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1. 发明授权

US5981118A Method for charged particle beam exposure with fixed barycenter through balancing stage scan 失效
标题翻译：通过平衡级扫描固定重心的带电粒子束曝光方法
公开(公告)号：US5981118A
公开(公告)日：1999-11-09
申请号：US42747
申请日：1998-03-17
申请人： Nobuyuki Yasutake , Yoshihisa Ooae , Kazushi Ishida , Hiroshi Yasuda , Akiyoshi Tsuda , Hitoshi Tanaka
发明人： Nobuyuki Yasutake , Yoshihisa Ooae , Kazushi Ishida , Hiroshi Yasuda , Akiyoshi Tsuda , Hitoshi Tanaka
IPC分类号： G03F7/20 , H01J37/317 , G03F9/00
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/2037 , G03F7/2065 , H01J37/3174 , H01J2237/31774
摘要： With using one scanning stage 19 where a plurality of wafers 16A to 16E is mounted through wafer holders 20A to 20E and balancing stage 21 disposed below scanning stage 19, scanning stage 19 is scanned based on exposure data common to a plurality of charged particle beam exposure apparatus 10A to 10E, and balancing stage 21 is scanned so that barycenter G of scanning stage 19 and balancing stage 21 becomes a fixed point. The positions of reflecting mirrors 70L and 70R secured to stage 19 are measured and based on their values, the expansion/contraction ratio of stage 19 and the positions of samples 16A to 16E are calculated to obtain deviation of the positions from target positions. Stage 19 is modeled such that rigid areas 19A to 19E are loosely connected, and for each area, the positions of three points are measured to calculate deviation of the exposure target position due to rotation of each ridged area. These deviations are corrected by deflectors 18A to 18D.
摘要翻译：通过使用一个扫描台19，其中通过设置在扫描台19下方的晶片保持器20A至20E和平衡台21安装多个晶片16A至16E，基于多个带电粒子束曝光共同的曝光数据扫描扫描台19 扫描装置10A至10E以及平衡级21，使得扫描级19和平衡级21的重心G成为固定点。测量固定在工作台19上的反射镜70L和70R的位置，并且基于它们的值，计算级19的伸缩比和样品16A至16E的位置以获得位置与目标位置的偏差。阶段19被建模为刚性区域19A至19E松散地连接，并且对于每个区域，测量三个点的位置以计算由于每个脊状区域的旋转引起的曝光目标位置的偏差。这些偏差由偏转器18A至18D校正。

2. 发明授权

US08356404B2 Method of producing multilayer printed wiring board and photosensitive dry film used therefor 有权
标题翻译：制造多层印刷线路板的方法和用于其的感光干膜
公开(公告)号：US08356404B2
公开(公告)日：2013-01-22
申请号：US11580157
申请日：2006-10-13
申请人： Akiyoshi Tsuda
发明人： Akiyoshi Tsuda
IPC分类号： B32B37/00
CPC分类号： H05K3/108 , H05K3/389 , H05K2203/124 , Y10T29/49117 , Y10T428/31504
摘要： A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface.A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.
摘要翻译：一种制造多层印刷线路板的方法，该方法是通过将感光性干膜附着到具有薄膜导体层的层间树脂绝缘层上并进行曝光和显影以形成电镀抗蚀剂，然后在不一定的部分上形成导体电路形成电镀抗蚀剂，其特征在于，所述感光性干膜在其表面上具有含氮杂环化合物层。能够提高薄膜导体层和感光性干膜之间的相容性的感光性干膜，以增强粘合力，防止感光性干膜中的浮动等的发生，以及多层印刷布线的制造方法使用这样的干膜。

3. 发明申请

US20060237225A1 Multilayer printed wiring board 有权
标题翻译：多层印刷线路板
公开(公告)号：US20060237225A1
公开(公告)日：2006-10-26
申请号：US10546620
申请日：2004-02-05
申请人： Takashi Kariya , Akiyoshi Tsuda
发明人： Takashi Kariya , Akiyoshi Tsuda
IPC分类号： H05K1/11 , H05K1/18
CPC分类号： H01L24/06 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/04042 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48235 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3511 , H05K1/0206 , H05K1/113 , H05K1/144 , H05K1/183 , H05K3/4614 , H05K3/4617 , H05K3/4652 , H05K2201/0355 , H05K2201/0394 , H05K2201/09627 , H05K2203/049 , H05K2203/0733 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： In a multi-layer printed wiring board 100 comprising single side circuit boards A, B and for accommodating an IC chip 70, BGAs 56 are disposed on its front and rear faces, so that with an IC module 120 mounted through the BGA 56 on the front face, this board can be connected to a printed wiring board through the BGA 56 on the rear face. Thus, freedom in the configuration of the IC module mounted increases so that various kinds of the IC modules can be loaded.
摘要翻译：在包括单侧电路板A，B并且用于容纳IC芯片70的多层印刷线路板100中，在其前表面和后表面上布置有BGA 56，使得通过在BGA 56上安装的IC模块120 正面，该板可以通过后面的BGA 56连接到印刷电路板。因此，安装的IC模块的结构自由度增加，从而可以加载各种IC模块。

