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    • 5. 发明申请
    • Wafer boat
    • 晶圆船
    • US20090188874A1
    • 2009-07-30
    • US12011981
    • 2008-01-30
    • Christianus Gerardus Maria De RidderAdriaan Garssen
    • Christianus Gerardus Maria De RidderAdriaan Garssen
    • H01L21/683
    • H01L21/67303H01L21/67309
    • Wafer boat for holding semiconductor wafers in a spaced vertical arrangement during processing, said wafer boat comprising a plurality of vertically spaced holding positions for receiving and supporting said wafers in a substantially horizontal orientation, wherein the holding positions can be accessed from a front side of the wafer boat to allow for insertion and removal of a wafer, wherein at least one holding position comprises a back support for engaging a back side portion of a wafer and two lateral supports for engaging opposite lateral side portions of the wafer, and wherein the back support is disposed at a lower position than said two lateral supports such that sagging of a front side portion of an inserted wafer near the front side of the wafer boat due to gravity is at least partially compensated for.
    • 用于在处理过程中以间隔垂直布置保持半导体晶片的晶片舟,所述晶片舟包括多个垂直间隔的保持位置,用于以基本上水平的方向接收和支撑所述晶片,其中保持位置可以从 晶片舟以允许插入和移除晶片,其中至少一个保持位置包括用于接合晶片的后侧部分的后支撑件和用于接合晶片的相对横向侧部分的两个侧向支撑件,并且其中后支撑件 被布置在比所述两个侧向支撑件更低的位置处,使得由于重力而在晶片舟皿的前侧附近的插入晶片的前侧部分的下垂至少部分地被补偿。
    • 7. 发明授权
    • Wafer boat
    • 晶圆船
    • US07971734B2
    • 2011-07-05
    • US12011981
    • 2008-01-30
    • Christianus Gerardus Maria De RidderAdriaan Garssen
    • Christianus Gerardus Maria De RidderAdriaan Garssen
    • A47G19/08
    • H01L21/67303H01L21/67309
    • Wafer boat for holding semiconductor wafers in a spaced vertical arrangement during processing, said wafer boat comprising a plurality of vertically spaced holding positions for receiving and supporting said wafers in a substantially horizontal orientation, wherein the holding positions can be accessed from a front side of the wafer boat to allow for insertion and removal of a wafer, wherein at least one holding position comprises a back support for engaging a back side portion of a wafer and two lateral supports for engaging opposite lateral side portions of the wafer, and wherein the back support is disposed at a lower position than said two lateral supports such that sagging of a front side portion of an inserted wafer near the front side of the wafer boat due to gravity is at least partially compensated for.
    • 用于在处理过程中以间隔垂直布置保持半导体晶片的晶片舟,所述晶片舟包括多个垂直间隔的保持位置,用于以基本上水平的方向接收和支撑所述晶片,其中保持位置可从 晶片舟以允许插入和移除晶片,其中至少一个保持位置包括用于接合晶片的后侧部分的后支撑件和用于接合晶片的相对横向侧部分的两个侧向支撑件,并且其中后支撑件 被布置在比所述两个侧向支撑件更低的位置处,使得由于重力而在晶片舟皿的前侧附近的插入晶片的前侧部分的下垂至少部分地被补偿。