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1. 发明授权

US06995038B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US06995038B2
公开(公告)日：2006-02-07
申请号：US10892269
申请日：2004-07-16
申请人： Yoshimi Egawa , Akira Sugai
发明人： Yoshimi Egawa , Akira Sugai
IPC分类号： H01L21/50
CPC分类号： H01L21/566 , H01L21/565 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing a semiconductor device includes preparing a semiconductor wafer including a first main surface having a semiconductor device forming region and a peripheral region, and a second main surface; preparing first and second dies defining a cavity; holding the semiconductor wafer by the first die so that the first main surface is exposed; placing a film member on the second die; supplying a predetermined amount of resin to a predetermined region on a resin layout region of the film member; heating the first die and the second die; bringing the first die and the second die into contact with each other through the film member to form the cavity, thereby the first main surface and the resin are placed in the cavity; and pressure-reducing the interior of the cavity and reducing the capacity of the cavity to cause the molten resin obtained by melting the resin to contact the first main surface, thereby forming an encapsulating portion on the first main surface.
摘要翻译：一种制造半导体器件的方法包括：制备包括具有半导体器件形成区域和周边区域的第一主表面和第二主表面的半导体晶片; 制备限定腔的第一和第二模具; 通过第一模具保持半导体晶片，使得第一主表面露出; 将膜构件放置在第二模具上; 将预定量的树脂供应到所述薄膜构件的树脂布局区域上的预定区域; 加热第一模具和第二模具; 使第一模具和第二模具通过膜构件彼此接触以形成空腔，从而将第一主表面和树脂放置在空腔中; 并且减小空腔的内部并降低空腔的容量，使得通过熔化树脂获得的熔融树脂与第一主表面接触，从而在第一主表面上形成封装部分。

2. 发明申请

US20050026418A1 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20050026418A1
公开(公告)日：2005-02-03
申请号：US10892269
申请日：2004-07-16
申请人： Yoshimi Egawa , Akira Sugai
发明人： Yoshimi Egawa , Akira Sugai
IPC分类号： H01L23/12 , H01L21/44 , H01L21/56 , H01L23/31
CPC分类号： H01L21/566 , H01L21/565 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing a semiconductor device includes preparing a semiconductor wafer including a first main surface having a semiconductor device forming region and a peripheral region, and a second main surface; preparing first and second dies defining a cavity; holding the semiconductor wafer by the first die so that the first main surface is exposed; placing a film member on the second die; supplying a predetermined amount of resin to a predetermined region on a resin layout region of the film member; heating the first die and the second die; bringing the first die and the second die into contact with each other through the film member to form the cavity, thereby the first main surface and the resin are placed in the cavity; and pressure-reducing the interior of the cavity and reducing the capacity of the cavity to cause the molten resin obtained by melting the resin to contact the first main surface, thereby forming an encapsulating portion on the first main surface.
摘要翻译：一种制造半导体器件的方法包括：制备包括具有半导体器件形成区域和周边区域的第一主表面和第二主表面的半导体晶片; 制备限定腔的第一和第二模具; 通过第一模具保持半导体晶片，使得第一主表面露出; 将膜构件放置在第二模具上; 将预定量的树脂供应到所述薄膜构件的树脂布局区域上的预定区域; 加热第一模具和第二模具; 使第一模具和第二模具通过膜构件彼此接触以形成空腔，从而将第一主表面和树脂放置在空腔中; 并且减小空腔的内部并降低空腔的容量，使得通过熔化树脂获得的熔融树脂与第一主表面接触，从而在第一主表面上形成封装部分。

3. 发明授权

US06767484B2 Transfer molding method for manufacturing semiconductor devices 失效
标题翻译：用于制造半导体器件的转移成型方法
公开(公告)号：US06767484B2
公开(公告)日：2004-07-27
申请号：US09893455
申请日：2001-06-29
申请人： Hiroyuki Nishi , Akira Sugai
发明人： Hiroyuki Nishi , Akira Sugai
IPC分类号： B29C4502
CPC分类号： B29C45/02 , B29C45/34 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.
摘要翻译：一种传递模塑方法，其中装置的上半模和下半模形成互连的多个空腔，并且其中压力调节器每当将特定量的树脂供应到任何一个中时，减小空腔的压力多个空腔中的一个。

4. 发明授权

US06267577B1 Transfer molding apparatus for manufacturing semiconductor devices 有权
标题翻译：用于制造半导体器件的传送成型设备
公开(公告)号：US06267577B1
公开(公告)日：2001-07-31
申请号：US09265841
申请日：1999-03-10
申请人： Hiroyuki Nishi , Akira Sugai
发明人： Hiroyuki Nishi , Akira Sugai
IPC分类号： B29C4502
CPC分类号： B29C45/02 , B29C45/34 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A transfer molding apparatus, wherein a top-half mold and a bottom-half mold form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any of the plurality of cavities.
摘要翻译：一种传送成型设备，其中上半模和下半模形成互连的多个空腔，并且其中压力调节器每当将特定量的树脂供应到多个空腔

