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1. 发明申请

US20100219920A1 MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL 有权
标题翻译：磁力去除的磁力驱动
公开(公告)号：US20100219920A1
公开(公告)日：2010-09-02
申请号：US12394339
申请日：2009-02-27
申请人： Jingbin Feng , Aaron LaBrie , Kousik Ganesan
发明人： Jingbin Feng , Aaron LaBrie , Kousik Ganesan
IPC分类号： H01F7/02
CPC分类号： H01L21/68728 , Y10S414/141 , Y10T279/18
摘要： Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or undamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction. The resulting cam motion is smooth and continuous.
摘要翻译：提供了磁力驱动的晶片卡盘，其允许晶片在工艺期间的任何时间以及根据需要以任何转速进行夹紧或无阻尼。这种晶片卡盘可以包括可在打开位置和闭合位置之间移动的约束构件。在关闭位置，限制构件在晶片切换之后对准晶片和/或在旋转期间夹紧晶片以防止其从卡盘飞出。在打开位置，约束构件远离晶片移动，以允许液体蚀刻剂从晶片边缘流动而无障碍。约束构件可以是例如凸轮，附接到卡盘的臂或连杆。凸轮或其他约束构件通过自平衡力在打开和关闭位置之间移动，包括用于沿第一方向移动凸轮的第一力（例如弹簧力）和非接触致动力作为磁力，其作用是使凸轮沿相反方向移动。所得到的凸轮运动是平滑和连续的。

2. 发明授权

US08419964B2 Apparatus and method for edge bevel removal of copper from silicon wafers 有权
标题翻译：用于从硅晶片去除铜的边缘斜面的设备和方法
公开(公告)号：US08419964B2
公开(公告)日：2013-04-16
申请号：US12199412
申请日：2008-08-27
申请人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
发明人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
IPC分类号： H01L21/302
CPC分类号： H01L21/6708 , H01L21/02068 , H01L21/02087 , H01L21/0209 , H01L21/32134 , H01L21/67745 , H01L21/68735 , H01L21/68785
摘要： Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
摘要翻译：描述了用于从半导体晶片的边缘斜面区域去除金属的化学蚀刻方法和相关模块。在晶片的边缘斜面区域上施加蚀刻剂之前，该方法和系统提供了薄层的预漂洗液体。蚀刻剂较少稀释，并通过稀薄的冲洗液层更快地扩散。公开了一种边缘斜面去除实施例，其涉及在减少加工时间，使金属锥度变窄并允许随后的化学机械抛光方面特别有效。

3. 发明授权

US08172646B2 Magnetically actuated chuck for edge bevel removal 有权
标题翻译：用于边缘斜面去除的磁致动卡盘
公开(公告)号：US08172646B2
公开(公告)日：2012-05-08
申请号：US12394339
申请日：2009-02-27
申请人： Jingbin Feng , Aaron LaBrie , Kousik Ganesan
发明人： Jingbin Feng , Aaron LaBrie , Kousik Ganesan
IPC分类号： B24B1/00
CPC分类号： H01L21/68728 , Y10S414/141 , Y10T279/18
摘要： Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction. The resulting cam motion is smooth and continuous.
摘要翻译：提供了磁力驱动的晶片卡盘，其允许晶片在工艺期间的任何时间被夹紧或松开，并且根据需要以任何转速。这种晶片卡盘可以包括可在打开位置和闭合位置之间移动的约束构件。在关闭位置，限制构件在晶片切换之后对准晶片和/或在旋转期间夹紧晶片以防止其从卡盘飞出。在打开位置，约束构件远离晶片移动，以允许液体蚀刻剂从晶片边缘流动而无障碍。约束构件可以是例如凸轮，附接到卡盘的臂或连杆。凸轮或其他约束构件通过自平衡力在打开和关闭位置之间移动，包括用于沿第一方向移动凸轮的第一力（例如弹簧力）和非接触致动力作为磁力，其作用是使凸轮沿相反方向移动。所得到的凸轮运动是平滑和连续的。

