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    • 4. 发明授权
    • Heat management for electronic enclosures
    • 电子机箱热管理
    • US09578781B2
    • 2017-02-21
    • US14274075
    • 2014-05-09
    • ADVANCED COOLING TECHNOLOGIES, INC.
    • Andrew J. SlippeyMichael C. Ellis
    • H05K7/20
    • H05K7/20336H05K7/20309H05K7/20318H05K7/20436
    • An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.
    • 用于容纳电气部件的外壳和方法。 外壳包括围绕电气部件设置的壁,壁具有差的导热性。 至少一个热传输装置延伸穿过至少一个相应的壁。 所述至少一个热传输装置具有位于外壳内的第一部分,位于外壳外部的第二部分和将第一部分连接到第二部分的过渡部分。 所述至少一个热传输装置具有高的有效热导率并且提供高热导率路径,以使热能从壳体内部传递到外壳外部。