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1. 发明授权

US08126166B2 Condenser microphone and packaging method for the same 有权
标题翻译：冷凝器麦克风和包装方法相同
公开(公告)号：US08126166B2
公开(公告)日：2012-02-28
申请号：US11519551
申请日：2006-09-12
申请人： Chung Dam Song
发明人： Chung Dam Song
IPC分类号： H04R25/00
CPC分类号： H04R31/006 , H01L2924/16151 , H01L2924/16152 , H04R1/06 , H04R19/04
摘要： Disclosed is a silicone based condenser microphone comprising: a metal case which includes a sound hole, a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for joining with the metal case. A fixing material for fixing the metal case to the board, and an adhesive for applying to the whole part where the metal case fixed to the board by the fixing material is joined with the board to bond the metal case to the board. Therefore, the metal case is tack-welded to the board by a laser to fix the case to the board and then the case is bonded to the board with the adhesive, thereby decreasing an inferiority ratio and strengthening a joining force and thus enhancing a mechanical firmness and highly resisting noise from the outside.
摘要翻译：本发明公开了一种有机硅电容式麦克风，包括：金属外壳，包括声孔，安装有MEMS麦克风芯片的板和具有电压泵和缓冲IC的ASIC芯片，并形成有用于连接的连接图案与金属外壳。用于将金属壳体固定到板上的固定材料和用于施加到通过固定材料固定到板的金属壳体的整个部分的粘合剂与板接合以将金属壳体接合到板上。因此，通过激光将金属壳体固定在基板上，将壳体固定在基板上，然后利用粘合剂将壳体粘合到基板上，从而降低不良率并加强接合力，从而增强机械坚固耐用和高度抵抗外界的噪音。

2. 发明申请

US20110272769A1 MEMS MICROPHONE PACKAGE AND PACKAGING METHOD 审中-公开
标题翻译： MEMS麦克风包装和包装方法
公开(公告)号：US20110272769A1
公开(公告)日：2011-11-10
申请号：US13144587
申请日：2010-02-11
申请人： Chung-Dam Song , Chang-Won Kim , Jung-Min Kim , Won-Taek Lee , Sung-Ho Park
发明人： Chung-Dam Song , Chang-Won Kim , Jung-Min Kim , Won-Taek Lee , Sung-Ho Park
IPC分类号： H01L29/84 , H01L21/58
CPC分类号： H04R19/005 , B81B7/0061 , B81B2201/0257 , H04R19/04 , H04R31/00
摘要： A MEMS microphone package having improved acoustic properties, and to a packaging method, which involve adding a vent path in the packaging process to improve equilibrium between internal and external air pressure. The MEMS microphone package includes a MEMS microphone chip, in which a back plate and a diaphragm structure are formed in a body by using MEMS process techniques; a substrate for mounting the MEMS microphone chip thereon; a vent path which is formed between the MEMS microphone chip and the substrate by applying an adhesive only to a portion of the substrate and adhering the MEMS microphone chip to the substrate; and a case which is adhered to the substrate and forms a space for accommodating the MEMS microphone chip, wherein acoustic properties of the MEMS microphone package are improved as air pressure inside the MEMS microphone chip and air pressure outside the MEMS microphone chip form air equilibrium via the vent path.
摘要翻译：具有改进的声学性质的MEMS麦克风封装以及包装方法，其包括在包装过程中增加通气路径以改善内部和外部空气压力之间的平衡。 MEMS麦克风封装包括MEMS麦克风芯片，其中通过使用MEMS工艺技术在主体中形成背板和隔膜结构; 用于在其上安装MEMS麦克风芯片的基板; 通过将粘合剂仅施加到基板的一部分并将MEMS麦克风芯片粘附到基板上而形成在MEMS麦克风芯片和基板之间的通气路径; 以及附着在基板上并形成用于容纳MEMS麦克风芯片的空间的壳体，其中MEMS麦克风封装的声学特性随着MEMS麦克风芯片内部的气压和MEMS麦克风芯片之外的气压而形成空气平衡通风道。

