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1. 发明授权

US09099569B2 MEMS microphone 有权
标题翻译： MEMS麦克风
公开(公告)号：US09099569B2
公开(公告)日：2015-08-04
申请号：US14261633
申请日：2014-04-25
申请人： BSE CO., LTD.
发明人： Sang Ho Lee , Yong Hyun Shim
IPC分类号： H01L29/84 , H04R19/04 , B81B3/00 , B81B7/00
CPC分类号： H01L29/84 , B81B3/0021 , B81B7/0032 , B81B7/0035 , B81B7/0061 , H04R1/086 , H04R1/2807 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2499/11
摘要： A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.
摘要翻译：微机电系统（MEMS）麦克风包括：印刷电路基板; 与印刷电路基板结合并具有MEMS内部空间的MEMS芯片; 以及与印刷电路基板结合的情况，容纳MEMS芯片，并且形成与外部空间分离的内部空间，其中壳体是包括内壳体和外壳体的双重情况，介质在内壳和外壳之间形成声路空间，并且印刷电路基板包括将介质声路空间连接到MEMS芯片的MEMS内部空间的基板声道，使得通过声孔的外部声音进入 MEMS芯片的MEMS内部空间通过介质声道空间。

2. 发明授权

US08519492B2 Silicon condenser microphone having an additional back chamber and a fabrication method therefor 失效
标题翻译：具有附加后室的硅电容麦克风及其制造方法
公开(公告)号：US08519492B2
公开(公告)日：2013-08-27
申请号：US13143585
申请日：2010-02-11
申请人： Chung-Dam Song
发明人： Chung-Dam Song
IPC分类号： H01L29/84
CPC分类号： H04R19/04 , H01L2924/16152 , H04R31/00 , H04R2410/03 , H04R2499/11
摘要： A fabrication method of a silicon condenser microphone having an additional back chamber. The method includes applying an adhesive on a substrate and mounting a chamber container thereon by using a mounter; curing the adhesive holding the chamber container; applying an adhesive on the chamber container and mounting a micro electro mechanical system (MEMS) chip thereon by using a mounter; curing the adhesive holding the MEMS chip; and attaching the substrate on which devices are mounted to a case, wherein a back chamber formed by the chamber container is added to a back chamber of the MEMS chip. Therefore, a silicon condenser microphone fabricated by using the method may have improved sensitivity by increasing the small back chamber space of the a micro electro mechanical system (MEMS) chip itself and reduced noise including total harmonic distortion (THD).
摘要翻译：具有附加后室的硅电容麦克风的制造方法。该方法包括将粘合剂施加在基底上并通过使用安装器将腔室容器安装在其上; 固化保持室容器的粘合剂; 在室容器上施加粘合剂并通过使用安装器在其上安装微机电系统（MEMS）芯片; 固化保持MEMS芯片的粘合剂; 以及将其上安装有装置的基板附接到壳体，其中由所述室容器形成的后室被添加到所述MEMS芯片的后室中。因此，通过使用该方法制造的硅电容式麦克风可以通过增加微机电系统（MEMS）芯片本身的小的后室空间和包括总谐波失真（THD）在内的降低的噪声来提高灵敏度。

