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1. 发明授权

US11535407B1 Thermal management system 有权
公开(公告)号：US11535407B1
公开(公告)日：2022-12-27
申请号：US16814307
申请日：2020-03-10
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Calin Tarau , Kuan-Lin Lee , William Anderson
IPC分类号： B64G1/50 , F25B19/00 , F25B45/00 , F25B41/20 , F25B27/02
摘要： A thermal management system adapted to vent a two-phase working fluid into an environment having a higher pressure than a vapor pressure of a working fluid corresponding to a set point of the system including a secondary vessel containing a secondary species. The system includes a primary vessel containing the working fluid and the secondary species, and at least one valve to selectively control venting of a mixture of the working fluid and the secondary species from the primary vessel to the environment. The system includes at least one valve connected between the primary vessel and the secondary vessel to selectively control charging of the secondary species into the primary vessel.

2. 发明授权

US10386121B2 Open-loop thermal management process and system 有权
公开(公告)号：US10386121B2
公开(公告)日：2019-08-20
申请号：US14519323
申请日：2014-10-21
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Xudong Tang , Ehsan Yakshi-Tafti
IPC分类号： F28D20/00 , B01J7/00 , F28F27/02
摘要： Open-loop thermal management systems and open-loop thermal management processes are disclosed. The process includes providing an open-loop thermal management system, saturating a reactor of the system with gas while a flow control unit prevents flow of the gas from the reactor, and maintaining a gas dissociation pressure range of the gas within the reactor. The system includes the reactor being arranged to receive a heat load. The reactor contains metal hydrides, metal organic framework, or a combination thereof. The reactor includes at least one venting line extending from the reactor. Also, the flow control unit is configured to adjustably control the flow of gas from the reactor to maintain the gas dissociation pressure range.

3. 发明申请

US20150327402A1 HEAT MANAGEMENT FOR ELECTRONIC ENCLOSURES 有权
标题翻译：电子封装热管理
公开(公告)号：US20150327402A1
公开(公告)日：2015-11-12
申请号：US14274075
申请日：2014-05-09
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Andrew J. SLIPPEY , Michael C. ELLIS
IPC分类号： H05K7/20
CPC分类号： H05K7/20336 , H05K7/20309 , H05K7/20318 , H05K7/20436
摘要： An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.
摘要翻译：用于容纳电气部件的外壳和方法。外壳包括围绕电气部件设置的壁，壁具有差的导热性。至少一个热传输装置延伸穿过至少一个相应的壁。所述至少一个热传输装置具有位于外壳内的第一部分，位于外壳外部的第二部分和将第一部分连接到第二部分的过渡部分。所述至少一个热传输装置具有高的有效热导率并且提供高热导率路径，以使热能从壳体内部传递到外壳外部。

4. 发明授权

US11882673B1 Heat spreader having conduction enhancement with EMI shielding 有权
公开(公告)号：US11882673B1
公开(公告)日：2024-01-23
申请号：US17104346
申请日：2020-11-25
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Jens Weyant , Conor Maghan , Matt Schultz , Ryan Spangler
IPC分类号： H05K7/20 , H05K9/00
CPC分类号： H05K7/20418 , H05K9/0049 , H05K9/0088 , H05K7/20336
摘要： A heat spreader including a body having a first conduction value and a first electromagnetic interference shield value. The heat spreader further includes a conduction enhancement affixed to the body, the conduction enhancement having a second conduction value greater than the first conduction value and a second electromagnetic interference shield value less than the first electromagnetic interference shield value. At least a portion of the conduction enhancement is positioned relative to the body for increasing an effective electromagnetic interference shield value of the body associated with the at least a portion of the conduction enhancement.

5. 发明授权

US11408684B1 Loop heat pipe evaporator 有权
公开(公告)号：US11408684B1
公开(公告)日：2022-08-09
申请号：US16157841
申请日：2018-10-11
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Bradley Richard , William Anderson , Richard W. Bonner, III , Devin Pellicone , Chien-Hua Chen , Greg Hoeschele , Taylor Maxwell , Dan Pounds , Dan Reist
IPC分类号： F28D15/04 , F28D15/02
摘要： A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.

