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1. 发明申请

US20050077362A1 STACKED SMALL MEMORY CARD 失效
标题翻译：堆叠的小存储卡
公开(公告)号：US20050077362A1
公开(公告)日：2005-04-14
申请号：US10683838
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： G06K19/02 , G06K19/077 , H05K1/02 , H05K1/14 , H05K3/28 , G06K19/06
CPC分类号： G06K19/0773 , G06K19/02 , G06K19/077 , H01L2224/48091 , H01L2224/48227 , H05K1/0206 , H05K1/144 , H05K3/0061 , H05K3/284 , H05K2201/043 , H01L2924/00014
摘要： A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.
摘要翻译：堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起，使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

2. 发明申请

US20060006310A1 Image sensor package structure 审中-公开
标题翻译：图像传感器封装结构
公开(公告)号：US20060006310A1
公开(公告)日：2006-01-12
申请号：US10887578
申请日：2004-07-08
申请人： Abnet Chen , Pierre Liu , Tony Wang , Chung Hsin , Figo Hsieh , Jian Lu
发明人： Abnet Chen , Pierre Liu , Tony Wang , Chung Hsin , Figo Hsieh , Jian Lu
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An image sensor package structure with plastic substrate includes a substrate, a frame layer, a photosensitive chip, wires and transparent layer. The substrate is formed with a plurality of via hole, and the each via hole is arranged at the periphery of the substrate, then an interval is formed between the periphery of the substrate and the via holes, a conductive material being filled into the each via hole. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip arranged within the cavity and is mounted on the substrate. Each wire is electrically connected the photosensitive chip to the substrate. The transparent layer covered over the frame layer to cover the photosensitive chip.
摘要翻译：具有塑料基板的图像传感器封装结构包括基板，框架层，感光芯片，导线和透明层。基板形成有多个通孔，并且每个通孔布置在基板的周边，然后在基板的周边和通孔之间形成间隔，将导电材料填充到每个通孔中孔。框架层布置在基板的上表面上以与基板一起形成空腔。感光芯片布置在腔内并安装在基板上。每根导线将感光芯片电连接到基板上。透明层被覆盖在框架层上以覆盖光敏芯片。

3. 发明申请

US20050098865A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20050098865A1
公开(公告)日：2005-05-12
申请号：US10705377
申请日：2003-11-10
申请人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Abnet Chen
IPC分类号： H01L23/02 , H01L23/48 , H01L31/0203
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/00014
摘要： An image sensor package includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. The lower metal formed with a first hole, the upper metal sheets formed a second hole penetrated from the upper surface to the lower surface. Wherein the encapsulant filled into the second hole and first hole to tighten the upper metal sheets and the lower metal sheets. A photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
摘要翻译：图像传感器封装包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂。形成有第一孔的下部金属，上部金属板形成从上表面向下表面贯穿的第二孔。其中密封剂填充到第二孔和第一孔中以收紧上金属片和下金属片。布置在室内的感光芯片，用于将芯片电连接到下金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

4. 发明申请

US20050078457A1 Small memory card 审中-公开
标题翻译：小存储卡
公开(公告)号：US20050078457A1
公开(公告)日：2005-04-14
申请号：US10683839
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20463
摘要： A small memory card includes a first substrate, a heat sink, a second substrate, at least one upper memory chip, at least one bottom memory chip and a glue layer. The heat sink is arranged between the first substrate and second substrate, and contacted with the metal, which are filled within the plurality of through holes, which formed between the first substrate and second substrate. And each of the upper memory chips and bottom memory chips are mounted on the first substrate and the second substrate, so that the heat of the upper and bottom memory chips may be traveled to the heat sink via the metal, which is filled within the through hole, then the heat will be dispersed. Thus, the small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively, the manufacturing processes must be simplified and the manufacturing cost must decrease also.
摘要翻译：小型存储卡包括第一基板，散热器，第二基板，至少一个上部存储器芯片，至少一个底部存储器芯片和胶合层。散热器布置在第一基板和第二基板之间，并且与形成在第一基板和第二基板之间的多个通孔中填充的金属接触。并且上部存储器芯片和底部存储器芯片中的每一个安装在第一基板和第二基板上，使得上部和下部存储器芯片的热量可以经由金属行进到散热器，该金属填充在通孔孔，那么热会分散。因此，本发明的小型存储卡具有高散热功能以有效提高其耐用性和寿命，因此制造工艺必须简化，制造成本也必须降低。