3. 发明申请

US20130010995A1 WELDING TYPE CONDENSER MICROPHONE USING SPRING BASE 审中-公开
标题翻译：使用弹簧基座的焊接式冷凝器麦克风
公开(公告)号：US20130010995A1
公开(公告)日：2013-01-10
申请号：US13493333
申请日：2012-06-11
申请人： Hyoung Joo KIM , Chang Won KIM , Myung Hoon HAM
发明人： Hyoung Joo KIM , Chang Won KIM , Myung Hoon HAM
IPC分类号： H04R19/04
CPC分类号： H04R19/016
摘要： A welding type condenser microphone using a spring base to prevent interferences due to deviations of thicknesses of components, wherein a second base is an elastic spring. The welding type condenser microphone includes a case sub-assembly, in which a diaphragm and a back plate face each other across a spacer in a metal case and the back plate is insulated from the case by a first base formed of an insulation material; a printed circuit board (PCB) sub-assembly, in which circuit devices and a second base, which is an elastic spring, are mounted on a PCB via a surface mounting technology (SMT) method; and a unit for attaching the case sub-assembly and the PCB sub-assembly to each other. Furthermore, the second base is a leaf spring that is bent once, a U-shaped leaf spring having wings, or a coil spring.
摘要翻译：一种使用弹簧座的焊接式电容麦克风，用于防止由于部件的厚度偏差引起的干扰，其中第二基座是弹性弹簧。焊接式电容麦克风包括壳体子组件，其中隔膜和后板跨过金属壳体中的间隔件彼此面对，并且后板通过由绝缘材料形成的第一基座与壳体绝缘; 印刷电路板（PCB）子组件，其中作为弹性弹簧的电路装置和第二基座通过表面安装技术（SMT）方法安装在PCB上; 以及用于将壳体子组件和PCB子组件彼此附接的单元。此外，第二基座是弯曲一次的板簧，具有翼的U形板簧或螺旋弹簧。

4. 发明申请

US20110274308A1 MULTIFUNCTIONAL MICRO SPEAKER 审中-公开
标题翻译：多功能微型扬声器
公开(公告)号：US20110274308A1
公开(公告)日：2011-11-10
申请号：US13143588
申请日：2009-08-31
申请人： Sung-Hwan Doh , Jae-Kyung Song , Jin-Hyuk Hong
发明人： Sung-Hwan Doh , Jae-Kyung Song , Jin-Hyuk Hong
IPC分类号： H04R11/02
CPC分类号： H04R9/06
摘要： A multifunctional micro speaker including a frame; a diaphragm having an outer circumference portion fixed to the frame; a voice coil fixed to a lower surface of the diaphragm; a suspension fixed to the frame and having a predetermined elasticity; a yoke fixed to the suspension and including a receiving groove having a concave shape; a permanent magnet fixed to a bottom surface of the receiving groove; and a plate fixed to an upper surface of the permanent magnet, wherein a through hole is vertically formed through a central portion of a magnetic circuit including the yoke, the permanent magnet and the plate. The multifunctional micro speaker includes the through hole formed in a magnetic circuit, and thus, a vibration displacement of the magnetic circuit and a damping coefficient of the diaphragm may be controlled.
摘要翻译：一种多功能微型扬声器，包括一个框架; 隔膜，其具有固定到所述框架的外周部分; 固定在隔膜的下表面的音圈; 固定在框架上并具有预定弹性的悬架; 固定在所述悬架上并且包括具有凹形形状的接收槽的轭; 固定到所述接收槽的底面的永磁体; 以及固定在所述永久磁铁的上表面上的板，其特征在于，通过包括所述轭，所述永久磁铁和所述板的磁路的中心部分垂直地形成通孔。多功能微型扬声器包括形成在磁路中的通孔，因此可以控制磁路的振动位移和隔膜的阻尼系数。

5. 发明申请

US20110243367A1 MULTIFUNCTIONAL MICRO SPEAKER 审中-公开
标题翻译：多功能微型扬声器
公开(公告)号：US20110243367A1
公开(公告)日：2011-10-06
申请号：US13133191
申请日：2009-08-31
申请人： Han-Ryang Lee , Chung-Dam Song
发明人： Han-Ryang Lee , Chung-Dam Song
IPC分类号： H04R1/00
CPC分类号： H04R9/066 , H04R9/063 , H04R2209/026 , H04R2209/027 , H04R2400/03 , H04R2400/07 , H04R2499/11
摘要： A multifunctional micro speaker including a frame; a diaphragm having an outer circumferential portion fixed to the frame; a voice coil fixed to a lower surface of the diaphragm; a first member having one side fixed to the frame and having a predetermined elasticity; a yoke fixed to the first member and comprising a receiving groove; a first permanent magnet fixed to a bottom surface of the receiving groove; a plate fixed to an upper surface of the first permanent magnet; a second member having one side fixed to the frame, spaced apart from the first member in a downwards direction and having a predetermined elasticity; and a second magnet fixed to the second member and spaced apart from the first member and the yoke.
摘要翻译：一种多功能微型扬声器，包括一个框架; 隔膜，其外周部固定在框架上; 固定在隔膜的下表面的音圈; 第一构件，其一侧固定到框架并具有预定的弹性; 轭固定到第一构件并包括容纳槽; 固定到所述接收槽的底面的第一永磁体; 固定到所述第一永磁体的上表面的板; 第二构件，其一侧固定到框架，与第一构件沿向下的方向间隔开并具有预定的弹性; 以及固定到所述第二构件并与所述第一构件和所述轭隔开的第二磁体。

