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81. 发明授权

US5955704A Optimal PWA high density routing to minimize EMI substrate coupling in a computer system 失效
标题翻译：最优PWA高密度路由，以最小化计算机系统中的EMI衬底耦合
公开(公告)号：US5955704A
公开(公告)日：1999-09-21
申请号：US754763
申请日：1996-11-21
申请人： Leroy Jones , Robert Petty
发明人： Leroy Jones , Robert Petty
IPC分类号： H05K1/02 , H05K1/11 , H05K9/00
CPC分类号： H05K1/112 , H05K1/0218 , H05K9/0039 , H05K2201/09227 , H05K2201/10689
摘要： A computer system includes a multi-layer circuit board having first and second routing layers. A component including pads is mounted on the first layer. Crosstalk protection is provided by a plurality of ground vias and signal vias adjacent to the component and extending between the first and second layers. A first circuit trace extends from a first pad along the first layer and between two adjacent ones of the ground vias. A second circuit trace extends from a second pad along the first layer to a signal via at the first layer and from the signal via along the second layer between the two adjacent ground vias.
摘要翻译：计算机系统包括具有第一和第二路由层的多层电路板。包括垫的部件安装在第一层上。串扰保护由邻近元件的多个接地通孔和信号通道提供，并在第一和第二层之间延伸。第一电路迹线沿着第一层从第一焊盘延伸，并且在两个相邻的接地通孔之间延伸。第二电路迹线沿着第一层从第二焊盘延伸到在第一层处的信号通孔和从两个相邻的接地通孔之间的沿着第二层的信号通道延伸。

82. 发明授权

US5949029A Conductive elastomers and methods for fabricating the same 失效
标题翻译：导电弹性体及其制造方法
公开(公告)号：US5949029A
公开(公告)日：1999-09-07
申请号：US736830
申请日：1996-10-28
申请人： David R. Crotzer , Jonathan W. Goodwin , Arthur G. Michaud , David A. DeDonato
发明人： David R. Crotzer , Jonathan W. Goodwin , Arthur G. Michaud , David A. DeDonato
IPC分类号： B32B7/02 , B32B25/04 , B32B27/08 , H01B1/00 , H01B5/14 , H01H1/029 , H01H13/702 , H01L23/498 , H01R11/01 , H01R12/52 , H01R12/71 , H01R13/03 , H01R13/24 , H01R13/658 , H05K1/09 , H05K3/10 , H05K3/32 , H05K3/38 , H05K9/00 , H05K1/00
CPC分类号： H01R13/2414 , B32B27/08 , H01H1/029 , H01H13/702 , H01L23/49827 , H01R12/52 , H01R13/035 , H05K1/095 , H05K3/102 , H05K3/325 , H05K3/38 , H05K3/386 , H05K9/0039 , H01H2209/014 , H01H2239/034 , H01L2924/00013 , H01L2924/0002 , H01R12/714 , H01R13/6599 , H05K2201/0133 , H05K2201/0245 , H05K2201/0329 , H05K2203/1168 , Y10T428/25
摘要： Several different types of electrically conductive elastomers are disclosed along with the methods for their fabrication. In one particular embodiment, a layered composition is disclosed which comprises a substrate, a first layer, and a second layer. The substrate is formed of a non-conductive elastic material and it has an outer surface. The first layer, which is formed with a non-conductive elastic material, is grafted to the outer surface of the substrate. The second layer, which is formed with a non-conductive elastic material having a quantity of conductive flakes interspersed therein, is grafted to an outer surface of the first layer. The second layer can further be formed with a quantity of rounded or jagged conductive particles interspersed in the non-conductive elastic material such that some of the conductive particles are present along an outer surface of the second layer. Alternatively, a quantity of rounded or jagged conductive particles may be imbedded in an outer surface of the second layer.
摘要翻译：公开了几种不同类型的导电弹性体及其制造方法。在一个具体实施方案中，公开了一种分层组合物，其包含基底，第一层和第二层。基板由非导电弹性材料形成，并具有外表面。形成有非导电弹性材料的第一层被接枝到基底的外表面上。形成有具有散布在其中的导电薄片数量的非导电弹性材料的第二层被接合到第一层的外表面。第二层可以进一步形成有一些散布在非导电弹性材料中的圆形或锯齿状导电颗粒，使得一些导电颗粒沿着第二层的外表面存在。或者，一定数量的圆形或锯齿状导电颗粒可嵌入第二层的外表面。