5. 发明申请

US20060008939A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20060008939A1
公开(公告)日：2006-01-12
申请号：US10887577
申请日：2004-07-08
申请人： Abnet Chen , Tony Wang , Chung Hsin , Figo Hsieh
发明人： Abnet Chen , Tony Wang , Chung Hsin , Figo Hsieh
IPC分类号： H01L21/00
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An image sensor package includes a substrate, a frame layer, a photosensitive chip, wires, and transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed, wherein the each first electrode is curved. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is arranged within the cavity and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrode of the substrate. The transparent layer is covered over the frame layer to cover the photosensitive chip.
摘要翻译：图像传感器封装包括基板，框架层，感光芯片，布线和透明层。基板具有形成第一电极的上表面和形成第二电极的下表面，其中每个第一电极是弯曲的。框架层布置在基板的上表面上以与基板一起形成空腔。感光芯片布置在空腔内并安装在基板的上表面上。多个导线将感光芯片电连接到基板的第一电极。透明层被覆盖在框架层上以覆盖感光芯片。

6. 发明授权

US06910637B2 Stacked small memory card 失效
标题翻译：堆叠小存储卡
公开(公告)号：US06910637B2
公开(公告)日：2005-06-28
申请号：US10683838
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： G06K19/02 , G06K19/077 , H05K1/02 , H05K1/14 , H05K3/28 , G06K19/06
CPC分类号： G06K19/0773 , G06K19/02 , G06K19/077 , H01L2224/48091 , H01L2224/48227 , H05K1/0206 , H05K1/144 , H05K3/0061 , H05K3/284 , H05K2201/043 , H01L2924/00014
摘要： A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.
摘要翻译：堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起，使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

7. 发明申请

US20050012025A1 Image sensor and method for packaging the same 审中-公开
标题翻译：图像传感器和包装方法
公开(公告)号：US20050012025A1
公开(公告)日：2005-01-20
申请号：US10621986
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Bruce Chen , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen , Abnet Chen
IPC分类号： H01L27/00 , H01L31/00 , H01L31/0203
CPC分类号： H01L31/0203 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： An image sensor includes lower and upper metal sheet sets, an encapsulant, a photosensitive chip, wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a middle board among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets stacked on the lower metal sheets, respectively. The encapsulant encapsulates the upper and lower metal sheets and the middle board with upper surfaces of the upper sheets, lower surfaces of the lower sheets, and upper and lower surfaces of the middle board exposed from the encapsulant, and with a frame layer formed around the upper sheets to define a chamber. The chip is mounted to the middle board and located within the chamber. The wires electrically connect the chip to the upper metal sheets. The transparent layer is arranged on the frame layer to cover the chip.
摘要翻译：图像传感器包括下部和上部金属片组，密封剂，感光芯片，导线和透明层。下金属片组包括多个下金属片和中间板，并与下金属片齐平。上部金属片组分别包括堆叠在下部金属片上的多个上部金属片。密封剂封装上，下金属片和中间板，上板的上表面，下片的下表面，以及从密封剂暴露的中间板的上表面和下表面，以及围绕上部板材定义一个室。芯片安装在中间板并位于腔室内。电线将芯片电连接到上金属片。透明层布置在框架层上以覆盖芯片。

8. 发明申请

US20050012024A1 Image sensor module and method for manufacturing the same 审中-公开
标题翻译：图像传感器模块及其制造方法
公开(公告)号：US20050012024A1
公开(公告)日：2005-01-20
申请号：US10621985
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： H01L27/00 , H01L27/146 , H01L31/00 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module includes an image sensor, and a lens holder and a lens barrel on the image sensor. The image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
摘要翻译：图像传感器模块包括图像传感器，以及在图像传感器上的透镜保持器和镜筒。图像传感器包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂，其中上金属片的上表面从密封剂露出，下表面的下部金属片从密封剂露出，并且密封剂在上金属片的上表面周围形成有框架层，以与上金属片一起限定室。图像传感器还包括布置在腔室内的感光芯片，用于将芯片电连接到上金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

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