6. 外观设计

USD518478S1 Condenser microphone 有权
公开(公告)号：USD518478S1
公开(公告)日：2006-04-04
申请号：US29224786
申请日：2005-03-07
申请人： Chung Dam Song
设计人： Chung Dam Song

7. 发明申请

US20130136291A1 MEMS MICROPHONE 失效
标题翻译： MEMS麦克风
公开(公告)号：US20130136291A1
公开(公告)日：2013-05-30
申请号：US13494336
申请日：2012-06-12
申请人： Sang Ho LEE , Yong Hyun SHIM
发明人： Sang Ho LEE , Yong Hyun SHIM
IPC分类号： H04R19/04
CPC分类号： H04R19/005
摘要： A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.
摘要翻译： MEMS麦克风包括具有侧壁，顶壁和开口底部的壳体; 一个PCB连接到壳体的底部; MEMS芯片，其布置在PCB上并且包括内部MEMS空间; 以及至少一个通过壳体的表面形成的用于引入外部声音的声孔，其中形成声孔和内部MEMS空间彼此连通的声道的内部通信单元布置在壳体内部通过声孔引入的外部声音穿过声音路径并进入内部MEMS空间。

8. 发明授权

US08126166B2 Condenser microphone and packaging method for the same 有权
标题翻译：冷凝器麦克风和包装方法相同
公开(公告)号：US08126166B2
公开(公告)日：2012-02-28
申请号：US11519551
申请日：2006-09-12
申请人： Chung Dam Song
发明人： Chung Dam Song
IPC分类号： H04R25/00
CPC分类号： H04R31/006 , H01L2924/16151 , H01L2924/16152 , H04R1/06 , H04R19/04
摘要： Disclosed is a silicone based condenser microphone comprising: a metal case which includes a sound hole, a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for joining with the metal case. A fixing material for fixing the metal case to the board, and an adhesive for applying to the whole part where the metal case fixed to the board by the fixing material is joined with the board to bond the metal case to the board. Therefore, the metal case is tack-welded to the board by a laser to fix the case to the board and then the case is bonded to the board with the adhesive, thereby decreasing an inferiority ratio and strengthening a joining force and thus enhancing a mechanical firmness and highly resisting noise from the outside.
摘要翻译：本发明公开了一种有机硅电容式麦克风，包括：金属外壳，包括声孔，安装有MEMS麦克风芯片的板和具有电压泵和缓冲IC的ASIC芯片，并形成有用于连接的连接图案与金属外壳。用于将金属壳体固定到板上的固定材料和用于施加到通过固定材料固定到板的金属壳体的整个部分的粘合剂与板接合以将金属壳体接合到板上。因此，通过激光将金属壳体固定在基板上，将壳体固定在基板上，然后利用粘合剂将壳体粘合到基板上，从而降低不良率并加强接合力，从而增强机械坚固耐用和高度抵抗外界的噪音。

