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    • 1. 发明申请
    • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20120015508A1
    • 2012-01-19
    • US13242789
    • 2011-09-23
    • Shinya IWASAKIAkira KAMEI
    • Shinya IWASAKIAkira KAMEI
    • H01L21/22
    • H01L29/861H01L21/263H01L21/266H01L21/761H01L27/0727H01L29/32H01L29/7397
    • Provided is a method of manufacturing a semiconductor device capable of preventing a relative displacement of the positions between a range where impurity ions are injected and a range where charged particles are injected. The method of manufacturing the semiconductor device includes: irradiating impurity ions in a state in which a mask is disposed between an impurity ion irradiation apparatus and a semiconductor substrate; and irradiating charged particles to form a short carrier lifetime region, in a state in which the mask is disposed between a charged particle irradiation apparatus and the semiconductor substrate. A relative positional relationship between the mask and the semiconductor substrate is not changed from a beginning of one of the irradiating the impurity ions and the irradiating the charged particles to a completion of both of the irradiating the impurity ions and the irradiating the charged particles.
    • 提供一种制造能够防止在注入杂质离子的范围之间的位置与注入带电粒子的范围之间的位置的相对位移的半导体器件的方法。 半导体装置的制造方法包括:在杂质离子照射装置和半导体基板之间设置掩模的状态下照射杂质离子; 并且在掩模设置在带电粒子照射装置和半导体基板之间的状态下照射带电粒子以形成短的载流子寿命区域。 掩模和半导体衬底之间的相对位置关系从照射杂质离子和照射带电粒子之一开始到完全照射杂质离子并照射带电粒子之后不会改变。
    • 2. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US08334193B2
    • 2012-12-18
    • US13242789
    • 2011-09-23
    • Shinya IwasakiAkira Kamei
    • Shinya IwasakiAkira Kamei
    • H01L21/20H01L21/425H01L21/04
    • H01L29/861H01L21/263H01L21/266H01L21/761H01L27/0727H01L29/32H01L29/7397
    • Provided is a method of manufacturing a semiconductor device capable of preventing a relative displacement of the positions between a range where impurity ions are injected and a range where charged particles are injected. The method of manufacturing the semiconductor device includes: irradiating impurity ions in a state in which a mask is disposed between an impurity ion irradiation apparatus and a semiconductor substrate; and irradiating charged particles to form a short carrier lifetime region, in a state in which the mask is disposed between a charged particle irradiation apparatus and the semiconductor substrate. A relative positional relationship between the mask and the semiconductor substrate is not changed from a beginning of one of the irradiating the impurity ions and the irradiating the charged particles to a completion of both of the irradiating the impurity ions and the irradiating the charged particles.
    • 提供一种制造能够防止在注入杂质离子的范围之间的位置与注入带电粒子的范围之间的位置的相对位移的半导体器件的方法。 半导体装置的制造方法包括:在杂质离子照射装置和半导体基板之间设置掩模的状态下照射杂质离子; 并且在掩模设置在带电粒子照射装置和半导体基板之间的状态下照射带电粒子以形成短的载流子寿命区域。 掩模和半导体衬底之间的相对位置关系从照射杂质离子和照射带电粒子之一开始到完全照射杂质离子并照射带电粒子之后不会改变。