3. 发明申请

US20110002495A1 METHOD OF MAKING SOUND HOLE IN CASE OF CONDENSER MICROPHONE AND THE CONDENSER MICROPHONE CASE 失效
标题翻译：冷凝器麦克风和冷凝器麦克风的情况下制作声孔的方法
公开(公告)号：US20110002495A1
公开(公告)日：2011-01-06
申请号：US12637284
申请日：2009-12-14
申请人： CHUNG-DAM SONG
发明人： CHUNG-DAM SONG
IPC分类号： H04R9/08
CPC分类号： H04R19/04 , H04R1/086 , Y10T29/49005
摘要： Provided are a method of forming a sound hole in a condenser microphone case that prevents foreign substances from being thrown to improve reliability and the condenser microphone case. The method of forming the sound hole in the condenser microphone case includes cutting a portion of a bottom surface of a metal case in the cylindrical metal case having an opened side to mount components for a microphone, and simultaneously, pressing the cut portion to form a sound hole having a gap shape at the cut portion.
摘要翻译：提供一种在电容麦克风盒中形成声孔的方法，其防止异物被抛出以提高可靠性和电容麦克风外壳。在电容麦克风盒中形成声孔的方法包括在具有开口侧的圆筒形金属外壳中切割金属外壳的底面的一部分以安装用于麦克风的部件，同时按压切割部分形成在切割部分具有间隙形状的声孔。

4. 发明授权

US07233674B2 Integrated base and electret condenser microphone using the same 失效
标题翻译：集成基座和驻极体电容麦克风使用相同
公开(公告)号：US07233674B2
公开(公告)日：2007-06-19
申请号：US10847544
申请日：2004-05-18
申请人： Chung Dam Song
发明人： Chung Dam Song
IPC分类号： H04R19/01
CPC分类号： H04R31/006 , H04R19/016
摘要： An electret condenser microphone includes a case, a diaphragm electrically connected to the case, a fixed electrode plate disposed opposing the diaphragm with a spacer interposed therebetween, the fixed electrode plate being formed of a metal plate coated with a polymer film on which an electret is formed, an insulating ring for insulating the fixed electrode plate from the case, a printed circuit board (PCB) defining a back chamber with the fixed electrode plate, and an integrated base for supporting the fixed electrode plate and the PCB and electrically connecting the fixed electrode plate to the circuit component embedded in the PCB through a connecting terminal. The integrated base includes a hollow cylindrical insulating body and metal plating layers formed on the top and bottom of the insulating body. Outer diameters of the metal plating layers are less than the insulating body and are electrically connected by a conductor.
摘要翻译：驻极体电容麦克风包括壳体，电连接到壳体的隔膜，与隔膜相对设置的固定电极板，隔着隔板插入其间，固定电极板由涂覆有聚合物膜的金属板形成，驻极体为形成有用于将固定电极板与壳体绝缘的绝缘环，限定具有固定电极板的后室的印刷电路板（PCB），以及用于支撑固定电极板和PCB并将固定电极板电极板通过连接端子嵌入PCB中的电路部件。集成基座包括中空圆柱形绝缘体和形成在绝缘体的顶部和底部的金属电镀层。金属镀层的外径小于绝缘体，并通过导体电连接。

5. 发明申请

US20060256981A1 Condenser microphone employing wide band stop filter and having improved resistance to electrostatic discharge 失效
标题翻译：采用宽带阻滤波器的冷凝器麦克风具有改进的静电放电阻力
公开(公告)号：US20060256981A1
公开(公告)日：2006-11-16
申请号：US10550170
申请日：2003-06-10
申请人： Chung-Dam Song , Eek-Joo Chung , Hyun-Ho Kim
发明人： Chung-Dam Song , Eek-Joo Chung , Hyun-Ho Kim
IPC分类号： H04R3/00
CPC分类号： H04R19/04 , H04R3/007
摘要： A condenser microphone employs a wide band stop filter, having improved resistance to electrostatic discharge. This includes providing a condenser microphone used for a multi-band by comprising a wide band stop filter capable of efficiently blocking a wide band signal including low frequency and radio frequency used in a mobile communication. A condenser microphone includes: an acoustic module for converting sound pressure into an electric signal; an FET for amplifying the electric signal; and a wide band stop filter for blocking a wide band signal including low frequency and radio frequency output from the FET. The filter is realized by resistors and/or capacitors which are connected selectively according to the radio frequency band between the drain and the source of the FET. The range capable of removing EM noise is widened, an excellent filtering effect of noise is obtained, and resistance of electrostatic discharge applied from outside is improved.
摘要翻译：电容麦克风采用宽带阻滤波器，具有改进的抗静电放电性能。这包括提供一种用于多频带的电容式麦克风，其包括能够有效地阻挡包括在移动通信中使用的低频和射频的宽带信号的宽带阻止滤波器。电容麦克风包括：用于将声压转换成电信号的声学模块; 用于放大电信号的FET; 以及用于阻挡包括从FET输出的低频和射频的宽带信号的宽带阻带滤波器。滤波器由根据FET的漏极和源极之间的射频频率选择性地连接的电阻器和/或电容器来实现。能够消除EM噪声的范围变宽，可以获得良好的噪声滤波效果，提高了从外部施加的静电放电电阻。

