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1. 发明授权

US07271958B2 Diffractive light modulator 失效
$Diffractive light modulator$
标题翻译：衍射光调制器
公开(公告)号：US07271958B2
公开(公告)日：2007-09-18
申请号：US11347636
申请日：2006-02-02
申请人： Sang Kee Yoon , Jong Sam Kim
发明人： Sang Kee Yoon , Jong Sam Kim
IPC分类号： G02B5/18
CPC分类号： G02B26/0808
摘要： The present invention relates to diffractive light modulators and, more particularly, to a diffractive light modulator in which the lower support for mirrors is configured in consideration of the internal intrinsic stress of a mirror, thus improving the flatness of a mirror surface and enhancing the optical efficiency of the light modulator.
摘要翻译：本发明涉及衍射光调制器，更具体地说，涉及一种衍射光调制器，其中考虑到反射镜的内部固有应力来构造反射镜的下支撑件，从而提高了镜面的平坦度并增强了光学光调制器的效率。

2. 发明申请

US20150028685A1 COIL SHEET INCLUDING CORE AND CONTACTLESS POWER TRANSMISSION DEVICE INCLUDING THE SAME 审中-公开
标题翻译：包括包括其中的核心和无连接电力传输装置的线圈板
公开(公告)号：US20150028685A1
公开(公告)日：2015-01-29
申请号：US14061119
申请日：2013-10-23
申请人： SAMSUNG ELECTRO-MACHANICS CO., LTD.
发明人： Kang Ryong CHOI , Yong Il Kwon , Sung Yong An , Chang Ryul Jung
IPC分类号： H01F27/34 , H01F38/14
CPC分类号： H01F27/34 , H01F38/14
摘要： There is provided a coil sheet including: a sheet having a spiral coil thereon; a core located at the central portion of the coil and having a thickness of t mm, wherein the core has a curvature in at least one of an upper surface of the core, a corner at which the upper surface and a side surface meet each other, and a position in which the core and the sheet meet each other.
摘要翻译：提供了一种线圈片，其包括：在其上具有螺旋线圈的片材; 位于线圈的中心部分的芯部，其厚度为tmm，其中芯部在芯部的上表面中的至少一个中具有曲率，上表面和侧表面彼此相交的角部，以及芯和片彼此相遇的位置。

3. 发明申请

US20110214913A1 ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METHOD THEREOF 审中-公开
标题翻译：电子设备嵌入式印刷电路板及其制造方法
公开(公告)号：US20110214913A1
公开(公告)日：2011-09-08
申请号：US12849624
申请日：2010-08-03
申请人： Jin-Won Lee , Yul-Kyo Chung , Dae-Jung Byun , Seung-Hyun Sohn
发明人： Jin-Won Lee , Yul-Kyo Chung , Dae-Jung Byun , Seung-Hyun Sohn
IPC分类号： H05K1/16 , H05K3/30
CPC分类号： H05K1/16 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/73267 , H01L2924/14 , H01L2924/351 , H05K3/30 , Y10T29/4913 , H01L2924/00
摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering an electro device on an upper surface of a supporting body; stacking a pure resin layer and an insulating reinforcing layer on an upper side of the supporting body, wherein the electro device is embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer.
摘要翻译：公开了电子装置嵌入式印刷电路板及其制造方法。根据本发明的实施例，电子装置嵌入式印刷电路板通过以下方式制造：将电子装置粘附在支撑体的上表面上; 在支撑体的上侧堆叠纯树脂层和绝缘增强层，其中电子器件嵌入纯树脂层中; 去除支撑体; 在电气设备的下侧堆叠绝缘层，浸渍在绝缘层中的增强材料; 并且在每个加强层和绝缘层上构图电路。

4. 发明申请

US20090315798A1 ANTENNA FOR RADIO FREQUENCY RECEPTION 审中-公开
标题翻译：无线电频率接收天线
公开(公告)号：US20090315798A1
公开(公告)日：2009-12-24
申请号：US12255260
申请日：2008-10-21
申请人： Hyun Kil Nam , Sung Eun Cho , Ha Ryong Hong , Chan Gwang An , Jae Suk Sung , Dae Seong Jeon
发明人： Hyun Kil Nam , Sung Eun Cho , Ha Ryong Hong , Chan Gwang An , Jae Suk Sung , Dae Seong Jeon
IPC分类号： H01Q1/38 , H01Q1/46 , H01Q1/00
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q1/36 , H01Q7/00 , H01Q21/30
摘要： An antenna for radio frequency (RF) reception includes a substrate, a first radiator disposed in one region of the substrate and receiving a signal of a first frequency band, and a second radiator disposed in another region of the substrate and receiving a signal of a second frequency band.
摘要翻译：一种用于射频（RF）接收的天线包括：衬底，设置在衬底的一个区域中并接收第一频带的信号的第一辐射器，以及设置在衬底的另一个区域中的第二辐射体，第二频带。