4. 发明授权

US5966200A Charged particle beam exposure apparatus 失效
标题翻译：带电粒子束曝光装置
公开(公告)号：US5966200A
公开(公告)日：1999-10-12
申请号：US948478
申请日：1997-10-10
申请人： Kenichi Kawakami , Tatsuro Ohkawa , Kazushi Ishida , Akiyoshi Tsuda
发明人： Kenichi Kawakami , Tatsuro Ohkawa , Kazushi Ishida , Akiyoshi Tsuda
IPC分类号： H01L21/027 , G03F7/20 , H01J37/304 , H01L21/68 , G03B27/42 , G01B11/00 , G01N21/00
CPC分类号： G03F7/70716 , H01J37/3045 , H01L21/681 , H01J2237/3175
摘要： The present invention is a charged particle beam exposure apparatus comprising: a column portion in which an optical system for a charged particle beam is disposed; a chamber to be coupled with the column portion; a movable sample stage located in the chamber for mounting a sample thereon; and a stage position measurement device, having an optical path for measurement, along which a laser beam having a predetermined frequency is projected and is reflected by reflection means provided on the sample stage, and an optical path for reference, which in length almost equals a distance between a starting point of the optical path for measurement and the origin of the optical system in the column portion and for which the length is increased at a rate substantially consistent with a thermal expansion coefficient as material of the chamber is expanded, for measuring a change in position of the sample stage by employing a laser optical signal for measurement, which passes along the optical path for measurement, and a reference laser signal, which passes along the optical path for reference.
摘要翻译：本发明是一种带电粒子束曝光装置，包括：列部分，其中设置带电粒子束的光学系统; 与柱部分联接的室; 位于所述室中的可移动的样品台，用于在其上安装样品; 以及台架位置测量装置，具有用于测量的光路，具有预定频率的激光束沿着该光路投射并被设置在样品台上的反射装置反射，以及用于参考的光路，其长度几乎等于用于测量的光路的起始点和柱部分中的光学系统的原点之间的距离和长度以与作为材料的材料的热膨胀系数基本一致的速率增加的距离被扩大，用于测量通过采用通过用于测量的光路的测量用的激光光信号和沿光路通过的参考激光信号来改变样品台的位置。

5. 发明授权

US08420300B2 Method of producing multilayer printed wiring board and photosensitive dry film used therefor 有权
标题翻译：制造多层印刷线路板的方法和用于其的感光干膜
公开(公告)号：US08420300B2
公开(公告)日：2013-04-16
申请号：US12974081
申请日：2010-12-21
申请人： Akiyoshi Tsuda
发明人： Akiyoshi Tsuda
IPC分类号： G03F1/06
CPC分类号： H05K3/108 , H05K3/389 , H05K2203/124 , Y10T29/49117 , Y10T428/31504
摘要： A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof.
摘要翻译：一种制造多层印刷线路板的方法，该方法是通过将感光性干膜附着到具有薄膜导体层的层间树脂绝缘层上并进行曝光和显影以形成电镀抗蚀剂，然后在不一定的部分上形成导体电路形成电镀抗蚀剂。感光性干膜在其第一表面上具有含氮杂环化合物层。

6. 发明申请

US20110183267A1 METHOD OF PRODUCING MULTILAYER PRINTED WIRING BOARD AND PHOTOSENSITIVE DRY FILM USED THEREFOR 有权
标题翻译：生产多层印刷线路板的方法及其使用的感光干膜
公开(公告)号：US20110183267A1
公开(公告)日：2011-07-28
申请号：US12974081
申请日：2010-12-21
申请人： Akiyoshi TSUDA
发明人： Akiyoshi TSUDA
IPC分类号： G03F7/20
CPC分类号： H05K3/108 , H05K3/389 , H05K2203/124 , Y10T29/49117 , Y10T428/31504
摘要： A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof.
摘要翻译：一种制造多层印刷线路板的方法，该方法是通过将感光性干膜附着到具有薄膜导体层的层间树脂绝缘层上并进行曝光和显影以形成电镀抗蚀剂，然后在不一定的部分上形成导体电路形成电镀抗蚀剂。感光性干膜在其第一表面上具有含氮杂环化合物层。

7. 发明授权

US07886428B2 Method of producing multilayer printed wiring board and photosensitive dry film used therefor 有权
公开(公告)号：US07886428B2
公开(公告)日：2011-02-15
申请号：US11580157
申请日：2006-10-13
申请人： Akiyoshi Tsuda
发明人： Akiyoshi Tsuda
IPC分类号： B32B37/00
摘要： A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface.A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.