5. 发明授权

US07253021B2 Transfer molding apparatus and method for manufacturing semiconductor devices 有权
标题翻译：传递成型装置及半导体装置的制造方法
公开(公告)号：US07253021B2
公开(公告)日：2007-08-07
申请号：US10890222
申请日：2004-07-14
申请人： Hiroyuki Nishi , Akira Sugai
发明人： Hiroyuki Nishi , Akira Sugai
IPC分类号： H01L21/00
CPC分类号： B29C45/02 , B29C45/34 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.
摘要翻译：一种传递模塑方法，其中装置的上半模和下半模形成互连的多个空腔，并且其中压力调节器每当将特定量的树脂供应到任何一个中时，减小空腔的压力多个空腔中的一个。

6. 发明授权

US07625768B2 Transfer molding apparatus and method for manufacturing semiconductor device 失效
标题翻译：传递成型装置及半导体装置的制造方法
公开(公告)号：US07625768B2
公开(公告)日：2009-12-01
申请号：US11771057
申请日：2007-06-29
申请人： Hiroyuki Nishi , Akira Sugai
发明人： Hiroyuki Nishi , Akira Sugai
IPC分类号： H01L21/66
CPC分类号： B29C45/02 , B29C45/34 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A transfer molding apparatus, wherein said top-half mold and said bottom-half mold form a plurality of cavities interconnected, and wherein said pressure adjusting means reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.
摘要翻译：一种传送成型设备，其中所述上半模和所述下半模形成互连的多个空腔，并且其中所述压力调节装置每当将特定量的树脂供应到任何一个中时，减小所述空腔的压力多个腔。

7. 发明授权

US06491508B1 Molding die set 失效
标题翻译：成型模具
公开(公告)号：US06491508B1
公开(公告)日：2002-12-10
申请号：US09689760
申请日：2000-10-13
申请人： Shin Kurosawa , Akira Sugai
发明人： Shin Kurosawa , Akira Sugai
IPC分类号： B29C7072
CPC分类号： B29C45/34 , B29C45/14655 , B29C45/4005 , B29C2045/4015 , Y10S425/047
摘要： A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.
摘要翻译：一种成型模具组件包括：第一模具，其包括空腔和分型面; 第二模具，其包括空腔和布置成面对所述第一模具的分离表面; 以及支撑在第一成型模具上以围绕空腔并具有不从分离表面向外延伸的外围线的O形环。

8. 发明授权

US08236621B2 Mold resin sealing device and molding method 有权
标题翻译：模具树脂密封装置及成型方法
公开(公告)号：US08236621B2
公开(公告)日：2012-08-07
申请号：US12929304
申请日：2011-01-13
申请人： Akira Sugai
发明人： Akira Sugai
IPC分类号： H01L21/56 , H01L21/00
CPC分类号： B29C43/18 , B29C43/361 , B29C2043/181 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A mold resin sealing device for sealing a surface of a semiconductor wafer with a mold resin, includes: a first mold die; and a second mold die disposed opposite to the first mold die, the second mold die having a second surface; wherein the first mold die includes a first part having a first surface facing the second surface of the second mold die and having an opening in a central region of the first surface; and a first step-like movable part capable of moving in the opening in both directions so that the first step-like movable part moves toward and away from the second mold die.
摘要翻译：一种用模具树脂密封半导体晶片的表面的模制树脂密封装置，包括：第一模具; 和与第一模具模具相对设置的第二模具模具，第二模具模具具有第二表面; 其中所述第一模具包括具有面向所述第二模具模具的第二表面的第一表面并且在所述第一表面的中心区域中具有开口的第一部分; 以及能够沿两个方向在开口中移动的第一阶梯状可动部，使得第一阶梯状可动部朝向和远离第二模具移动。

9. 发明申请

US20070292975A1 TRANSFER MOLDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
标题翻译：用于制造半导体器件的传输成型装置和方法
公开(公告)号：US20070292975A1
公开(公告)日：2007-12-20
申请号：US11771057
申请日：2007-06-29
申请人： Hiroyuki Nishi , Akira Sugai
发明人： Hiroyuki Nishi , Akira Sugai
IPC分类号： H01L21/56
CPC分类号： B29C45/02 , B29C45/34 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A transfer molding apparatus, wherein said top-half mold and said bottom-half mold form a plurality of cavities interconnected, and wherein said pressure adjusting means reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.
摘要翻译：一种传送成型设备，其中所述上半模和所述下半模形成互连的多个空腔，并且其中所述压力调节装置每当将特定量的树脂供应到任何一个中时，减小所述空腔的压力多个腔。

10. 发明授权

US06756690B2 Molding die set and semiconductor device fabricated using the same 失效
标题翻译：成型模具和使用其制造的半导体器件
公开(公告)号：US06756690B2
公开(公告)日：2004-06-29
申请号：US10277057
申请日：2002-10-22
申请人： Shin Kurosawa , Akira Sugai
发明人： Shin Kurosawa , Akira Sugai
IPC分类号： H01L2328
CPC分类号： B29C45/34 , B29C45/14655 , B29C45/4005 , B29C2045/4015 , Y10S425/047
摘要： A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.
摘要翻译：一种成型模具组件包括：第一模具，其包括空腔和分型面; 第二模具，其包括空腔和布置成面对所述第一模具的分离表面; 以及支撑在第一成型模具上以围绕空腔并具有不从分离表面向外延伸的外围线的O形环。

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