5. 发明申请

US20060002577A1 Internal weight type vertical vibrator 有权
标题翻译：内部重量型立式振动器
公开(公告)号：US20060002577A1
公开(公告)日：2006-01-05
申请号：US10947145
申请日：2004-09-23
申请人： Sung Won , Joon Choi , Il Park , Ju Kim , Hwa Oh
发明人： Sung Won , Joon Choi , Il Park , Ju Kim , Hwa Oh
IPC分类号： H04R1/00 , H04R9/06 , H04R11/02
CPC分类号： B06B1/045 , H02K33/06 , H02K33/16
摘要： Disclosed is an internal weight type vertical vibrator including: a housing; a magnetic circuit unit placed in the internal space of the housing, and comprising a magnet perpendicularly placed and a yoke for fixedly receiving the magnet therein for generating a magnetic field; spring members provided with upper ends fixed to the housing and lower ends fixed to the magnetic circuit unit for vertically; a vibrating unit placed in the yoke so that the outer surface of the vibrating unit is surrounded by the yoke, comprising the weight having a hollow cylindrical structure provided with a central hole, into which the magnet is inserted; and a vibration-generating coil placed just below the magnetic circuit unit so that the vibration-generating coil is interlinked with the magnetic field of the magnet for allowing current supplied from the outside to flow in one direction therethrough.
摘要翻译：公开了一种内部重量型的垂直振动器，包括：壳体; 放置在所述壳体的内部空间中的磁路单元，并且包括垂直放置的磁体和用于在其中固定地接收磁体以产生磁场的磁轭; 弹簧构件设置有固定到壳体的上端和用于垂直地固定到磁路单元的下端; 设置在所述轭中的振动单元，使得所述振动单元的外表面被所述轭包围，所述振动单元包括所述重物，所述重物具有设置有所述磁体插入其中的中心孔的中空圆柱形结构; 以及位于磁路单元正下方的振动产生线圈，使得振动产生线圈与磁体的磁场相互连接，以允许从外部供给的电流沿着一个方向流过。

6. 发明授权

US09929117B2 Electronic component package and electronic device including the same 有权
公开(公告)号：US09929117B2
公开(公告)日：2018-03-27
申请号：US15670711
申请日：2017-08-07
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Hyun Lee , Sung Won Jeong , Ha Young Ahn , Shang Hoon Seo , Seung Yeop Kook
IPC分类号： H01L23/00 , H01L23/48 , H01L23/31
CPC分类号： H01L24/14 , H01L23/3114 , H01L23/481 , H01L24/06 , H01L2224/0237 , H01L2224/0239 , H01L2224/024 , H01L2224/0401 , H01L2224/04105 , H01L2224/05111 , H01L2224/05116 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/12105 , H01L2224/13014 , H01L2224/13016 , H01L2224/13023 , H01L2224/13024 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/14131 , H01L2224/14181 , H01L2224/16225 , H01L2225/1035 , H01L2225/1058 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07025 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1436 , H01L2924/1438 , H01L2924/145 , H01L2924/186 , H01L2924/3025 , H01L2924/3511 , H01L2924/3512
摘要： An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.

