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1. 发明授权

US07091602B2 Miniature moldlocks for heatsink or flag for an overmolded plastic package 有权
标题翻译：微型模具用于散热器或标志，用于包覆成型塑料包装
公开(公告)号：US07091602B2
公开(公告)日：2006-08-15
申请号：US10318699
申请日：2002-12-13
申请人： Alexander J. Elliott , L. Mali Mahalingam , William M. Strom
发明人： Alexander J. Elliott , L. Mali Mahalingam , William M. Strom
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L21/4842 , H01L21/4878 , H01L23/4334 , H01L2924/0002 , Y10T29/49121 , H01L2924/00
摘要： A system of mold locks (28, 30) is formed on a heatsink (2) of a packaged semiconductor to prevent/mitigate delamination. The mold locks (4, 12) anchor a plastic mold compound (34) that forms the protective cover for the packaged semiconductor die. The mold locks (4, 12) are miniaturized to allow the positioning of them within the flag portion of the heatsink (2) and leadframe (24) such that a semiconductor die can be anchored above the mold locks (4, 12) formed within the flag portion of the heatsink/lead frame (2, 24). The miniaturized size of the said moldlocks (4, 12 do not detract from the purpose of the die attach solder (36).
摘要翻译：在封装半导体的散热器（2）上形成模具锁（28,30）的系统，以防止/减轻分层。模具锁（4,12）锚固形成用于封装的半导体管芯的保护盖的塑料模具化合物（34）。模具锁（4,12）被小型化以允许它们定位在散热器（2）和引线框架（24）的标志部分内，使得半导体管芯可以锚固在形成在其内的模具锁（4,12）的上方散热器/引线框架的标志部分（2,24）。所述模具锁（4,12）的小型化尺寸不会降低芯片附着焊料（36）的目的。

2. 发明授权

US5786745A Electronic package and method 失效
标题翻译：电子封装及方法
公开(公告)号：US5786745A
公开(公告)日：1998-07-28
申请号：US597307
申请日：1996-02-06
申请人： Alexander J. Elliott , Lonne L. Mays
发明人： Alexander J. Elliott , Lonne L. Mays
IPC分类号： H01C1/084 , H05K3/30 , H01C1/08
CPC分类号： H01C1/084 , H05K3/303 , H05K2201/10568 , H05K2201/10583 , H05K2201/10651 , Y02P70/613
摘要： A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).
摘要翻译：包装（10）具有形成多边形形状的最外表面（12,13,14,16）。包装体（10）的主体（11）具有围绕轴线（21）的轴向对称性。引线（22）沿轴线（21）离开封装。

3. 发明授权

US5075255A Method of removing contaminants from a plated article with a clean burning hydrogen flame 失效
标题翻译：用清洁燃烧的氢气火焰从电镀制品中除去污染物的方法
公开(公告)号：US5075255A
公开(公告)日：1991-12-24
申请号：US661143
申请日：1991-02-27
申请人： Alexander J. Elliott
发明人： Alexander J. Elliott
IPC分类号： H01L21/48
CPC分类号： H01L21/4835
摘要： A clean burning high temperature flame is used to vaporize contaminants from a lead frame's surface, and also vaporize contaminants up to a shallow depth into the lead frame.
摘要翻译：使用清洁燃烧的高温火焰从引线框架的表面蒸发污染物，并将污染物蒸发到引导框架的浅深度。

4. 发明授权

US06996897B2 Method of making a mount for electronic devices 有权
标题翻译：电子设备安装方法
公开(公告)号：US06996897B2
公开(公告)日：2006-02-14
申请号：US10208867
申请日：2002-07-31
申请人： Frank J. Mosna, Jr. , Alexander J. Elliott , William M. Strom
发明人： Frank J. Mosna, Jr. , Alexander J. Elliott , William M. Strom
IPC分类号： B23P15/00
CPC分类号： H01L23/49544 , H01L23/49575 , H01L2924/0002 , Y10T29/49117 , Y10T29/49121 , H01L2924/00
摘要： method for making a mount for at least two electronic devices forming a first mounting surface (210) from a material (240), and forming a second mounting surface (220) from the material (240). The first mounting surface (210) is connected to, but spaced from, the second mounting surface (220) by a mounting surface distance (250). The method further comprises reducing the mounting surface distance (250).
摘要翻译：用于制造用于至少两个电子器件的安装件的方法，所述至少两个电子器件从材料（240）形成第一安装表面（210），以及从所述材料（240）形成第二安装表面（220）。第一安装表面（210）通过安装表面距离（250）连接到第二安装表面（220）但与第二安装表面（220）隔开。该方法还包括减小安装表面距离（250）。

