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1. 发明授权

US08551628B2 Composite material, high-frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：复合材料，由其制成的高频电路基片及其制造方法
公开(公告)号：US08551628B2
公开(公告)日：2013-10-08
申请号：US12267198
申请日：2008-11-07
申请人： Min She Su
发明人： Min She Su
IPC分类号： B32B5/02 , B32B27/04 , B32B27/12
CPC分类号： H05K1/0373 , H05K1/032 , H05K1/0366 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24355 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/3594
摘要： A composite material, a high-frequency circuit substrate made from the composite material, and a method of making the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a butadiene styrene copolymer resin with a molecular weight less than 11,000 containing more than 60 percent of vinyl, a polybutadiene resin with polarity groups containing more than 60 percent vinyl, and a maleic anhydride grafted polybutadiene styrene copolymer with a molecular weight of more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material permits easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for the processing operation. The composite material is suitable for making the circuit substrate.
摘要翻译：复合材料，由复合材料制成的高频电路基板以及制造高频电路基板的方法。复合材料包括：热固性组合物，其包含分子量小于11,000的丁二烯苯乙烯共聚物树脂，其含有60％以上的乙烯基，极性基团含有大于60％的乙烯基的聚丁二烯树脂和马来酸酐接枝的聚丁二烯苯乙烯共聚物分子量超过50,000; 玻璃纤维布; 粉末填料; 和固化引发剂。复合材料允许容易地制造预浸料和铜箔的高粘结。由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且便于加工操作。复合材料适用于制造电路基板。

2. 发明申请

US20110053447A1 HALOGEN-FREE RESIN COMPOSITION WITH HIGH FREQUENCY DIELECTRIC PROPERTY, AND PREPREG AND LAMINATE MADE THEREFROM 有权
标题翻译：具有高频介电性能的无卤素树脂组合物，以及其中的PREPREG和层压体
公开(公告)号：US20110053447A1
公开(公告)日：2011-03-03
申请号：US12695186
申请日：2010-01-28
申请人： Shi Guo Su , Yue Shan He , Bi Wu Wang , Jie Li , Tao Chen
发明人： Shi Guo Su , Yue Shan He , Bi Wu Wang , Jie Li , Tao Chen
IPC分类号： B32B27/04 , C08L63/00
CPC分类号： C08J5/24 , C08J2325/08 , C08J2363/00 , C08K5/357 , C08K5/49 , C08L63/00 , C08L2201/02 , C08L2203/20 , C08L2203/206 , C09D135/06 , Y10T428/24994 , Y10T428/31515 , Y10T442/2721 , C08L35/06
摘要： The present invention relates to a halogen-free resin composition with high frequency dielectric property, and a prepreg and a laminate made therefrom. The halogen-free resin composition with high frequency dielectric property comprises, calculating according to the parts by weight of organic solids: (A) 10-50 parts by weight of copolymer of styrene-maleic anhydride; (B) 10-50 parts by weight of at least one compound having dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one polyepoxide; (D) 5-30 parts by weight of at least one phosphorus-containing flame retardant. Prepregs and laminates made from the resin composition have low dielectric constant, low dielectric dissipation factor, high glass transition temperature, high heat resistance, low moisture adsorption, and the technological operation is simple.
摘要翻译：本发明涉及具有高频介电性能的无卤素树脂组合物，以及预浸料和由其制成的层压材料。具有高频介电性能的无卤树脂组合物包括：根据有机固体的重量份计算：（A）10-50重量份苯乙烯 - 马来酸酐的共聚物; （B）10-50重量份的至少一种具有二氢苯并恶嗪环的化合物; （C）10-50重量份的至少一种聚环氧化物; （D）5-30重量份的至少一种含磷阻燃剂。由树脂组合物制成的预浸料和层压板具有低介电常数，低介电损耗因子，高玻璃化转变温度，高耐热性，低吸湿性，工艺操作简单。

3. 发明授权

US10093800B2 Polyphenylene ether resin composition, and a prepreg and a copper clad laminate made therefrom 有权
公开(公告)号：US10093800B2
公开(公告)日：2018-10-09
申请号：US13845116
申请日：2013-03-18
申请人： GUANGDONG SHENGYI SCI.TECH CO., LTD
发明人： Xian-Ping Zeng
IPC分类号： C08L71/12 , D06M15/53 , C08L47/00 , C08J5/24 , C08G65/48
摘要： The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.