7. 发明授权

US08906836B2 Lubricating oil composition 有权
标题翻译：润滑油组成
公开(公告)号：US08906836B2
公开(公告)日：2014-12-09
申请号：US13271368
申请日：2011-10-12
申请人： Ha Yong Jung , Myung Hwa Choi , Wang Hyun Kwon , Hyung Kyu Kim , Kun Kim
发明人： Ha Yong Jung , Myung Hwa Choi , Wang Hyun Kwon , Hyung Kyu Kim , Kun Kim
IPC分类号： C10M105/36 , C07C69/44 , C10M105/38
CPC分类号： C07C69/44 , C10M105/36 , C10M105/38 , C10M2207/2825 , C10M2207/2835 , C10N2220/022 , C10N2220/13 , C10N2230/74 , C10N2240/02 , C10N2240/204
摘要： Disclosed is a lubricating oil composition which includes a diester-based base oil having an asymmetric structure in which the number of carbons of the alkyl chain bound to one ester group with respect to a central atom is two more than that of the alkyl group bound to the other ester group, and which has low viscosity and a comparatively small amount of evaporation at high temperature. When this composition is used for a motor of a small hard disk, power consumption can be reduced and stability at high temperature can be enhanced.
摘要翻译：公开了一种润滑油组合物，其包含具有不对称结构的二酯基基油，其中与一个酯基相对于中心原子结合的烷基链的碳数相对于与另一个酯基，并且在高温下具有低粘度和相对较少量的蒸发。当该组合物用于小硬盘的电动机时，可以降低功耗，并且可以提高高温下的稳定性。

8. 发明申请

US20140176380A1 MULTILAYER FERRITE SHEET, ANTENNA DEVICE USING THE SAME, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：多层铁氧体片，使用其的天线装置及其制造方法
公开(公告)号：US20140176380A1
公开(公告)日：2014-06-26
申请号：US13788999
申请日：2013-03-07
申请人： SAMSUNG ELECTRO-MACHANICS CO., LTD.
发明人： Dong Hyeok Choi , Jin Young Kim , Sung Yong An , Ji Man Ryu
IPC分类号： H01Q1/36
CPC分类号： H01Q1/38 , Y10T156/10 , Y10T156/1052 , Y10T428/2495 , Y10T428/325
摘要： There are provided a multilayer ferrite sheet capable of performing communications in a wideband frequency, an antenna device using the same, and a manufacturing method thereof. The multilayer ferrite sheet includes: a Y-type hexaferrite layer; and a Z-type hexaferrite layer, wherein the Y-type hexaferrite and the Z-type hexaferrite are alternately laminated.
摘要翻译：提供能够进行宽带频率通信的多层铁氧体片，使用其的天线装置及其制造方法。多层铁氧体片包括：Y型六方晶系层; 和Z型六电极层，其中Y型六铁素体和Z型六方铁氧体交替层压。

9. 发明授权

US08708215B2 Solder ball supplying apparatus 有权
标题翻译：焊球供应装置
公开(公告)号：US08708215B2
公开(公告)日：2014-04-29
申请号：US13894312
申请日：2013-05-14
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Hueng Jae Oh , Yon Ho You , Jin Won Choi
IPC分类号： B23K37/00
CPC分类号： B23K3/0623
摘要： Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.
摘要翻译：本发明公开了一种焊球供给装置，其特征在于，包括：盒形状，盒内嵌有多个焊球; 耦合到所述盒的下部的振动单元; 以及金属掩模，与所述振动单元的下部一体地结合，并且在其整个表面上形成有多个孔。

10. 发明申请

US20120289173A1 INTERFACE OF MULTI CHIP MODULE 审中-公开
标题翻译：多芯片模块接口
公开(公告)号：US20120289173A1
公开(公告)日：2012-11-15
申请号：US13444538
申请日：2012-04-11
申请人： Kyoung Ho Lee , Su Bong Jang , Dong Hwan Lee , Hee Soo Yoon
发明人： Kyoung Ho Lee , Su Bong Jang , Dong Hwan Lee , Hee Soo Yoon
IPC分类号： H04B1/44 , H04B1/40 , H04B1/04
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is an interface of a multi chip module transmitting and receiving data among a plurality of chips. An interface of a multi chip module includes a communication unit that is provided in the chips and transmits and receives the data; and a radio communication unit that is provided outside the chips, converts the data transmitted from the communication unit into radio signals and wirelessly transmits the radio signals, and demodulates radio signals received from other chips into data and transmits the data to the communication unit, whereby wired communication chips can implement radio communication.
摘要翻译：这里公开了多芯片模块在多个芯片之间发送和接收数据的接口。多芯片模块的接口包括设置在芯片中并发送和接收数据的通信单元; 以及设置在芯片外部的无线电通信单元，将从通信单元发送的数据转换为无线电信号并无线发送无线电信号，并将从其他芯片接收的无线电信号解调为数据，并将数据发送到通信单元，由此有线通信芯片可以实现无线电通信。

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