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    • 2. 发明申请
    • Vacuum System For Wafer Handling
    • 晶圆处理真空系统
    • US20080199281A1
    • 2008-08-21
    • US11912753
    • 2005-05-26
    • Vincenzo OgliariFranco Preti
    • Vincenzo OgliariFranco Preti
    • H01L21/68
    • H01L21/6838
    • The present invention relates to a system for handling wafers (W) within a treatment apparatus (1) comprising a suction system (10) equipped with a suction inlet, a suction pipe (7) having a first end and a second end, said first end being connected to the suction inlet of the suction system (10), a tool (6) suitable for handling wafers (W) and for holding them by suction, and connected to the second end of the suction pipe (7), and a device for regulating the pressure in the suction pipe; the regulating device comprises a valve (8) connected to the suction pipe (7) and capable of opening when the pressure in the suction pipe (7) falls below a predetermined value.
    • 本发明涉及一种处理设备(1)内处理晶片(W)的系统,包括一个装有吸入口的抽吸系统(10),一个具有第一端和第二端的吸入管(7) 端部连接到抽吸系统(10)的抽吸入口,适于处理晶片(W)并通过抽吸将其保持并连接到吸入管(7)的第二端的工具(6),以及 用于调节吸入管中压力的装置; 所述调节装置包括连接到所述吸入管(7)并且当所述吸入管(7)中的压力低于预定值时能够打开的阀(8)。