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1. 发明授权

US07062741B1 Wire bond padring bond pad checker program 失效
标题翻译：导线键合焊盘焊盘检查程序
公开(公告)号：US07062741B1
公开(公告)日：2006-06-13
申请号：US10351101
申请日：2003-01-23
申请人： Allen Cheah Chong Leng , Tan Ping Chet
发明人： Allen Cheah Chong Leng , Tan Ping Chet
IPC分类号： G06F17/50
CPC分类号： G06F17/5081
摘要： A computer-implemented method is described for verifying bond pad position conformity with predetermined design rules corresponding to a padring design. The padring design includes a plurality of linear arrays of bond pads. Horizontal and vertical scribelines for the padring design are defined. A first one of the linear arrays of bond pads is selected. Each bond pad has associated position values. Bond pad position data are determined with reference to the scribelines and the associated position values. The bond pad position data are compared to the predetermined design rules. Where violations of the predetermined design rules exist, the violations are identified.
摘要翻译：描述了一种计算机实现的方法，用于验证与垫环设计相对应的预定设计规则的接合垫位置一致性。垫环设计包括多个键合衬垫的线性阵列。定义了用于衬垫设计的水平和垂直划线。选择接合焊盘的线性阵列中的第一个。每个接合垫具有相关联的位置值。键盘位置数据是参照刻划线和相关的位置值来确定的。将焊盘位置数据与预定的设计规则进行比较。如果存在违反预定设计规则的行为，则确定违规行为。

2. 发明授权

US07215009B1 Expansion plane for PQFP/TQFP IR—package design 有权
标题翻译： PQFP / TQFP IR封装设计扩展平面
公开(公告)号：US07215009B1
公开(公告)日：2007-05-08
申请号：US10785535
申请日：2004-02-23
申请人： Allen Cheah Chong Leng , Tan Ping Chet
发明人： Allen Cheah Chong Leng , Tan Ping Chet
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49589 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/27013 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10161 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： Provided is a lead frame package with an expansion plane to minimize electrical parasitics introduced into the semiconductor chip's electrical system (e.g., power delivery system, signal loops, etc.). Also provided are methods for assembling such lead frame packages into various semiconductor packages. Generally, a lead frame package includes a down set die attach pad over an underlying bottom plate. Both the die attach pad and the bottom plate may be used as intermediary connections for either power or ground connections. As compared to conventional lead frame package having an intermediary connection, the lead frame packages of the present invention can provide for any combination of shorter wire bond lengths, more wire bond connections, improved power delivery system, or reduced amounts of electrical parasitics.
摘要翻译：提供了一种具有扩展平面的引线框封装，以最小化引入到半导体芯片的电气系统（例如，电力输送系统，信号回路等）中的电寄生效应。还提供了将这种引线框架封装组装成各种半导体封装的方法。通常，引线框架封装包括在下面的底板上的下降管芯附接垫。芯片安装板和底板都可以用作电源或接地连接的中间连接。与具有中间连接的常规引线框封装相比，本发明的引线框架封装可以提供更短的引线键长度，更多的引线键合连接，改进的功率输送系统或减少的电寄生效应的组合。

3. 发明授权

US07038305B1 Package for integrated circuit die 失效
标题翻译：集成电路芯片封装
公开(公告)号：US07038305B1
公开(公告)日：2006-05-02
申请号：US10621255
申请日：2003-07-15
申请人： Tan Ping Chet , Allen Cheah Chong Leng
发明人： Tan Ping Chet , Allen Cheah Chong Leng
IPC分类号： H01L23/495 , H01L23/34 , H01L23/48 , H01L23/52 , H01L21/44
CPC分类号： H01L24/49 , H01L23/13 , H01L23/36 , H01L23/49527 , H01L23/49541 , H01L23/49568 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48253 , H01L2224/4911 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit device package and method of assembling same is disclosed. The device package includes an interposer ring substrate having a hollowed out center mounted on a die attach pad, a die mounted substantially in the center of the die attach pad such that the die is encompassed by the hollowed out center. The package further includes a single-piece drop-in heat sink having a first and second disk shaped portions where the first disk shaped portion has a diameter that is different than the second disk shaped portion.
摘要翻译：公开了一种集成电路器件封装及其组装方法。器件封装包括具有安装在管芯附接焊盘上的中空的中心的插入器环形衬底，基本上安装在管芯附接垫的中心的管芯，使得管芯被中空的中心包围。该封装还包括具有第一和第二盘形部分的单件式散热器，其中第一盘形部分具有与第二盘形部分不同的直径。

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