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1. 发明授权

US08373353B2 Alternating current light emitting diode device 有权
标题翻译：交流发光二极管装置
公开(公告)号：US08373353B2
公开(公告)日：2013-02-12
申请号：US12656854
申请日：2010-02-18
申请人： Pei-Hsuan Lan , Jui-Hung Chen , Jen-Hua Yang , Yu-Bing Lan
发明人： Pei-Hsuan Lan , Jui-Hung Chen , Jen-Hua Yang , Yu-Bing Lan
IPC分类号： H05B41/16
CPC分类号： F21K9/00 , F21Y2115/10 , H01L25/167 , H01L2224/45144 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： An alternating current light emitting diode device is disclosed, which comprises a substrate having a supporting surface and two supporting elements locating on the two sides of the supporting surface; a plurality of LED grains set on the supporting surface; a first chip resistor set on one of the two supporting elements; and a plurality of electrical wires providing electrical connections between the LED grains, and between the LED grain and the first chip resistor. Therefore, the total wattage of the AC LED device can be lowered to a designed range by using a chip resistor with proper resistance, and the total illumination efficiency can be increased.
摘要翻译：公开了一种交流发光二极管装置，其包括具有支撑表面的基板和位于支撑表面两侧的两个支撑元件; 设置在支撑面上的多个LED晶粒; 设置在所述两个支撑元件中的一个上的第一芯片电阻器; 以及多个电线，其在LED晶粒之间以及在LED晶粒和第一芯片电阻之间提供电连接。因此，可以通过使用具有适当电阻的片式电阻器将AC LED装置的总功率降低到设计范围，并且可以提高总的照明效率。

2. 发明授权

US08148739B2 LED package structure 失效
标题翻译： LED封装结构
公开(公告)号：US08148739B2
公开(公告)日：2012-04-03
申请号：US12662819
申请日：2010-05-05
申请人： Pei-Hsuan Lan , Yu-Bing Lan
发明人： Pei-Hsuan Lan , Yu-Bing Lan
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/8592 , H01L2924/00 , H01L2924/00014
摘要： An LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and an LED module electrically connected with the positive-electrode frame and the negative-electrode frame. The LED module includes a plurality of LED chips. The heatsink slug is provided, at its surface, with a plurality of cup-like recesses. The plural LED chips are each bonded, correspondingly, on a plane in the cup-like recess. Each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex contour. As a result, a specific proportion for the color lights emitted from all the LED chips and from the fluorescent material in every direction of a space can be maintained, and that a better spatial color uniformity can be achieved.
摘要翻译： LED封装结构包括与正极框架和负极框架电连接的散热片，正极框架，负极框架和LED模块。 LED模块包括多个LED芯片。散热片在其表面上设置有多个杯状凹部。相应地，多个LED芯片在杯状凹部中的平面上相互粘合。每个LED芯片被具有弯曲和凸形轮廓的荧光胶体层覆盖。结果，可以保持从所有LED芯片和从空间的每个方向上的荧光材料发射的颜色光的特定比例，并且可以实现更好的空间颜色均匀性。

3. 发明申请

US20110089461A1 LED package structure and manufacturing process thereof 失效
标题翻译： LED封装结构及其制造工艺
公开(公告)号：US20110089461A1
公开(公告)日：2011-04-21
申请号：US12662727
申请日：2010-04-30
申请人： Yin-Cheng CHAO , Yu-Bing LAN , Pei-Hsuan LAN , Jui-Hung CHEN
发明人： Yin-Cheng CHAO , Yu-Bing LAN , Pei-Hsuan LAN , Jui-Hung CHEN
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L33/642 , H01L33/32 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.
摘要翻译：一种制造LED封装结构的方法包括以下步骤：（A）提供T形散热块和整体材料片，其中T形散热块包括基部和从所述基座部分，并且其中所述整体材料片包括分别从所述侧框架的两个相对的内侧延伸的侧框架和一对电极引线框架; （B）在所述基部的上表面上形成绝缘层; （C）将电极引线框架设置在绝缘层上; 和（D）在所述T形散热块周围形成绝缘外框，其中所述绝缘层被包封在所述绝缘外框架中，并且所述散热块的所述基部的一部分暴露于所述绝缘外框架。因此，LED封装结构可以提高耐电压和绝缘性。

4. 发明授权

US08143633B2 LED package structure and manufacturing process thereof 失效
标题翻译： LED封装结构及其制造工艺
公开(公告)号：US08143633B2
公开(公告)日：2012-03-27
申请号：US12662727
申请日：2010-04-30
申请人： Yin-Cheng Chao , Yu-Bing Lan , Pei-Hsuan Lan , Jui-Hung Chen
发明人： Yin-Cheng Chao , Yu-Bing Lan , Pei-Hsuan Lan , Jui-Hung Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/32 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.
摘要翻译：一种制造LED封装结构的方法包括以下步骤：（A）提供T形散热块和整体材料片，其中T形散热块包括基部和从所述基座部分，并且其中所述整体材料片包括分别从所述侧框架的两个相对的内侧延伸的侧框架和一对电极引线框架; （B）在所述基部的上表面上形成绝缘层; （C）将电极引线框架设置在绝缘层上; 和（D）在所述T形散热块周围形成绝缘外框，其中所述绝缘层被包封在所述绝缘外框架中，并且所述散热块的所述基部的一部分暴露于所述绝缘外框架。因此，LED封装结构可以提高耐电压和绝缘性。

