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    • 3. 发明授权
    • Method for forming a lightly-doped drain (LDD) structure in a
semiconductor device
    • 在半导体器件中形成轻掺杂漏极(LDD)结构的方法
    • US4994404A
    • 1991-02-19
    • US399670
    • 1989-08-28
    • David Y. ShengYasunobu KosaAndrew J. UrquhartMark J. Cullen
    • David Y. ShengYasunobu KosaAndrew J. UrquhartMark J. Cullen
    • H01L21/336
    • H01L29/6659Y10S438/945
    • A process is disclosed for the formation of an LDD structure in an MOS transistor having a reduced mask count and providing high integrity source/drain junctions. In accordance with one embodiment of the invention an MOS transistor is formed having a gate dielectric overlying an active region of the substrate. A transistor gate is formed in a central portion of the active region and an oxidation layer is formed over the active region and the transistor gate. A lightly-doped source/drain region is formed which is self aligned to the transistor gate. A conformal layer of an oxygen reactive material is formed overlying the transistor gate and the active region. The oxygen reactive material is anisotropically etched in a oxygen plasma reactive ion etch to form a sidewall spacer on the edge the transistor gate. The oxygen reactive ion etch does not penetrate the oxidation layer overlying the active region. A heavily-doped source/drain region is formed which is self aligned to the edge of the sidewall spacer. The sidewall spacer is then removed completing the LDD structure.
    • 公开了一种用于在具有减小的掩模计数并提供高完整性源极/漏极结的MOS晶体管中形成LDD结构的工艺。 根据本发明的一个实施例,形成具有覆盖在衬底的有源区上的栅极电介质的MOS晶体管。 晶体管栅极形成在有源区的中心部分,氧化层形成在有源区和晶体管栅上。 形成与晶体管栅极自对准的轻掺杂源/漏区。 在晶体管栅极和有源区上形成氧反应性材料的共形层。 氧反应性材料在氧等离子体反应离子蚀刻中各向异性蚀刻以在晶体管栅极的边缘上形成侧壁间隔物。 氧反应离子蚀刻不穿透覆盖有源区的氧化层。 形成重掺杂源极/漏极区域,其与侧壁间隔物的边缘自对准。 然后去除侧壁间隔物,完成LDD结构。