6. 发明授权

US06552754B1 Laser video projector using optical pumping valve 失效
标题翻译：激光视频投影机使用光泵阀
公开(公告)号：US06552754B1
公开(公告)日：2003-04-22
申请号：US09457583
申请日：1999-12-09
申请人： Chung Dam Song , Sang Mook Kim
发明人： Chung Dam Song , Sang Mook Kim
IPC分类号： H04N931
CPC分类号： H04N9/3129
摘要： A laser video projector using an optical pumping valve is provided. The video projector according to the present invention forms an image using an optical pumping valve including a laser resonator for resonating light of a certain wavelength, an optical pumping source for performing pumping so that the laser resonator can generate a laser beam, and an optical valve for filtering the laser beam emitted from the laser resonator so that the filtered laser beam forms a picture instead of a cathode ray tube (CRT).
摘要翻译：提供了使用光泵阀的激光视频投影仪。根据本发明的视频投影仪使用包括用于谐振一定波长的光的激光谐振器的光泵阀，用于执行泵浦的激光源，使得激光谐振器能够产生激光束并且形成光阀用于对从激光谐振器发射的激光束进行滤波，使得滤波的激光束形成图像而不是阴极射线管（CRT）。

7. 发明授权

US06518698B1 Semiconductor laser cathode ray tube for driving at room temperature 失效
标题翻译：半导体激光阴极射线管，用于室温驱动
公开(公告)号：US06518698B1
公开(公告)日：2003-02-11
申请号：US09545186
申请日：2000-04-07
申请人： Chung-dam Song , Sang-kyun Kim , Sang-muk Kim , Young-woo Song , Moon-gueon Kim , Duk-sung Park , Jong-sig Choi
发明人： Chung-dam Song , Sang-kyun Kim , Sang-muk Kim , Young-woo Song , Moon-gueon Kim , Duk-sung Park , Jong-sig Choi
IPC分类号： H01J2910
CPC分类号： H01S3/0959 , H01J31/10
摘要： A semiconductor laser CRT for driving at room temperature, whose target is pumped by an electron beam, in which a laser target is fixed to a beaker-shaped transparent glass support plate, and the glass support plate is sealed with a glass bulb using fused frit glass. Accordingly, there is no cracking of the glass bulb due to a difference in thermal expansion or destroying of a sustained airtight vacuum.
摘要翻译：一种用于在室温下驱动的半导体激光器CRT，其靶被电子束泵浦，其中激光靶固定到烧杯状透明玻璃支撑板上，玻璃支撑板用玻璃泡密封，使用熔融玻璃料玻璃。因此，由于持续气密真空的热膨胀或破坏的差异，玻璃灯泡不会破裂。