83. 发明授权

US5905641A Electrical connection with electromagnetic compatibility 失效
标题翻译：电气连接具有电磁兼容性
公开(公告)号：US5905641A
公开(公告)日：1999-05-18
申请号：US894760
申请日：1997-08-27
申请人： Hans-Jorg John , Rolf Paland
发明人： Hans-Jorg John , Rolf Paland
IPC分类号： H05K9/00
CPC分类号： H05K9/0039
摘要： Leading an electrical connection (40), arranged on a printed circuit board (32), in a fashion exhibiting EMC out of a screening housing (12), one wall (16) of which is provided with a slit (18) through which a part (36), bearing an electrical connection (40), of the printed circuit board (32) can project. The edges (20) of the slit (18) are provided with a contact strip (24) which makes contact with an electrically conducting coating (38) of the printed circuit board (32).
摘要翻译： PCT No.PCT / DE96 / 00181 Sec。 371日期1997年8月27日第 102（e）日期1997年8月27日PCT提交1996年2月6日PCT公布。公开号WO96 / 27281 日期1996年9月6日以从展示壳体（12）中呈现出EMC的方式布置在印刷电路板（32）上的电连接（40），其中一个壁（16）设置有狭缝 18），印刷电路板（32）的带有电气连接（40）的部分（36）可穿过该突出部。狭缝（18）的边缘（20）设置有与印刷电路板（32）的导电涂层（38）接触的接触片（24）。

84. 发明授权

US5898576A Printed circuit board including a terminated power plane and method of manufacturing the same 失效
标题翻译：一种包括终端电力平面的印刷电路板及其制造方法
公开(公告)号：US5898576A
公开(公告)日：1999-04-27
申请号：US747397
申请日：1996-11-12
申请人： John J. Lockwood , Edward J. Pavlu, III
发明人： John J. Lockwood , Edward J. Pavlu, III
IPC分类号： H05K1/02 , H05K1/16 , H05K9/00 , H05K7/02
CPC分类号： H05K1/0234 , H05K1/167 , H05K9/0039 , H05K1/0227 , H05K1/0231 , H05K2201/093 , H05K2201/09309 , H05K2201/09663 , H05K2201/10022 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
摘要： A printed circuit board including a terminated power plane is described. Specifically, the power-ground plane construction includes a dielectric layer, a power plane having a peripheral edge, and a ground plane. The ground plane is spaced from the power plane by the dielectric layer, and is positioned in an opposed relationship to the power plane. The power-ground plane construction also includes a termination element coupling the power plane, at or adjacent the peripheral edge thereof, to the ground plane so as to terminate the power plane. In one embodiment, a plurality of termination elements couple the power plane, at or adjacent the peripheral edge thereof, to the ground plane. The termination elements are spaced from each other at substantially regular intervals. In another embodiment, a termination element is a strip or sheet element coupling continuous lengths of the peripheral edge of the power plane to ground plane.
摘要翻译：描述包括终端电力平面的印刷电路板。具体而言，电源 - 接地平面构造包括电介质层，具有周缘的电力平面和接地面。接地平面通过电介质层与电源平面隔开，并且与电源平面相对置。电源 - 接地平面结构还包括一个终端元件，该终端元件将电源平面连接在其周边边缘处或与其相邻的边缘处，以便终止电源平面。在一个实施例中，多个终端元件将功率平面耦合到接地平面上或其周围边缘处。终端元件以基本上规则的间隔彼此间隔开。在另一个实施例中，终端元件是将电力平面的周边边缘的连续长度连接到接地平面的带状或片状元件。

85. 发明授权

US5898344A High-frequency module 失效
标题翻译：高频模块
公开(公告)号：US5898344A
公开(公告)日：1999-04-27
申请号：US816736
申请日：1997-03-14
申请人： Katsuhiko Hayashi
发明人： Katsuhiko Hayashi
IPC分类号： H03B5/02 , H05K1/02 , H05K3/34 , H05K3/40 , H05K5/00 , H05K9/00 , H03B1/00
CPC分类号： H05K3/3405 , H05K5/0091 , H05K9/0039 , H05K1/0237 , H05K2201/09181 , H05K2201/10371 , H05K3/341 , H05K3/403
摘要： Downward projections made on two side walls of a cap are fitted into recesses in two opposed side faces of a substrate. Lower margins of two end walls of the cap are soldered to ground electrodes provided on a part mounting face of the substrate. Lower margins in the proximity of projections of the side walls of the cap are soldered to ground electrodes provided on the part mounting face above recesses of the substrate. Therefore, it is provided a high-frequency module that can produce a good electromagnetic shielding effect even in a high-frequency band.
摘要翻译：在盖的两个侧壁上形成的向下突起装配到基板的两个相对的侧面中的凹部中。将盖的两个端壁的下边缘焊接到设置在基板的部件安装面上的接地电极。将盖的侧壁的突起附近的下边缘焊接到设置在基板的凹部上方的部件安装面上的接地电极。因此，提供了即使在高频带也能够产生良好的电磁屏蔽效果的高频模块。