4. 发明授权

US6030451A Two camera diameter control system with diameter tracking for silicon ingot growth 失效
标题翻译：两个相机直径控制系统，具有硅锭生长的直径跟踪
公开(公告)号：US6030451A
公开(公告)日：2000-02-29
申请号：US5773
申请日：1998-01-12
申请人： Aaron LaBrie , Masahiko Baba
发明人： Aaron LaBrie , Masahiko Baba
IPC分类号： C30B15/26 , C30B15/22
CPC分类号： C30B15/26 , Y10T117/1004 , Y10T117/1008
摘要： A method and apparatus for measuring and controlling the diameter of a silicon single crystal ingot grown by the Czochralski technique using dual optical cameras focused on diametrically opposed edges of the meniscus of the growing crystal to measure the actual crystal diameter. The crystal growth parameters can be adjusted in response to the measured diameter to maintain a constant, desired diameter. The method and apparatus of the invention provide a continuous accurate measurement of the crystal diameter and avoid unnecessary adjustments to the crystal growth conditions resulting from diameter measurement errors due to the effects of crystal orbit, melt level changes and camera angle variations.
摘要翻译：一种用于测量和控制通过使用双光学照相机通过切克劳斯基技术生长的硅单晶锭的直径的方法和装置，其聚焦在生长晶体的弯月面的直径相对的边缘上以测量实际晶体直径。可以响应于测量的直径来调节晶体生长参数以保持恒定的期望直径。本发明的方法和装置提供了晶体直径的连续精确测量，并且避免了由于晶体轨道，熔体水平变化和相机角度变化的影响而导致的直径测量误差对晶体生长条件的不必要的调整。

5. 发明申请

US20140190529A1 APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON WAFERS 审中-公开
标题翻译：用于边缘去除硅膜的铜的装置和方法
公开(公告)号：US20140190529A1
公开(公告)日：2014-07-10
申请号：US13857883
申请日：2013-04-05
申请人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
发明人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
IPC分类号： H01L21/67 , H01L21/02
CPC分类号： H01L21/6708 , H01L21/02068 , H01L21/02087 , H01L21/0209 , H01L21/32134 , H01L21/67745 , H01L21/68735 , H01L21/68785
摘要： Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
摘要翻译：描述了用于从半导体晶片的边缘斜面区域去除金属的化学蚀刻方法和相关模块。在晶片的边缘斜面区域上施加蚀刻剂之前，该方法和系统提供了薄层的预漂洗液体。蚀刻剂较少稀释，并通过稀薄的冲洗液层更快地扩散。公开了一种边缘斜面去除实施例，其涉及在减少加工时间，使金属锥度变窄并允许随后的化学机械抛光方面特别有效。

6. 发明申请

US20100055924A1 APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON WAFERS 有权
标题翻译：用于边缘去除硅膜的铜的装置和方法
公开(公告)号：US20100055924A1
公开(公告)日：2010-03-04
申请号：US12199412
申请日：2008-08-27
申请人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
发明人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
IPC分类号： H01L21/306
CPC分类号： H01L21/6708 , H01L21/02068 , H01L21/02087 , H01L21/0209 , H01L21/32134 , H01L21/67745 , H01L21/68735 , H01L21/68785
摘要： Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
摘要翻译：描述了用于从半导体晶片的边缘斜面区域去除金属的化学蚀刻方法和相关模块。在晶片的边缘斜面区域上施加蚀刻剂之前，该方法和系统提供了薄层的预漂洗液体。蚀刻剂较少稀释，并通过稀薄的冲洗液层更快地扩散。公开了一种边缘斜面去除实施例，其涉及在减少加工时间，使金属锥度变窄并允许随后的化学机械抛光方面特别有效。

7. 发明授权

US09732416B1 Wafer chuck with aerodynamic design for turbulence reduction 有权
公开(公告)号：US09732416B1
公开(公告)日：2017-08-15
申请号：US11737045
申请日：2007-04-18
申请人： Craig P. Stephens , Matt Kanetomi , Joseph Richardson , Chris Veazey , Aaron LaBrie
发明人： Craig P. Stephens , Matt Kanetomi , Joseph Richardson , Chris Veazey , Aaron LaBrie
IPC分类号： H01L21/683 , H01L21/687 , C23C14/50 , C23C16/458
CPC分类号： C23C14/505 , C23C16/4584 , C23C16/4588 , H01L21/6708 , H01L21/68728 , H01L21/68764
摘要： A rotatable wafer chuck includes chuck arms and wafer holders that are aerodynamically shaped to reduce turbulence during rotation. A wafer holder may include a friction support and an independently rotatable vertical alignment member and clamping member that is shaped to reduce drag. The shape reduces turbulence during edge bevel etching to improve the uniformity of the edge exclusion and during high-speed rotation to improve particle performance.

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