6. 发明授权

US11184996B1 Double sided heat exchanger cooling unit 有权
公开(公告)号：US11184996B1
公开(公告)日：2021-11-23
申请号：US16684878
申请日：2019-11-15
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Scott D. Garner , Peter Dussinger , Jon Zuo , Daniel T. Reist
IPC分类号： H05K7/20 , F28F21/08 , F28F21/02 , F28D15/02 , F28F3/02
摘要： A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.

7. 发明授权

US10638639B1 Double sided heat exchanger cooling unit 有权
公开(公告)号：US10638639B1
公开(公告)日：2020-04-28
申请号：US15176947
申请日：2016-06-08
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Scott D. Garner , Peter Dussinger , Jon Zuo , Daniel T. Reist
IPC分类号： H05K7/20 , F28D15/02 , F28F21/08 , F28F21/02 , F28F3/02
CPC分类号： H05K7/20154 , F28D15/0266 , F28D15/0275 , F28F3/02 , F28F21/02 , F28F21/084 , F28F21/085 , H05K7/20336 , H05K7/20409 , H05K7/20518 , F28D2015/0216 , F28F2250/08
摘要： A cooling unit positioned between a first gas stream and a second gas stream, the first gas stream and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger.

8. 发明授权

US09578781B2 Heat management for electronic enclosures 有权
标题翻译：电子机箱热管理
公开(公告)号：US09578781B2
公开(公告)日：2017-02-21
申请号：US14274075
申请日：2014-05-09
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Andrew J. Slippey , Michael C. Ellis
IPC分类号： H05K7/20
CPC分类号： H05K7/20336 , H05K7/20309 , H05K7/20318 , H05K7/20436
摘要： An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.
摘要翻译：用于容纳电气部件的外壳和方法。外壳包括围绕电气部件设置的壁，壁具有差的导热性。至少一个热传输装置延伸穿过至少一个相应的壁。所述至少一个热传输装置具有位于外壳内的第一部分，位于外壳外部的第二部分和将第一部分连接到第二部分的过渡部分。所述至少一个热传输装置具有高的有效热导率并且提供高热导率路径，以使热能从壳体内部传递到外壳外部。

9. 发明授权

US10605541B1 Heat pipe—thermal storage medium based cool storage system 有权
公开(公告)号：US10605541B1
公开(公告)日：2020-03-31
申请号：US15270083
申请日：2016-09-20
申请人： Advanced Cooling Technologies, Inc.
发明人： Ying Zheng , Chien-Hua Chen , Howard Pearlman , Richard Bonner, III , William G. Anderson
IPC分类号： F28D20/00 , F28D15/06 , F28D15/02 , F28D20/02 , F28D15/04 , F28D21/00
摘要： A cool storage system comprising which includes a plurality of heat pipes. Each of the heat pipes has a lower evaporator section, a hybrid evaporator/condensing section, and an upper condensing section. The hybrid evaporator/condensing section positioned between the lower evaporator section and the upper condensing section. Each of the heat pipes contains a selected amount of a heat transfer fluid adapted to transfer heat from the lower evaporator section to the hybrid evaporator/condensing section and the upper condensing section through a vapor/condensation cycle, or the heat transfer fluid is vaporized in the hybrid evaporator and condensed in the upper evaporator section. A thermal storage medium is provided in thermal engagement with the hybrid evaporator/condensing section. A heat source is located in said lower evaporator section, and a cooling source, located in said upper condensing section.

10. 发明授权

US10495388B1 Thermal energy storage system with tunable phase change composition 有权
公开(公告)号：US10495388B1
公开(公告)日：2019-12-03
申请号：US15689245
申请日：2017-08-29
申请人： ADVANCED COOLING TECHNOLOGIES, INC.
发明人： Ying Zheng , Chien-Hua Chen , Howard Pearlman , Richard Bonner, III , Fangyu Cao
IPC分类号： F28D20/02 , C09K5/06
CPC分类号： F28D20/02 , C09K5/063
摘要： A thermal energy storage system includes a phase change composition including a phase change material. The phase change composition has a first melting temperature at a first hydration level and a second melting temperature at a second hydration level. The phase change composition stores thermal energy by converting from a solid to a liquid. The thermal energy storage system also includes at least one compartment containing the phase change composition and at least one tuning medium receiving water to adjust the phase change composition from the first hydration level to the second hydration level and supplying water to adjust the phase change composition from the second hydration level to the first hydration level. A method of storing and releasing thermal energy is also disclosed.

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