9. 发明申请

US20110272769A1 MEMS MICROPHONE PACKAGE AND PACKAGING METHOD 审中-公开
标题翻译： MEMS麦克风包装和包装方法
公开(公告)号：US20110272769A1
公开(公告)日：2011-11-10
申请号：US13144587
申请日：2010-02-11
申请人： Chung-Dam Song , Chang-Won Kim , Jung-Min Kim , Won-Taek Lee , Sung-Ho Park
发明人： Chung-Dam Song , Chang-Won Kim , Jung-Min Kim , Won-Taek Lee , Sung-Ho Park
IPC分类号： H01L29/84 , H01L21/58
CPC分类号： H04R19/005 , B81B7/0061 , B81B2201/0257 , H04R19/04 , H04R31/00
摘要： A MEMS microphone package having improved acoustic properties, and to a packaging method, which involve adding a vent path in the packaging process to improve equilibrium between internal and external air pressure. The MEMS microphone package includes a MEMS microphone chip, in which a back plate and a diaphragm structure are formed in a body by using MEMS process techniques; a substrate for mounting the MEMS microphone chip thereon; a vent path which is formed between the MEMS microphone chip and the substrate by applying an adhesive only to a portion of the substrate and adhering the MEMS microphone chip to the substrate; and a case which is adhered to the substrate and forms a space for accommodating the MEMS microphone chip, wherein acoustic properties of the MEMS microphone package are improved as air pressure inside the MEMS microphone chip and air pressure outside the MEMS microphone chip form air equilibrium via the vent path.
摘要翻译：具有改进的声学性质的MEMS麦克风封装以及包装方法，其包括在包装过程中增加通气路径以改善内部和外部空气压力之间的平衡。 MEMS麦克风封装包括MEMS麦克风芯片，其中通过使用MEMS工艺技术在主体中形成背板和隔膜结构; 用于在其上安装MEMS麦克风芯片的基板; 通过将粘合剂仅施加到基板的一部分并将MEMS麦克风芯片粘附到基板上而形成在MEMS麦克风芯片和基板之间的通气路径; 以及附着在基板上并形成用于容纳MEMS麦克风芯片的空间的壳体，其中MEMS麦克风封装的声学特性随着MEMS麦克风芯片内部的气压和MEMS麦克风芯片之外的气压而形成空气平衡通风道。

10. 发明申请

US20110255732A1 MULTIFUNCTIONAL MICRO SPEAKER 审中-公开
标题翻译：多功能微型扬声器
公开(公告)号：US20110255732A1
公开(公告)日：2011-10-20
申请号：US13140966
申请日：2009-11-04
申请人： Cheol-Young Kwon , Sang-Ho Lee , Hong-Kyu Jang
发明人： Cheol-Young Kwon , Sang-Ho Lee , Hong-Kyu Jang
IPC分类号： H04R9/06
CPC分类号： H04R11/04 , H04R9/06 , H04R2400/03 , H04R2400/07
摘要： A multifunctional micro speaker including a frame; a diaphragm having an outer circumferential portion fixed to the frame; a voice coil fixed to a lower surface of the diaphragm; a first suspension having an outer circumferential portion fixed to the frame and having a predetermined elasticity; a yoke fixed to the first suspension; a first permanent magnet fixed to a bottom surface of the yoke; a plate fixed to an upper surface of the first permanent magnet; a second suspension including a supporter and a protrusion, and having a predetermined elasticity, wherein the supporter is spaced apart from the first suspension in a downwards direction and has a first end portion fixed to the frame, and the protrusion protrudes from the supporter towards the first suspension; and a second magnet accommodated in the protrusion and fixed to a lower surface of the second suspension.
摘要翻译：一种多功能微型扬声器，包括一个框架; 隔膜，其外周部固定在框架上; 固定在隔膜的下表面的音圈; 第一悬架，其具有固定到所述框架并具有预定弹性的外周部; 固定在第一悬架上的轭; 固定到所述轭的底表面的第一永磁体; 固定到所述第一永磁体的上表面的板; 第二悬架，其包括支撑件和突起，并且具有预定的弹性，其中所述支撑件沿着向下的方向与所述第一悬架间隔开，并且具有固定到所述框架的第一端部，并且所述突起从所述支撑件朝向第一次暂停; 以及容纳在所述突起中并固定到所述第二悬架的下表面的第二磁体。

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