5. 发明授权

US5614131A Method of making an optoelectronic device 失效
标题翻译：制造光电器件的方法
公开(公告)号：US5614131A
公开(公告)日：1997-03-25
申请号：US431994
申请日：1995-05-01
申请人： Prosanto K. Mukerji , Alexander J. Elliott , Shanmugam Suppiah
发明人： Prosanto K. Mukerji , Alexander J. Elliott , Shanmugam Suppiah
IPC分类号： B29C39/10 , B29C70/84 , H01L21/56 , H01L31/0232 , H01L31/173 , B29D11/00
CPC分类号： H01L31/0232 , B29C39/10 , B29C70/84 , H01L21/56 , H01L31/173 , H01L2224/48091 , H01L2224/48247 , H01L2924/01039 , H01L2924/12041
摘要： An optoelectronic device is fabricated by casting a transparent polymeric body surrounding an electronic component. A reflective layer is formed over the polymeric body. The reflective layer acts as a mirror to reflect light emitted by one electronic component to another electronic component which receives the light. By casting the polymeric body, a consistent and defined shape for optical transmission is provided for forming the shape of the reflective layer.
摘要翻译：通过铸造围绕电子部件的透明聚合物制造光电子器件。在聚合体上形成反射层。反射层用作反射镜，以将由一个电子部件发射的光反射到接收光的另一个电子部件。通过浇铸聚合物体，提供用于光学透射的一致且限定的形状用于形成反射层的形状。

6. 发明授权

US5175007A Mold assembly with separate encapsulating cavities 失效
标题翻译：具有独立封装腔体的模具组件
公开(公告)号：US5175007A
公开(公告)日：1992-12-29
申请号：US705860
申请日：1991-05-28
申请人： Alexander J. Elliott
发明人： Alexander J. Elliott
IPC分类号： B29C45/02 , B29C45/14 , H01L21/56
CPC分类号： B29C45/02 , B29C45/14655 , H01L21/565 , H01L2924/0002
摘要： A duo-cavity multigang pot molding assembly (10) for encapsulating semiconductor devices having an annular cavity (11) to form a molded carrier ring and an inner cavity (12) adapted to receive the item to be encapsulated. An outer mold pot (16) provides encapsulating material for the annular cavity (11) whereas a separate mold pot (17) provides encapsulating material for the inner cavity (12). Encapsulating material for the mold pots (16, 17) may be the same or in a preferred embodiment, different. Molding apparatus (10) promotes improved process control by delivering encapsulating material with a lower and more uniform viscosity to both the annular cavity (11) and the inner cavity (12). Further, use of separate mold pots (16, 17) allows cost savings because a less expensive encapsulating material may be used for molding the molded carrier ring since a high purity encapsulating material is not needed.
摘要翻译：一种用于封装具有环形空腔（11）以形成模制载体环的半导体器件的二腔多电极罐模塑组件（10）和适于接收待封装的物品的内腔（12）。外模罐（16）提供用于环形空腔（11）的封装材料，而单独的模具罐（17）提供用于内腔（12）的封装材料。用于模具罐（16,17）的封装材料可以相同或在优选实施例中是不同的。成型设备（10）通过将具有较低和更均匀粘度的密封材料递送到环形空腔（11）和内腔（12）来促进改进的过程控制。此外，由于不需要高纯度的封装材料，所以使用分离的模具罐（16,17）可以节省成本，因为较便宜的封装材料可用于模制模制的载体环。

7. 发明授权

US08310042B2 Heatsink moldlocks 有权
标题翻译：散热模具
公开(公告)号：US08310042B2
公开(公告)日：2012-11-13
申请号：US11424183
申请日：2006-06-14
申请人： Alexander J. Elliott , L. M. Mahalingam , William M. Strom
发明人： Alexander J. Elliott , L. M. Mahalingam , William M. Strom
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L21/4842 , H01L21/4878 , H01L23/4334 , H01L2924/0002 , Y10T29/49121 , H01L2924/00
摘要： A system of mold locks (28, 30) is formed on a heatsink (2) of a packaged semiconductor to prevent/mitigate delamination. The mold locks (4, 12) anchor a plastic mold compound (34) that forms the protective cover for the packaged semiconductor die. The mold locks (4, 12) are miniaturized to allow the positioning of them within the flag portion of the heatsink (2) and leadframe (24) such that a semiconductor die can be anchored above the mold locks (4, 12) formed within the flag portion of the heatsink/lead frame (2, 24). The miniaturized size of the said moldlocks (4, 12 do not detract from the purpose of the die attach solder (36).
摘要翻译：在封装半导体的散热器（2）上形成模具锁（28,30）的系统，以防止/减轻分层。模具锁（4,12）锚固形成用于封装的半导体管芯的保护盖的塑料模具化合物（34）。模具锁（4,12）被小型化以允许它们定位在散热器（2）和引线框架（24）的标志部分内，使得半导体管芯可以锚固在形成在其内的模具锁（4,12）的上方散热器/引线框架的标志部分（2,24）。所述模具锁（4,12）的小型化尺寸不会降低芯片附着焊料（36）的目的。