5. 发明申请

US20110121706A1 LED package structure 审中-公开
标题翻译： LED封装结构
公开(公告)号：US20110121706A1
公开(公告)日：2011-05-26
申请号：US12923995
申请日：2010-10-20
申请人： Chao-Feng Lee , Yu-Bing Lan , Yin-Cheng Chao
发明人： Chao-Feng Lee , Yu-Bing Lan , Yin-Cheng Chao
IPC分类号： H01J7/24
CPC分类号： H01L33/642 , H01L25/0753 , H01L33/50 , H01L2924/0002 , H01L2924/00
摘要： A LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and a LED module electrically connected with the positive-electrode frame and the negative-electrode frame, respectively. The heatsink slug is provided, on its surface, with a converged ladder-like recess, where the LED module is fixed on a plane deep inside the recess. Thereby, the fluorescent-colloidal-layer covering on the LED module has an increased thickness in a normal direction, making the color-lights emitted from the chips and from the fluorescent colloid in the space and in every direction able to be maintained so as to achieve a better spatial color uniformity.
摘要翻译： LED封装结构包括分别与正极框架和负极框架电连接的散热片，正极框架，负极框架和LED模块。散热片在其表面上设置有会聚的梯形凹槽，其中LED模块固定在凹陷深处的平面上。由此，覆盖在LED模块上的荧光胶体层在正常方向上具有增加的厚度，使得能够保持从空间和每个方向从芯片和荧光胶体发出的颜色光，以便保持实现更好的空间色彩均匀性。

6. 发明申请

US20100230695A1 LED package structure 审中-公开
标题翻译： LED封装结构
公开(公告)号：US20100230695A1
公开(公告)日：2010-09-16
申请号：US12656867
申请日：2010-02-18
申请人： Yu-Bing Lan , Pei-Hsuan Lan
发明人： Yu-Bing Lan , Pei-Hsuan Lan
IPC分类号： H01L33/52
CPC分类号： H01L33/56 , H01L33/507 , H01L33/54
摘要： An LED package structure includes an LED chip, an internal transparent colloidal layer, a fluorescent colloidal layer, and an external transparent colloidal layer. The internal transparent colloidal layer is interposed between the LED chip (such as a blue-light LED chip) and the fluorescent colloidal layer (such as a yellow fluorescent colloidal layer), and that the external transparent colloidal layer, in cooperation with the internal transparent colloidal layer, sandwiches and envelops the fluorescent colloidal layer so as to lower the possibility that light emitted from the LED chip may be absorbed by the LED chip itself because the light is scattered backward by particles of the fluorescent powder. This will increase overall lumen output and decrease thermal energy of the LED chip, and will as well provide a more desirable moisture insulation for the fluorescent powder.
摘要翻译： LED封装结构包括LED芯片，内部透明胶体层，荧光胶体层和外部透明胶体层。内部透明胶体层插入在LED芯片（如蓝光LED芯片）和荧光胶体层（如黄色荧光胶体层）之间，外部透明胶体层与内部透明胶体层胶体层，三明治和包围荧光胶体层，以便降低由LED芯片本身吸收的光可能被LED芯片本身吸收的可能性，因为光被荧光粉末的颗粒向后散射。这将增加总体流明输出并降低LED芯片的热能，并且还将为荧光粉提供更理想的保湿性。

7. 发明申请

US20110018449A1 AC LED device for avoiding harmonic current and flash 审中-公开
标题翻译：交流LED设备，用于避免谐波电流和闪光
公开(公告)号：US20110018449A1
公开(公告)日：2011-01-27
申请号：US12588328
申请日：2009-10-13
申请人： Pei-Hsuan Lan , Jui-Hung Chen , Jen-Hua Yang , Yu-Bing Lan
发明人： Pei-Hsuan Lan , Jui-Hung Chen , Jen-Hua Yang , Yu-Bing Lan
IPC分类号： H05B37/02
CPC分类号： H05B33/0809
摘要： An AC LED device for avoiding harmonic current and flash includes an AC power input terminal, a first AC LED group and a second AC LED group. The AC power input terminal receives an AC power including a positive half-cycle and a negative half-cycle. The first AC LED group is turned on in the positive half-cycle and turned off in the negative half-cycle. The second AC LED group is turned on in the negative half-cycle and turned off in the positive half-cycle. Each of the first AC LED group and the second AC LED group has an overall on voltage with a value lower than a peak voltage value of the AC power by a predetermined value, and an overall peak inverse voltage with a value higher than the peak voltage value of the AC power, so as to increase power factor and avoid harmonic current, thereby effectively eliminating flash problems of the AC LED.
摘要翻译：用于避免谐波电流和闪光的AC LED装置包括AC电力输入端子，第一AC LED组和第二AC LED组。交流电源输入端子接收包括正半周期和负半周期的交流电力。第一个交流LED组在正半周期打开，在负半周期关闭。第二个交流LED组在负半周期打开，在正半周期中关闭。第一AC LED组和第二AC LED组中的每一个具有的值小于AC电力的峰值电压值的总导通电压达预定值，并且具有高于峰值电压的值的总峰值反向电压交流电源的值，从而提高功率因数，避免谐波电流，从而有效消除交流LED的闪光问题。