4. 发明授权

US09193858B2 Thermoset resin composition and its use 有权
标题翻译：热固性树脂组合物及其用途
公开(公告)号：US09193858B2
公开(公告)日：2015-11-24
申请号：US13803519
申请日：2013-03-14
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Minshe Su , Yong Chen , Guofang Tang , Zhongqiang Yang
IPC分类号： C08L35/06 , C08L63/00
CPC分类号： C08L35/06 , C08L63/00 , C08L2312/00
摘要： The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.
摘要翻译：本发明公开了包含溴化环氧树脂以外的环氧树脂，苯乙烯马来酸酐共聚物和添加型阻燃剂的热固性树脂组合物。热固性树脂组合物还包括活性酯。热固性树脂组合物用于制备树脂片，树脂涂布的铜，预浸料，层压体，覆铜层压板和印刷线路板等。所述热固性树脂组合物显着降低了PCB层压体的分层可能性，并且克服了四溴双酚A的缺点，以引入介质性能，这将使系统恶化。所得树脂组合物具有良好的热稳定性和耐湿热性，低介电常数和介电损耗角切线，以及良好的阻燃性。

5. 发明申请

US20140107256A1 THERMOSET RESIN COMPOSITION AND ITS USE 有权
标题翻译：热固性树脂组合物及其用途
公开(公告)号：US20140107256A1
公开(公告)日：2014-04-17
申请号：US13803519
申请日：2013-03-14
申请人： GUANGDONG SHENGYI SCI. TECH CO., LTD.
发明人： Minshe SU , Yong CHEN , Guofang TANG , Zhongqiang YANG
IPC分类号： C08L35/06
CPC分类号： C08L35/06 , C08L63/00 , C08L2312/00
摘要： The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.
摘要翻译：本发明公开了包含溴化环氧树脂以外的环氧树脂，苯乙烯马来酸酐共聚物和添加型阻燃剂的热固性树脂组合物。热固性树脂组合物还包括活性酯。热固性树脂组合物用于制备树脂片，树脂涂布的铜，预浸料，层压体，覆铜层压板和印刷线路板等。所述热固性树脂组合物显着降低了PCB层压体的分层可能性，并且克服了四溴双酚A的缺点，以引入介质性能，这将使系统恶化。所得树脂组合物具有良好的热稳定性和耐湿热性，低介电常数和介电损耗角切线，以及良好的阻燃性。

6. 发明授权

US08445605B2 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom 有权
标题翻译：无卤阻燃树脂组合物，以及由其制成的印刷电路用预浸料，层压板和层叠体
公开(公告)号：US08445605B2
公开(公告)日：2013-05-21
申请号：US12861742
申请日：2010-08-23
申请人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
发明人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
IPC分类号： B32B15/08 , B32B17/04 , B32B27/04 , B32B27/38 , C08K3/20 , C08K3/36 , C08L61/06 , C08L63/02 , C08L63/04 , C08K7/14
CPC分类号： C08K5/357 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2385/02 , C08J2463/00 , C08K5/5399 , C08L63/00 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.
摘要翻译：本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压材料和印刷电路用层压材料。无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1）和含二氢苯并恶嗪环的化合物（A2）为1:10至1:2之间; （B）15-45重量份聚环氧化合物; （C）5-25重量份酚醛树脂型固化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压板具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

7. 发明授权

US08269115B2 Composite material and high-frequency circuit substrate made therefrom 有权
标题翻译：复合材料和由其制成的高频电路基板
公开(公告)号：US08269115B2
公开(公告)日：2012-09-18
申请号：US12584596
申请日：2009-09-09
申请人： Min She Su
发明人： Min She Su
IPC分类号： H05K1/09
CPC分类号： C08J5/24 , C08J5/043 , C08J2309/06 , H05K1/024 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , H05K2201/029 , Y10T442/2672 , Y10T442/2713 , Y10T442/2934
摘要： The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by a coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen elements. More than 60 percent of the resin is vinyl. The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils covered on both sides of overlapped prepregs, wherein each prepeg is made from the composite material.
摘要翻译：本发明涉及由复合材料制成的复合材料和高频电路基板。复合材料包括：相对于复合材料为20〜70重量％的热固性组合物，由偶联剂处理的玻璃纤维布; 粉末填料; 阻燃剂和固化引发剂。热固性组合物包括分子量小于11,000的树脂和低分子量固体烯丙基树脂。树脂由碳和氢元素组成。超过60％的树脂是乙烯基树脂。由复合材料制成的高频电路基板包括：相互重叠的多个预浸料和覆盖在重叠的预浸料的两侧的铜箔，其中每个预成型件由复合材料制成。