8. 发明授权

US06147410A Electronic component and method of manufacture 失效
标题翻译：电子元件及制造方法
公开(公告)号：US06147410A
公开(公告)日：2000-11-14
申请号：US33188
申请日：1998-03-02
申请人： Alexander J. Elliott , Timothy E. Meko , Gary R. Lorenzen , Kent Lamar Kime , Prosanto K. Mukerji , Keith W. Bailey , William L. Fragale , Pablo Rodriguez , George C. Chen
发明人： Alexander J. Elliott , Timothy E. Meko , Gary R. Lorenzen , Kent Lamar Kime , Prosanto K. Mukerji , Keith W. Bailey , William L. Fragale , Pablo Rodriguez , George C. Chen
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L24/06 , H01L23/49548 , H01L23/49562 , H01L24/05 , H01L24/40 , H01L24/41 , H01L24/49 , H01L2224/04042 , H01L2224/05551 , H01L2224/05563 , H01L2224/05599 , H01L2224/0603 , H01L2224/37011 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/4903 , H01L2224/49051 , H01L2224/85399 , H01L24/48 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/14
摘要： An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).
摘要翻译：电子部件包括半导体衬底（101,301,401），由半导体衬底（101,301,401）支撑的导电层（102,103,302,303,402,403）和引线（110 ，具有耦合到所述导电层（102,103,302,303,402,403）的电耦合部分（112,122,212,312,412,422），所述电耦合部分），其中所述电耦合部分（112,122,212,312,412,422）具有与所述导电层（102,103,302,303,402,403）相邻的至少一个凹口（115,215,315）。

9. 发明授权

US5074139A Roll forming of semiconductor component leadframes 失效
标题翻译：半导体元件引线框的成型
公开(公告)号：US5074139A
公开(公告)日：1991-12-24
申请号：US664234
申请日：1991-03-04
申请人： Alexander J. Elliott
发明人： Alexander J. Elliott
IPC分类号： B21D5/08 , H01L23/50 , H05K13/00
CPC分类号： H05K13/0092 , Y10T29/49121
摘要： A method by which leads of a semiconductor component are bent into their final shape using a roll forming process to bend the leads into the desired shape before separation of the individual components. The roll forming process achieves a final form by passing a lead frame holding a plurality of the semiconductor components through a series of form rollers which progressively bend the leads into the final shape. The method can be designed to cut the components free from the lead frame as a final step, minimizing the individual handling of the miniaturized components.
摘要翻译：半导体部件的引线使用辊成型工艺弯曲成其最终形状的方法，以在分离各个部件之前将引线弯曲成所需的形状。通过使保持多个半导体部件的引线框架通过将引线逐渐弯曲成最终形状的一系列成形辊来实现最终形状。该方法可以设计成将没有引线框架的部件切割成最后的步骤，从而最小化小型化部件的单独处理。

10. 发明申请

US20140035114A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD 有权
标题翻译：半导体封装结构与方法
公开(公告)号：US20140035114A1
公开(公告)日：2014-02-06
申请号：US13745072
申请日：2013-01-18
申请人： Bishnu Prasanna Gogoi , Phuong Le , Alexander J. Elliott
发明人： Bishnu Prasanna Gogoi , Robert Bruce Davies , Phuong Le , Alexander J. Elliott
IPC分类号： H01L25/065
CPC分类号： H01L25/0652 , H01L23/13 , H01L23/142 , H01L23/3121 , H01L23/60 , H01L23/64 , H01L25/072 , H01L2224/48091 , H01L2224/73257 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a semiconductor package structure includes a substrate having a well region extending from a major surface. An interposer structure is attached to the substrate within the well region. The interposer structure has a major surface that is substantially co-planar with the major surface of the substrate. An electrical device is directly attached to the substrate and the interposer structure. The interposer structure can be an active device, such as a gate driver integrated circuit, or passive device structure, such as an impedance matching network.
摘要翻译：在一个实施例中，半导体封装结构包括具有从主表面延伸的阱区的衬底。插入器结构附着在阱区内的衬底上。插入器结构具有与基板的主表面基本共面的主表面。电气设备直接连接到基板和插入器结构。插入器结构可以是有源器件，例如栅极驱动器集成电路或无源器件结构，例如阻抗匹配网络。

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