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    • 5. 发明申请
    • Carrying system and processing equipment
    • 搬运系统及加工设备
    • US20070243075A1
    • 2007-10-18
    • US11783562
    • 2007-04-10
    • Akio HiroseKatsuhiko Goto
    • Akio HiroseKatsuhiko Goto
    • F04B49/00
    • F04B49/08B05B13/0221B05B13/0242B05B13/0431B25J9/0096
    • A carrying system includes first and second carrying machines each of which includes a holding unit, a base and a linkage having pivotally joined first and second links. The holding unit can be moved, by turning the second link relative to the first link which is turned relative to the base, along a substantially arc carrying route extending round the pedestal between a loading position and a processing position. The arc carrying route is closer to the pedestal with respect to an imaginary circle having its center on the pedestal and a radius corresponding to the distance between the pedestal and either of the loading position and the processing position.
    • 承载系统包括第一和第二搬运机器,每个承载机器包括保持单元,基座和具有枢转连接的第一和第二连杆的连杆。 可以通过相对于相对于基座转动的第一连杆转动第二连杆,沿着在装载位置和处理位置之间的基座延伸的基本上圆弧的运送路线来移动保持单元。 电弧携带路径相对于其在基座上的中心的假想圆更靠近基座,并且与基座与装载位置和处理位置中的任一个之间的距离相对应。
    • 10. 发明申请
    • METHOD FOR BONDING ALUMINUM-BASED METALS
    • 用于粘结铝基金属的方法
    • US20140030634A1
    • 2014-01-30
    • US13819390
    • 2011-08-30
    • Toshikazu NanbuKenji MiyamotoMasayuki InoueChika YamamotoYoshitaka UeharaAkio Hirose
    • Toshikazu NanbuKenji MiyamotoMasayuki InoueChika YamamotoYoshitaka UeharaAkio Hirose
    • B23K20/00
    • An inexpensive bonding method is provided to bond materials constituted of an aluminum-based metal to each other at a low temperature and a low pressure while inhibiting deformation, without requiring the use of a flux and minimizing the influence on the base materials and the periphery. Also provided are various bonded parts obtained by the bonding method. An insert material comprising Zn as an element that undergoes a eutectic reaction with Al is interposed between two materials constituted of an aluminum-based metal. The two materials are heated, while being pressed against each other, to a temperature at which the eutectic reaction takes place, thereby generating, at the bonding interface between the two materials, a melt due to the eutectic reaction with some of the Al contained in the base materials and discharging the Al oxide films from the bonding interface together with the melt. Thus, the two materials are bonded.
    • 提供廉价的接合方法,以便在不需要使用助焊剂并且最小化对基材和周边的影响的同时,在低温和低压下将由铝基金属构成的材料彼此粘合,同时抑制变形。 还提供了通过接合方法获得的各种粘合部件。 包含Zn作为与Al发生共晶反应的元素的插入材料插入由铝基金属构成的两种材料之间。 将这两种材料在彼此挤压的同时加热到发生共晶反应的温度,从而在两种材料之间的结合界面处产生熔体,这是由于与包含在其中的一些Al的共晶反应 基材并与熔融物一起从接合界面排出Al氧化物膜。 因此,两种材料结合。