8. 发明申请

US20100270575A1 AC LED package structure 审中-公开
标题翻译：交流LED封装结构
公开(公告)号：US20100270575A1
公开(公告)日：2010-10-28
申请号：US12588326
申请日：2009-10-13
申请人： Pei-Hsuan Lan , Jui-Hung Chen , Jen-Hua Yang , Yu-Bing Lan
发明人： Pei-Hsuan Lan , Jui-Hung Chen , Jen-Hua Yang , Yu-Bing Lan
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/48 , H01L33/641 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： An AC LED package structure includes a heat-sink slug, an AC LED module, a positive-electrode frame, a negative-electrode frame, and an insulation submount. The AC LED module is electrically connected with the positive-electrode frame and the negative-electrode frame, respectively. The insulation submount is interposed between the AC LED module and the heat-sink slug. The insulation submount is characterized by having a voltage-resistance value greater than 1000 volts. Therefore, it is possible to prevent the AC LED chip of an AC LED device from being broken through by high voltage, causing an electric shock if a human body touches the AC LED device. And moreover, the AC LED device can satisfy the requirements of a certified safety specification.
摘要翻译： AC LED封装结构包括散热片，AC LED模块，正极框架，负极框架和绝缘底座。 AC LED模块分别与正极框架和负极框架电连接。绝缘子安装座位于AC LED模块和散热片之间。绝缘子座的特征在于具有大于1000伏的电压值。因此，可以防止AC LED装置的AC LED芯片被高电压破坏，如果人体接触到AC LED装置，则会发生触电。此外，AC LED设备可以满足认证安全规范的要求。

9. 发明申请

US20110121328A1 LED package structure 失效
标题翻译： LED封装结构
公开(公告)号：US20110121328A1
公开(公告)日：2011-05-26
申请号：US12662819
申请日：2010-05-05
申请人： Pei-Hsuan Lan , Yu-Bing Lan
发明人： Pei-Hsuan Lan , Yu-Bing Lan
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/8592 , H01L2924/00 , H01L2924/00014
摘要： An LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and an LED module electrically connected with the positive-electrode frame and the negative-electrode frame. The LED module includes a plurality of LED chips. The heatsink slug is provided, at its surface, with a plurality of cup-like recesses. The plural LED chips are each bonded, correspondingly, on a plane in the cup-like recess. Each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex contour. As a result, a specific proportion for the color lights emitted from all the LED chips and from the fluorescent material in every direction of a space can be maintained, and that a better spatial color uniformity can be achieved.
摘要翻译： LED封装结构包括与正极框架和负极框架电连接的散热片，正极框架，负极框架和LED模块。 LED模块包括多个LED芯片。散热片在其表面上设置有多个杯状凹部。相应地，多个LED芯片在杯状凹部中的平面上相互粘合。每个LED芯片被具有弯曲和凸形轮廓的荧光胶体层覆盖。结果，可以保持从所有LED芯片和从空间的每个方向上的荧光材料发射的颜色光的特定比例，并且可以实现更好的空间颜色均匀性。

10. 发明申请

US20110024720A1 High-efficiency LED 审中-公开
标题翻译：高效率LED
公开(公告)号：US20110024720A1
公开(公告)日：2011-02-03
申请号：US12588129
申请日：2009-10-06
申请人： Jui-Hung Chen , Pei-Hsuan Lan , Yu-Bing Lan
发明人： Jui-Hung Chen , Pei-Hsuan Lan , Yu-Bing Lan
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L2933/0091
摘要： A high-efficiency LED includes: a substrate, an epitaxial layer structure, a cathode, an anode, a transparent sealing compound and a polyimide layer. The polyimide layer covers surfaces of the epitaxial layer structure and the substrate. The transparent sealing compound covers the polyimide layer, the substrate, the epitaxial layer structure, the cathode and the anode. The polyimide layer of the present invention has a refractive index higher than that of packaging materials in prior art, so as to reduce total internal reflection and optical consumption caused by light scattered from the epitaxial layer structure and the transparent sealing compound.
摘要翻译：高效率LED包括：基板，外延层结构，阴极，阳极，透明密封化合物和聚酰亚胺层。聚酰亚胺层覆盖外延层结构和基板的表面。透明密封化合物覆盖聚酰亚胺层，基板，外延层结构，阴极和阳极。本发明的聚酰亚胺层的折射率比现有技术中的包装材料的折射率高，从而降低由外延层结构和透明密封化合物散射的光引起的全内反射和光消耗。

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