模块的不同位置处的RF功率电平，可以获得屏蔽要求的这种调谐。这种调谐的RF屏蔽配置可以提高屏蔽的总体有效性，并且也可以更具成本效益地实现。

3. 发明授权

US07925211B2 Method for uplink power control for distributed satellite networks to compensate for rain fade 有权
标题翻译：用于分布式卫星网络的上行链路功率控制方法，以补偿雨衰
公开(公告)号：US07925211B2
公开(公告)日：2011-04-12
申请号：US12429071
申请日：2009-04-23
申请人： Anil K. Agarwal , Moorthy N. Hariharan
发明人： Anil K. Agarwal , Moorthy N. Hariharan
IPC分类号： H04B7/185
CPC分类号： H04B7/2125 , H04B7/18513 , H04B7/18543 , H04B7/208 , H04L1/0003 , H04L1/0007 , H04L1/0009 , H04L1/0017 , H04L1/0025 , H04L1/0083 , H04W52/28
摘要： A method for dynamically determining the power compression point of an amplifier in a distributed network under the control of a computer, the network having a first terminal (600) including the amplifier operatively coupled to a plurality of second terminals (500) by a communication channel including the steps for generating bit error rate (BER) messages indicative of measured BER for a signal transmitted at N power levels, the BER messages including respective tags indicative of the N power levels for that BER, at the second terminals (500), and reducing the maximum allowed power of the amplifier when it is determined that the amplifier is approaching saturation responsive to the BER messages. Also described is a method for dynamic uplink power control for an amplifier in a distributed network.
摘要翻译：一种用于在计算机的控制下动态地确定分布式网络中的放大器的功率压缩点的方法，所述网络具有包括通过通信信道可操作地耦合到多个第二终端（500）的放大器的第一终端（600）包括用于产生指示在N个功率电平处发送的信号的测量BER的误码率（BER）消息的步骤，所述BER消息包括在第二终端（500）处指示该BER的N个功率电平的相应标签，以及当确定放大器响应于BER消息接近饱和时，减小放大器的最大允许功率。还描述了用于分布式网络中的放大器的动态上行链路功率控制的方法。

4. 发明授权

US07599658B1 Method for uplink power control for distributed satellite networks to compensate for rain fade 有权
标题翻译：用于分布式卫星网络的上行链路功率控制方法，以补偿雨衰
公开(公告)号：US07599658B1
公开(公告)日：2009-10-06
申请号：US09529773
申请日：1998-10-20
申请人： Anil K. Agarwal , Moorthy N. Hariharan
发明人： Anil K. Agarwal , Moorthy N. Hariharan
IPC分类号： H04B7/185
CPC分类号： H04B7/2125 , H04B7/18513 , H04B7/18543 , H04B7/208 , H04L1/0003 , H04L1/0007 , H04L1/0009 , H04L1/0017 , H04L1/0025 , H04L1/0083 , H04W52/28
摘要： A method for dynamically determining the power compression point of an amplifier in a distributed network under the control of a computer, the network having a first terminal (600) including the amplifier operatively coupled to a plurality of second terminals (500) by a communication channel including the steps for generating bit error rate (BER) messages indicative of measured BER for a signal transmitted at N power levels, the BER messages including respective tags indicative of the N power levels for that BER, at the second terminals (500), and reducing the maximum allowed power of the amplifier when it is determined that the amplifier is approaching saturation responsive to the BER messages. Also described is a method for dynamic uplink power control for an amplifier in a distributed network.
摘要翻译：一种用于在计算机的控制下动态地确定分布式网络中的放大器的功率压缩点的方法，所述网络具有包括通过通信信道可操作地耦合到多个第二终端（500）的放大器的第一终端（600）包括用于产生指示在N个功率电平处发送的信号的测量BER的误码率（BER）消息的步骤，所述BER消息包括在第二终端（500）处指示该BER的N个功率电平的相应标签，以及当确定放大器响应于BER消息接近饱和时，减小放大器的最大允许功率。还描述了用于分布式网络中的放大器的动态上行链路功率控制的方法。