8. 发明授权

US08519492B2 Silicon condenser microphone having an additional back chamber and a fabrication method therefor 失效
标题翻译：具有附加后室的硅电容麦克风及其制造方法
公开(公告)号：US08519492B2
公开(公告)日：2013-08-27
申请号：US13143585
申请日：2010-02-11
申请人： Chung-Dam Song
发明人： Chung-Dam Song
IPC分类号： H01L29/84
CPC分类号： H04R19/04 , H01L2924/16152 , H04R31/00 , H04R2410/03 , H04R2499/11
摘要： A fabrication method of a silicon condenser microphone having an additional back chamber. The method includes applying an adhesive on a substrate and mounting a chamber container thereon by using a mounter; curing the adhesive holding the chamber container; applying an adhesive on the chamber container and mounting a micro electro mechanical system (MEMS) chip thereon by using a mounter; curing the adhesive holding the MEMS chip; and attaching the substrate on which devices are mounted to a case, wherein a back chamber formed by the chamber container is added to a back chamber of the MEMS chip. Therefore, a silicon condenser microphone fabricated by using the method may have improved sensitivity by increasing the small back chamber space of the a micro electro mechanical system (MEMS) chip itself and reduced noise including total harmonic distortion (THD).
摘要翻译：具有附加后室的硅电容麦克风的制造方法。该方法包括将粘合剂施加在基底上并通过使用安装器将腔室容器安装在其上; 固化保持室容器的粘合剂; 在室容器上施加粘合剂并通过使用安装器在其上安装微机电系统（MEMS）芯片; 固化保持MEMS芯片的粘合剂; 以及将其上安装有装置的基板附接到壳体，其中由所述室容器形成的后室被添加到所述MEMS芯片的后室中。因此，通过使用该方法制造的硅电容式麦克风可以通过增加微机电系统（MEMS）芯片本身的小的后室空间和包括总谐波失真（THD）在内的降低的噪声来提高灵敏度。

9. 发明申请

US20110243367A1 MULTIFUNCTIONAL MICRO SPEAKER 审中-公开
标题翻译：多功能微型扬声器
公开(公告)号：US20110243367A1
公开(公告)日：2011-10-06
申请号：US13133191
申请日：2009-08-31
申请人： Han-Ryang Lee , Chung-Dam Song
发明人： Han-Ryang Lee , Chung-Dam Song
IPC分类号： H04R1/00
CPC分类号： H04R9/066 , H04R9/063 , H04R2209/026 , H04R2209/027 , H04R2400/03 , H04R2400/07 , H04R2499/11
摘要： A multifunctional micro speaker including a frame; a diaphragm having an outer circumferential portion fixed to the frame; a voice coil fixed to a lower surface of the diaphragm; a first member having one side fixed to the frame and having a predetermined elasticity; a yoke fixed to the first member and comprising a receiving groove; a first permanent magnet fixed to a bottom surface of the receiving groove; a plate fixed to an upper surface of the first permanent magnet; a second member having one side fixed to the frame, spaced apart from the first member in a downwards direction and having a predetermined elasticity; and a second magnet fixed to the second member and spaced apart from the first member and the yoke.
摘要翻译：一种多功能微型扬声器，包括一个框架; 隔膜，其外周部固定在框架上; 固定在隔膜的下表面的音圈; 第一构件，其一侧固定到框架并具有预定的弹性; 轭固定到第一构件并包括容纳槽; 固定到所述接收槽的底面的第一永磁体; 固定到所述第一永磁体的上表面的板; 第二构件，其一侧固定到框架，与第一构件沿向下的方向间隔开并具有预定的弹性; 以及固定到所述第二构件并与所述第一构件和所述轭隔开的第二磁体。

10. 发明申请

US20090116669A1 MEMS MICROPHONE PACKAGE HAVING SOUND HOLE IN PCB 失效
标题翻译： MEMS麦克风包装在PCB中有声孔
公开(公告)号：US20090116669A1
公开(公告)日：2009-05-07
申请号：US12249343
申请日：2008-10-10
申请人： Chung Dam SONG
发明人： Chung Dam SONG
IPC分类号： H04R17/02
CPC分类号： H04R19/04 , B81B7/0064 , B81B2201/0257 , H04R19/005
摘要： Provided is a MEMS microphone package having a sound hole in a PCB, which can ground-connect a metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a printed circuit board (PCB) substrate to which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB substrate being inserted into the metal case and having a sound hole for introducing an external sound, and a support configured to support the PCB substrate in the curling operation and define a space between the metal case and the PCB substrate.
摘要翻译：提供了一种MEMS麦克风封装，其在PCB中具有声孔，其可以使用包括弯曲和夹紧外壳的端部的组装工艺将金属外壳与主板接地连接。 MEMS麦克风封装包括具有开口侧的四边形容器状金属壳体，以将部件插入内部空间，并且在开口侧上的倒角端容易地进行卷曲操作，印刷电路板（PCB）基板其中安装了MEMS麦克风芯片和专用集成电路（ASIC）芯片，PCB基板插入金属外壳并具有用于引入外部声音的声孔，以及被配置为将PCB基板支撑在卷曲中的支撑操作并限定金属外壳和PCB基板之间的空间。

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