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1. 发明授权

US08750550B2 MEMS microphone 失效
标题翻译： MEMS麦克风
公开(公告)号：US08750550B2
公开(公告)日：2014-06-10
申请号：US13494336
申请日：2012-06-12
申请人： Sang Ho Lee , Yong Hyun Shim
发明人： Sang Ho Lee , Yong Hyun Shim
IPC分类号： H04R9/08 , H04R1/20
CPC分类号： H04R19/005
摘要： A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.
摘要翻译： MEMS麦克风包括具有侧壁，顶壁和开口底部的壳体; 一个PCB连接到壳体的底部; MEMS芯片，其布置在PCB上并且包括内部MEMS空间; 以及至少一个通过壳体的表面形成的用于引入外部声音的声孔，其中形成声孔和内部MEMS空间彼此连通的声道的内部通信单元布置在壳体内部通过声孔引入的外部声音穿过声音路径并进入内部MEMS空间。

2. 发明申请

US20080083111A1 Apparatus and method of producing a microphone assembly 审中-公开
标题翻译：制造麦克风组件的装置和方法
公开(公告)号：US20080083111A1
公开(公告)日：2008-04-10
申请号：US11899140
申请日：2007-09-04
申请人： Yong Hyun Shim
发明人： Yong Hyun Shim
IPC分类号： H01S4/00
CPC分类号： H04R31/006 , H04R19/016 , Y10T29/49002 , Y10T29/5313 , Y10T29/53174
摘要： A microphone assembly is provided. An apparatus for fabricating the microphone assembly includes a lower mold attached to a bottom surface of a printed circuit board (PCB) on which a microphone chip is mounted, an upper mold installed on the PCB and including receiving spaces receiving the microphone chips and an inlet for injecting a material; and a material injector movably installed with respect to the inlet to inject epoxy or silicone into the receiving spaces of the upper mold. A method for fabricating the microphone phone includes mounting microphone chips, installing the mold, injecting the material, and cutting the PCB and producing the microphone assembly. The microphone assembly is fabricated in a transfer molding process or an injection molding process using a mold to reduce the processing time needed for fabricating the microphone and fabricating high quality microphones due to improvements in workability and productivity.
摘要翻译：提供麦克风组件。一种用于制造麦克风组件的装置，包括一个附着在其上安装麦克风芯片的印刷电路板（PCB）的底表面上的下模具，安装在PCB上的上模具，并包括接收麦克风芯片的接收空间和一个入口用于注射材料; 以及相对于入口可移动地安装的材料注射器，以将环氧树脂或硅树脂注入到上模的接收空间中。一种用于制造麦克风电话的方法包括安装麦克风芯片，安装模具，注入材料，以及切割PCB并生产麦克风组件。麦克风组件采用传递模制工艺或使用模具的注射成型工艺制造，以减少制造麦克风所需的处理时间并且由于可操作性和生产率的改进而制造高质量麦克风。

3. 发明申请

US20130136291A1 MEMS MICROPHONE 失效
标题翻译： MEMS麦克风
公开(公告)号：US20130136291A1
公开(公告)日：2013-05-30
申请号：US13494336
申请日：2012-06-12
申请人： Sang Ho LEE , Yong Hyun SHIM
发明人： Sang Ho LEE , Yong Hyun SHIM
IPC分类号： H04R19/04
CPC分类号： H04R19/005
摘要： A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.
摘要翻译： MEMS麦克风包括具有侧壁，顶壁和开口底部的壳体; 一个PCB连接到壳体的底部; MEMS芯片，其布置在PCB上并且包括内部MEMS空间; 以及至少一个通过壳体的表面形成的用于引入外部声音的声孔，其中形成声孔和内部MEMS空间彼此连通的声道的内部通信单元布置在壳体内部通过声孔引入的外部声音穿过声音路径并进入内部MEMS空间。

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