8. 发明授权

US10194528B2 Composite material, high-frequency circuit baseboard made therefrom and production method thereof 有权
公开(公告)号：US10194528B2
公开(公告)日：2019-01-29
申请号：US14115748
申请日：2011-09-14
申请人： Minshe Su
发明人： Minshe Su
IPC分类号： C08J5/24 , H05K1/03 , B32B27/04 , C08J5/18 , C08J9/42 , H05K1/02
摘要： A composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; and a powdery packing. The high-frequency circuit baseboard made from the composite material comprises: several laminated sheets of prepreg made from the composite material, and copper foils pressed over the two properties sides thereof. The baseboard uses a porous ePTFE film with excellent dielectric as a carrier material, which can lower the dielectric constant and dielectric loss angle tangent of the composite material and high-frequency circuit baseboard. The dielectric constant of the high-frequency circuit baseboard and prepreg is isotropic in both X and Y directions. The thickness of the prepreg can be regulated by employing porous ePTFE films with a different thickness, which avoids cracking.

9. 发明授权

US08629219B2 Epoxy resin compound, preparation method thereof, prepreg made therefrom, and copper cladded laminate made therefrom 有权
标题翻译：环氧树脂化合物，其制备方法，由其制成的预浸料，以及由其制成的铜包覆层压材料
公开(公告)号：US08629219B2
公开(公告)日：2014-01-14
申请号：US12820664
申请日：2010-06-22
申请人： Dong Wei , Ke Hong Fang
发明人： Dong Wei , Ke Hong Fang
IPC分类号： C08K3/22 , C08K3/36 , C08L63/00 , C08L63/04 , B32B15/092 , B32B17/04 , B32B27/04 , B32B27/38
CPC分类号： C08L63/00 , C08G65/485 , C08K3/013 , C08K5/0008 , C08K7/04 , C08L71/126 , Y10T428/24994 , Y10T428/2915 , Y10T428/2971 , Y10T428/31525 , Y10T428/31529 , Y10T442/20 , C08L71/12
摘要： The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production. Besides, the laminate material and copper cladded laminate of the present invention, which are made from the above mentioned epoxy resin compound, are used in printed circuit boards to have good heat resistance, dielectric property, and machinability, so as to be good for the signal transmission of a high-frequency PCB.
摘要翻译：本发明涉及环氧树脂化合物，其制备方法，由其制备的预浸料，以及由其制成的铜包覆层压材料。环氧树脂化合物包括：30〜80重量份的环氧树脂; 20-50重量份新结构的聚苯醚树脂，其数均分子量为1000-5000，通过聚苯醚和酚醛树脂与引发剂的再分布反应制备; 0-50重量份填料; 1-20份（重量）成分。本发明的环氧树脂化合物具有良好的耐热性和介电性，制备方法简单，对批量生产有利。此外，由上述环氧树脂化合物制成的本发明的层压材料和铜包覆层压板用于印刷电路板中以具有良好的耐热性，介电性和机械加工性，从而对于信号传输高频PCB。

10. 发明申请

US20100258340A1 Composite material and high-frequency circuit substrate made therefrom 有权
标题翻译：复合材料和由其制成的高频电路基板
公开(公告)号：US20100258340A1
公开(公告)日：2010-10-14
申请号：US12584596
申请日：2009-09-09
申请人： Min She Su
发明人： Min She Su
IPC分类号： H05K1/09 , B32B5/02 , B32B27/04 , B32B17/02
CPC分类号： C08J5/24 , C08J5/043 , C08J2309/06 , H05K1/024 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , H05K2201/029 , Y10T442/2672 , Y10T442/2713 , Y10T442/2934
摘要： The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen element. More than 60 percent of the resin is vinyl. The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils respectively covered on both sides of overlapped prepregs, wherein each prepreg is made from the composite material. The composite material of the present invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.
摘要翻译：本发明涉及由复合材料制成的复合材料和高频电路基板。复合材料包括：相对于复合材料为20〜70重量％的热固性组合物，由偶联剂处理的玻璃纤维布; 粉末填料; 阻燃剂和固化引发剂。热固性组合物包括分子量小于11,000的树脂和低分子量固体烯丙基树脂。树脂由碳和氢元素组成。超过60％的树脂是乙烯基树脂。由复合材料制成的高频电路基板包括：相互重叠的多个预浸料和分别覆盖在重叠的预浸料的两侧的铜箔，其中每个预浸料由复合材料制成。本发明的复合材料实现了预浸料的容易制造和铜箔的高粘合性。由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切，耐热性优异，方便操作。因此，复合材料适合于制造电路基板。

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