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    • 3. 发明申请
    • THERMALLY CURABLE PRECURSOR OF A TOUGHENED THERMO-EXPANDED FILM AND A FILM MADE THEREOF
    • 热固化热膨胀膜的热固化前驱体及其薄膜
    • US20100120936A1
    • 2010-05-13
    • US11995954
    • 2006-07-21
    • Alain H. Lamon
    • Alain H. Lamon
    • C08G59/00
    • C08J9/04B29C44/022C08J2363/00
    • Precursor of a toughened foamed film comprising a. 30-60 wt. % of at least one epoxy compound with an average epoxy equivalent weight of at least 350 g, b. 10-25 wt. % of at least one epoxy compound with an average epoxy equivalent weight of less than 200 g, c. 2-40 wt. % of at least one epoxy curing agent, d. 10-30 wt. % of at least one toughening agent, and e. at least one blowing agent wherein the mass ratio of the epoxy components a and b and the amount of the toughening component d is selected to provide a floating roller peel strength of the cured film of at least 150 N/25 mm at 23° C. and/or a shear impact strength of at least 12 kN/m2 at 23° C.
    • 增韧发泡膜的前体包含a。 30-60重量% %的至少一种平均环氧当量为至少350g的环氧化合物,b。 10-25重量% %的至少一种平均环氧当量小于200g的环氧化合物,c。 2-40重量% %至少一种环氧固化剂,d。 10-30重量% 至少一种增韧剂的%,以及e。 选择环氧组分a和b的质量比和增韧组分d的量的至少一种发泡剂,以在23℃下提供至少150N / 25mm的固化膜的浮辊剥离强度。 和/或在23℃下剪切冲击强度至少为12kN / m 2。
    • 4. 发明申请
    • Fire-Retardant Low-Density Epoxy Composition
    • 阻燃低密度环氧组合物
    • US20080167412A1
    • 2008-07-10
    • US11721833
    • 2005-12-23
    • Sohaib ElgimiabiAlain H. Lamon
    • Sohaib ElgimiabiAlain H. Lamon
    • C08K3/22C08K3/32
    • C09K21/04C08K3/22C08K3/32C09K21/02C08L63/00
    • The present invention relates to a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition comprising (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1 to 55 weight percent of at least one epoxide hardener, (iii) 5 to 50 weight percent of an essentially halogen-free fire-retardant system that includes a mixture of: (1) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (2) at least one phosphorous-containing material, (iv) 10 to 60 weight percent of a filler system capable of reducing the density of the precursor that includes a mixture of (1) at least one low-density inorganic filler having a density of between 0.1 to 0.5 g cm−3?, (2) at least one low-density organic filler having a density of between 0.01 to 0.30 g/cm−3? and being compressible.
    • 本发明涉及阻燃,低密度和基本上无卤素的环氧组合物的可固化前体,其包含(i)10至70重量%的至少一种环氧官能度为至少一个的有机环氧化合物,( ii)1至55重量%的至少一种环氧化物硬化剂,(iii)5至50重量%的基本上不含卤素的阻燃体系,其包括以下混合物:(1)至少一种选自以下的化合物: 碱土金属氢氧化物和铝基氢氧化物,和(2)至少一种含磷材料,(iv)10至60重量%的能够降低前体密度的填料体系,其包括(1)在 至少一种密度为0.1至0.5g / cm 2的低密度无机填料,其中= =“3.56mm”wi =“1.44mm”file =“US20080167412A1-20080710-P00001”。 TIF“img-content =”character“img-format =”tif“/> -3?(2)至少有一个低密度 密度在0.01至0.30g / cm 2之间的有机填料 - 3? 并可压缩。
    • 5. 发明授权
    • Pressure-sensitive adhesive tape
    • 压敏胶带
    • US06254954B1
    • 2001-07-03
    • US09367958
    • 1999-08-26
    • Greggory S. BennettClayton A. GeorgeGuido HitschmannAlain H. Lamon
    • Greggory S. BennettClayton A. GeorgeGuido HitschmannAlain H. Lamon
    • B32B2704
    • C09J167/00C08L63/00C08L71/00C08L2666/22C09J7/10C09J7/38C09J2463/00C09J2467/00Y10T428/1476Y10T428/2809Y10T428/287
    • The invention relates to a pressure-sensitive adhesive tape with improved room temperature handleability comprising an adhesive layer with at least one exposed surface and optionally a backing, wherein the pressure-sensitive adhesive layer comprises an epoxy/polyester based pressure sensitive adhesive which is crosslinkable upon exposure to actinic or e-beam irradiation and optionally heat, and comprises (i) 30-80% by weight of a polyester component comprising one or more amorphous polyesters compounds, (ii) 20-70% by weight of an epoxy component comprising one or more epoxy resins and/or monomers, (iii) 0-50% by weight of a hydroxyl-functional component containing one or more hydroxyl-containing compounds having a hydroxyl functionality of at least 1, and (iv) an effective amount of a photoinitiator component for crosslinking the pressure-sensitive adhesive, whereby the weight percentages refer to the total mass of components (i)-(iv) and add up to 100 wt. %, and which exhibits a holding power of at least 5 min.
    • 本发明涉及具有改进的室温操作性的压敏粘合带,其包括具有至少一个暴露表面和任选的背衬的粘合剂层,其中该压敏粘合剂层包含可环氧树脂/聚酯基压敏粘合剂 暴露于光化或电子束照射和任选地加热,并且包含(i)30-80重量%的包含一种或多种无定形聚酯化合物的聚酯组分,(ii)20-70重量%的包含一个 或更多的环氧树脂和/或单体,(iii)0-50重量%的含有一个或多个羟基官能度至少为1的含羟基化合物的羟基官能组分,和(iv)有效量的 用于使压敏粘合剂交联的光引发剂组分,其中重量百分数是指组分(i) - (iv)的总质量,并加起来至100重量份。 %,表现出至少5分钟的保持力。
    • 6. 发明授权
    • Fire-retardant low-density epoxy composition
    • 阻燃低密度环氧组合物
    • US08188165B2
    • 2012-05-29
    • US11721833
    • 2005-12-23
    • Sohaib ElgimiabiAlain H. Lamon
    • Sohaib ElgimiabiAlain H. Lamon
    • C08K13/00C08K9/02C08L63/00
    • C09K21/04C08K3/22C08K3/32C09K21/02C08L63/00
    • The present invention relates to a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition comprising (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1 to 55 weight percent of at least one epoxide hardener, (iii) 5 to 50 weight percent of an essentially halogen-free fire-retardant system that includes a mixture of: (1) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (2) at least one phosphorous-containing material, (iv) 10 to 60 weight percent of a filler system capable of reducing the density of the precursor that includes a mixture of (1) at least one low-density inorganic filler having a density of between 0.1 to 0.5 g cm−3?, (2) at least one low-density organic filler having a density of between 0.01 to 0.30 g/cm−3? and being compressible.
    • 本发明涉及阻燃,低密度和基本上无卤素的环氧组合物的可固化前体,其包含(i)10至70重量%的至少一种环氧官能度为至少一个的有机环氧化合物,( ii)1至55重量%的至少一种环氧化物硬化剂,(iii)5至50重量%的基本上不含卤素的阻燃体系,其包括以下混合物:(1)至少一种选自以下的化合物: 碱土金属氢氧化物和铝基氢氧化物,和(2)至少一种含磷材料,(iv)10至60重量%的能够降低前体密度的填料体系,其包括(1)在 至少一种密度为0.1至0.5g / c-3的低密度无机填料,(2)至少一种密度为0.01至0.30g / c-3之间的低密度有机填料, 并可压缩。