会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Encoder with tri-color LED
    • 三色LED编码器
    • US08440925B2
    • 2013-05-14
    • US13064167
    • 2011-03-09
    • Ching-Hao ChungHsiu-Chen LiPei-Tung Chung
    • Ching-Hao ChungHsiu-Chen LiPei-Tung Chung
    • H01H9/00
    • H01H19/005H01H1/5805H01H19/025H01H19/08H01H19/11H01H25/06H01H2009/164H01H2019/006
    • An encoder with a tri-color LED includes an insulating base, five terminals, a conductive elastic piece, a tri-color LED assembly, an encoder substrate assembly, a conductive wiper assembly, and an insulated light shaft. The five terminals and the insulating base are formed integrally. The conductive elastic piece is received in a receiving chamber of the insulating base. The tri-color LED assembly is disposed in the receiving chamber. The encoder substrate assembly covers on both the conductive elastic piece and the tri-color LED assembly. The conductive wiper assembly is received in the encoder substrate assembly. The insulated light shaft passes through a through hole of the conductive wiper assembly and a through hole of the encoder substrate assembly. Thereby, through voltage variation of an independent tri-color LED loop, color mixing can be controlled, and that to combine the same with the encoder a function of lighting and marking can be achieved.
    • 具有三色LED的编码器包括绝缘基座,五个端子,导电弹性片,三色LED组件,编码器基底组件,导电擦拭器组件和绝缘光轴。 五个端子和绝缘基座一体形成。 导电弹性件被容纳在绝缘基座的接收室中。 三色LED组件设置在接收室中。 编码器基板组件覆盖导电弹性片和三色LED组件。 导电擦拭器组件被接收在编码器基板组件中。 绝缘光轴穿过导电擦拭器组件的通孔和编码器基板组件的通孔。 因此,通过独立的三色LED环路的电压变化,可以控制混色,并且可以实现与编码器相同的照明和标记功能。
    • 6. 发明申请
    • Surface plasmon resonance sensing device
    • 表面等离子体共振检测装置
    • US20110157590A1
    • 2011-06-30
    • US12662545
    • 2010-04-22
    • Chung-Pei LeeYu-Chia TsaoWoo-Hu TsaiHsiang-Chih Hsu
    • Chung-Pei LeeYu-Chia TsaoWoo-Hu TsaiHsiang-Chih Hsu
    • G01N21/55
    • G01N21/553G01N2201/0221
    • A surface plasmon resonance sensing device that is portable, and having the fiber sensing unit whose resonant wavelength being within the transmission range of a single-mode fiber or a multi-mode fiber, is disclosed. The disclosed sensing device comprises: a light source unit, a fiber sensing unit, an optical sensor, a plurality of fibers, and a computing and displaying unit. The fiber sensing unit includes a trench, a cladding layer, a core layer, a first metallic layer, and a plurality of dielectric thin film layers, wherein the first metallic layer covers the trench, and the plurality of dielectric thin film layers forms on the first metallic layer. The light source provided by the light source unit will become a light signal, after the light passes through the fiber sensing unit. The optical sensor transforms the light signal into a corresponding electric signal, for the usage of the computing and displaying unit.
    • 公开了一种便携式的表面等离子体共振感测装置,其具有谐振波长在单模光纤或多模光纤的传输范围内的光纤传感单元。 所公开的感测装置包括:光源单元,光纤感测单元,光学传感器,多个光纤以及计算和显示单元。 光纤感测单元包括沟槽,包覆层,芯层,第一金属层和多个电介质薄膜层,其中第一金属层覆盖沟槽,并且多个电介质薄膜层形成在 第一金属层。 在光通过光纤感测单元之后,由光源单元提供的光源将成为光信号。 光学传感器将光信号转换成相应的电信号,以用于计算和显示单元的使用。
    • 7. 发明申请
    • LED package structure and manufacturing process thereof
    • LED封装结构及其制造工艺
    • US20110089461A1
    • 2011-04-21
    • US12662727
    • 2010-04-30
    • Yin-Cheng CHAOYu-Bing LANPei-Hsuan LANJui-Hung CHEN
    • Yin-Cheng CHAOYu-Bing LANPei-Hsuan LANJui-Hung CHEN
    • H01L33/62H01L33/64
    • H01L33/642H01L33/32H01L33/62H01L2224/48091H01L2224/48247H01L2924/00014
    • A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.
    • 一种制造LED封装结构的方法包括以下步骤:(A)提供T形散热块和整体材料片,其中T形散热块包括基部和从 所述基座部分,并且其中所述整体材料片包括分别从所述侧框架的两个相对的内侧延伸的侧框架和一对电极引线框架; (B)在所述基部的上表面上形成绝缘层; (C)将电极引线框架设置在绝缘层上; 和(D)在所述T形散热块周围形成绝缘外框,其中所述绝缘层被包封在所述绝缘外框架中,并且所述散热块的所述基部的一部分暴露于所述绝缘外框架 。 因此,LED封装结构可以提高耐电压和绝缘性。