5. 发明授权

US06839330B1 Method and apparatus for improving asynchronous transfer mode operation over noisy, high speed wireless links 有权
标题翻译：用于在嘈杂的高速无线链路上改进异步传输模式操作的方法和装置
公开(公告)号：US06839330B1
公开(公告)日：2005-01-04
申请号：US09462895
申请日：1998-07-15
申请人： Dattakumar M. Chitre , Anil K. Agarwal , Prabhakar Gowrisankaran , John A. Lunsford , Sathyanarayanan Narayanaswamy
发明人： Dattakumar M. Chitre , Anil K. Agarwal , Prabhakar Gowrisankaran , John A. Lunsford , Sathyanarayanan Narayanaswamy
IPC分类号： H03M7/30 , H03M13/15 , H03M13/23 , H03M13/27 , H03M13/29 , H03M13/35 , H04B7/185 , H04J3/06 , H04L1/00 , H04L5/02 , H04L5/06 , H04L7/04 , H04L12/56 , H04Q11/04 , H04B7/212
CPC分类号： H04L1/0057 , H03M7/30 , H03M13/15 , H03M13/23 , H03M13/27 , H03M13/29 , H03M13/35 , H03M13/6312 , H04B7/18532 , H04B7/1858 , H04B7/18582 , H04J3/0608 , H04L1/0007 , H04L1/0009 , H04L1/0025 , H04L1/0041 , H04L1/0054 , H04L1/0071 , H04L1/0072 , H04L1/0083 , H04L5/023 , H04L5/06 , H04L7/048 , H04L12/5601 , H04L2012/5607 , H04L2012/5608 , H04L2012/5616 , H04L2012/5627 , H04L2012/5632 , H04L2012/5647 , H04L2012/5649 , H04L2012/5652 , H04L2012/5662 , H04L2012/5675 , H04Q11/0478
摘要： A method for encoding ATM cells for transmission over a wireless link comprising the steps of receiving an ATM cell stream comprised of a plurality of ATM cells and detecting idle/unassigned cells within the cell stream. Then, a header frame made up of headers of a number of the plurality of ATM cells is assembled, together with a payload frame made up of payloads of a number of the plurality of ATM cells. Finally, some of the detected idle/unassigned cells are placed in a selected portion of the payload frame.
摘要翻译：一种用于对通过无线链路进行传输的ATM信元进行编码的方法，包括以下步骤：接收由多个ATM信元组成的ATM信元流并检测所述信元流内的空闲/未分配信元。然后，由多个ATM信元的数量的报头构成的报头帧与由多个ATM信元的数量的有效载荷构成的有效载荷帧一起进行组装。最后，检测到的空闲/未分配小区中的一些被放置在有效载荷帧的选定部分中。

6. 发明授权

US06453281B1 Portable audio database device with icon-based graphical user-interface 失效
标题翻译：便携式音频数据库设备，具有基于图标的图形用户界面
公开(公告)号：US06453281B1
公开(公告)日：2002-09-17
申请号：US08688299
申请日：1996-07-30
申请人： Timothy L. Walters , Anil K. Agarwal , Thomas Russell
发明人： Timothy L. Walters , Anil K. Agarwal , Thomas Russell
IPC分类号： G06F300
CPC分类号： G06F17/30755 , G06F3/0481 , G06F17/30749 , G06F17/30775
摘要： A method and apparatus for storing and retrieving information to and from a memory of a hand-held audio database device. The audio database device includes a graphics display provided on a hand-held housing for displaying graphical information. A microphone and a speaker are provided on the housing to receive and broadcast audio information from and to a user, respectively. The audio database device includes a memory configured to store graphical icons and to support a hierarchical memory structure comprising categories, wherein the icons graphically represent the categories. A user-actuated navigation control is provided on the housing and permits a user to navigate the categories in the hierarchical memory structure and to select a desired category. A processor is coupled to the memory, the display, and the navigation control and effects displaying of one of the icons on the display when the user is navigating a corresponding one of the categories, and storing of the audio information in the desired category of the memory.
摘要翻译：一种用于存储和从手持音频数据库设备的存储器检索信息的方法和装置。音频数据库装置包括设置在用于显示图形信息的手持外壳上的图形显示器。麦克风和扬声器分别设置在外壳上以从用户接收和广播音频信息。音频数据库设备包括被配置为存储图形图标并且支持包括类别的分层存储器结构的存储器，其中图标以图形方式表示类别。在壳体上提供用户致动的导航控制，并且允许用户在分层存储器结构中导航类别并选择期望的类别。处理器耦合到存储器，显示器和导航控制，并且当用户正在浏览相应的一个类别时将显示器上的图标之一显示出来，并将音频信息存储在期望的类别中记忆。

7. 发明授权

US09041168B2 Overmolded semiconductor package with wirebonds for electromagnetic shielding 有权
标题翻译：包覆半导体封装，具有用于电磁屏蔽的引线
公开(公告)号：US09041168B2
公开(公告)日：2015-05-26
申请号：US13311493
申请日：2011-12-05
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

8. 发明授权

US08399972B2 Overmolded semiconductor package with a wirebond cage for EMI shielding 有权
标题翻译：包覆半导体封装，具有用于EMI屏蔽的引线键盘
公开(公告)号：US08399972B2
公开(公告)日：2013-03-19
申请号：US11499285
申请日：2006-08-04
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L23/49
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

9. 发明申请

US20120146178A1 OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING 有权
标题翻译：具有电磁屏蔽线的超模半导体封装
公开(公告)号：US20120146178A1
公开(公告)日：2012-06-14
申请号：US13311493
申请日：2011-12-05
申请人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinhphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L27/06 , H01L23/48
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

10. 发明申请

US20110084368A1 OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING 有权
标题翻译：带有用于EMI屏蔽的线束的超模半导体封装
公开(公告)号：US20110084368A1
公开(公告)日：2011-04-14
申请号：US12970705
申请日：2010-12-16
申请人： Dinphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
发明人： Dinphuoc V. Hoang , Thomas E. Noll , Anil K. Agarwal , Robert W. Warren , Matthew S. Read , Anthony LoBianco
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

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