8. 发明申请

US20070095466A1 Method of producing multilayer printed wiring board and photosensitive dry film used therefor 有权
标题翻译：制造多层印刷线路板的方法和用于其的感光干膜
公开(公告)号：US20070095466A1
公开(公告)日：2007-05-03
申请号：US11580157
申请日：2006-10-13
申请人： Akiyoshi Tsuda
发明人： Akiyoshi Tsuda
IPC分类号： B32B37/00
CPC分类号： H05K3/108 , H05K3/389 , H05K2203/124 , Y10T29/49117 , Y10T428/31504
摘要： A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface. A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.
摘要翻译：一种制造多层印刷线路板的方法，该方法是通过将感光性干膜附着到具有薄膜导体层的层间树脂绝缘层上并进行曝光和显影以形成电镀抗蚀剂，然后在不一定的部分上形成导体电路形成电镀抗蚀剂，其特征在于，所述感光性干膜在其表面上具有含氮杂环化合物层。能够提高薄膜导体层和感光性干膜之间的相容性的感光性干膜，以增强粘合力，防止感光性干膜中的浮动等的发生，以及多层印刷布线的制造方法使用这样的干膜。

9. 发明授权

US07894203B2 Multilayer printed wiring board 有权
标题翻译：多层印刷线路板
公开(公告)号：US07894203B2
公开(公告)日：2011-02-22
申请号：US10546620
申请日：2004-02-05
申请人： Takashi Kariya , Akiyoshi Tsuda
发明人： Takashi Kariya , Akiyoshi Tsuda
IPC分类号： H05K7/10 , H05K7/12
CPC分类号： H01L24/06 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/04042 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48235 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3511 , H05K1/0206 , H05K1/113 , H05K1/144 , H05K1/183 , H05K3/4614 , H05K3/4617 , H05K3/4652 , H05K2201/0355 , H05K2201/0394 , H05K2201/09627 , H05K2203/049 , H05K2203/0733 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A multi-layer printed wiring board including a first substrate having an opening and having external terminals positioned to be connected to a package substrate, a second substrate laminated to the first substrate and having external terminals positioned to be connected to a mother board, the second substrate having a metallic layer portion in the opening of the first substrate and non-through holes filled with conductive material and connected to the metallic layer portion, and an IC component having terminals and loaded in the opening of the first substrate such that the terminals of the IC component face an opposite side of the metallic layer portion of the second substrate. The IC chip is accommodated in the opening such that the metallic layer portion and non-through holes of the second substrate irradiate heat generated by the IC chip.
摘要翻译：一种多层印刷线路板，包括具有开口的第一基板和具有被连接到封装基板的外部端子的第一基板，层压到所述第一基板上并具有定位成连接到母板的外部端子的第二基板，所述第二基板在第一基板的开口中具有金属层部分的基板和填充有导电材料并且连接到金属层部分的非通孔，以及具有端子并装载在第一基板的开口中的IC部件， IC元件面向与第二基板的金属层部分相反的一侧。 IC芯片容纳在开口中，使得第二基板的金属层部分和非通孔照射由IC芯片产生的热量。

10. 发明授权

US6046459A Method and system for charged particle beam exposure 失效
标题翻译：带电粒子束曝光的方法和系统
公开(公告)号：US6046459A
公开(公告)日：2000-04-04
申请号：US401943
申请日：1999-09-23
申请人： Nobuyuki Yasutake , Yoshihisa Ooae , Kazushi Ishida , Hiroshi Yasuda , Akiyoshi Tsuda , Hitoshi Tanaka
发明人： Nobuyuki Yasutake , Yoshihisa Ooae , Kazushi Ishida , Hiroshi Yasuda , Akiyoshi Tsuda , Hitoshi Tanaka
IPC分类号： G03F7/20 , H01J37/317 , H01J37/20
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/2037 , G03F7/2065 , H01J37/3174 , H01J2237/31774
摘要： With using one scanning stage 19 where a plurality of wafers 16A to 16E is mounted through wafer holders 20A to 20E and balancing stage 21 disposed below scanning stage 19, scanning stage 19 is scanned based on exposure data common to a plurality of charged particle beam exposure apparatus 10A to 10E, and balancing stage 21 is scanned so that barycenter G of scanning stage 19 and balancing stage 21 becomes a fixed point. The positions of reflecting mirrors 70L and 70R secured to stage 19 are measured and based on their values, the expansion/contraction ratio of stage 19 and the positions of samples 16A to 16E are calculated to obtain deviation of the positions from target positions. Stage 19 is modeled such that rigid areas 19A to 19E are loosely connected, and for each area, the positions of three points are measured to calculate deviation of the exposure target position due to rotation of each ridged area. These deviations are corrected by deflectors 18A to 18D.
摘要翻译：通过使用一个扫描台19，其中通过设置在扫描台19下方的晶片保持器20A至20E和平衡台21安装多个晶片16A至16E，基于多个带电粒子束曝光共同的曝光数据扫描扫描台19 扫描装置10A至10E以及平衡级21，使得扫描级19和平衡级21的重心G成为固定点。测量固定在工作台19上的反射镜70L和70R的位置，并且基于它们的值，计算级19的伸缩比和样品16A至16E的位置以获得位置与目标位置的偏差。阶段19被建模为刚性区域19A至19E松散地连接，并且对于每个区域，测量三个点的位置以计算由于每个脊状区域的旋转引起的曝光目标位置的偏差。这些偏差由偏转器18A至18D校正。

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