86. 发明授权

US5856656A Electrical grounding arrangement for a printed circuit board of a microwave oven 失效
标题翻译：微波炉印刷电路板的电气接地装置
公开(公告)号：US5856656A
公开(公告)日：1999-01-05
申请号：US897310
申请日：1997-07-21
申请人： Geun-Soo Kim
发明人： Geun-Soo Kim
IPC分类号： F24C7/02 , H05B6/80 , H05K9/00 , H05B6/68
CPC分类号： H05B6/66 , H05K9/0039
摘要： The present invention relates to a ground structure of a printed circuit board in a microwave oven, where the microwave oven formed with a screw hole at a tip end of a bar extended from a body thereof and having a jumper wire connected to a ground pattern at around a screw hole formed at a printed circuit board while a bolt is screwed to a control panel through a screw hole formed at the tip end of the bar and through a screw hole formed at the printed circuit board are connected by the jumper wire, so that the printed circuit board is automatically connected and grounded to the body of the microwave oven when the printed circuit board is fastened to the control panel, thereby providing a convenience in assembly of the microwave oven and a stability thereto.
摘要翻译：本发明涉及一种微波炉中的印刷电路板的接地结构，其中微波炉在其从其本体延伸的杆的尖端处形成有螺纹孔，并且具有连接到接地图案的跳线围绕形成在印刷电路板上的螺孔，而螺栓通过形成在杆的顶端处的螺钉孔和通过形成在印刷电路板上的螺孔而拧到控制面板上，通过跳线连接，因此当印刷电路板被固定到控制面板上时，印刷电路板自动地连接并接地到微波炉的主体，从而提供了微波炉的组装方便和稳定性。

87. 发明授权

US5745989A Method of preparation of an optically transparent article with an embedded mesh 失效
标题翻译：具有嵌入网的光学透明制品的制备方法
公开(公告)号：US5745989A
公开(公告)日：1998-05-05
申请号：US511392
申请日：1995-08-04
申请人： Donald Fisher , Charles Warner
发明人： Donald Fisher , Charles Warner
IPC分类号： H05B3/86 , H05K1/00 , H05K1/03 , H05K3/00 , H05K3/04 , H05K3/10 , H05K9/00 , H05K3/02
CPC分类号： H05K9/0039 , H05B3/86 , H05K3/107 , H05B2203/017 , H05K1/0289 , H05K1/0306 , H05K2201/0108 , H05K2201/09036 , H05K3/0029 , H05K3/048 , Y10T29/49155 , Y10T428/16 , Y10T428/162 , Y10T428/23 , Y10T428/239 , Y10T428/24777 , Y10T428/2481 , Y10T428/249921
摘要： An optically transparent article is prepared from an optically transparent first piece and an optically transparent second piece. A channel pattern is scribed into a surface of the first piece to a preselected depth. A metallic stripe pattern is deposited into the channel pattern, with the thickness of the metallic stripe pattern being less than the depth of the channel pattern. The second piece is placed over the first piece and sealed thereto at a peripheral boundary such that the second piece does not contact the metallic stripe pattern. A bus connection is optionally made to the metallic stripe, preferably from the periphery of either the first or second piece.
摘要翻译：光学透明制品由光学透明的第一片和光学透明的第二片制成。将通道图案划刻到第一件的表面中至预选深度。金属条纹图案沉积到通道图案中，金属条纹图案的厚度小于通道图案的深度。将第二件放置在第一件上并在周边边界密封，使得第二件不接触金属条纹图案。总线连接可选地制成金属条，优选地从第一或第二片的周边。

88. 发明授权

US5742488A Shielding device and method of mounting 失效
标题翻译：屏蔽装置及其安装方法
公开(公告)号：US5742488A
公开(公告)日：1998-04-21
申请号：US524325
申请日：1995-09-06
申请人： Pekka Lonka , Kari Aittokangas
发明人： Pekka Lonka , Kari Aittokangas
IPC分类号： H05K9/00
CPC分类号： H05K9/0039
摘要： The invention relates to a method for attaching an EMC protective casing to a circuit board and to an EMC protective casing. The fastening method according to the invention is based on convex pins (3) in a metal casing (7), which are pressed into metal-coated openings (2) in the circuit board (1). The arrangement according to the invention is applicable as a protection against interference in portable mobile phones.
摘要翻译：本发明涉及一种用于将EMC保护壳体附接到电路板和EMC保护套管的方法。根据本发明的紧固方法基于金属壳体（7）中的凸形销（3），其被压入电路板（1）中的金属涂覆的开口（2）中。根据本发明的装置可用作防止对便携式移动电话的干扰的保护。

89. 发明授权

US5686871A Method for minimizing radio frequency emissions from plug-in adapter cards in computer systems 失效
标题翻译：用于最小化计算机系统中插入式适配器卡的射频发射的方法
公开(公告)号：US5686871A
公开(公告)日：1997-11-11
申请号：US678888
申请日：1996-07-12
申请人： Jozef B. Baran
发明人： Jozef B. Baran
IPC分类号： H05K1/02 , H05K1/14 , H05K9/00
CPC分类号： H05K9/0039 , H05K1/0227 , H05K1/0233 , H05K1/141 , H05K2201/093 , H05K2201/09663 , H05K2201/1006
摘要： Noise generated in a computer system on a modem adapter card is effectively suppressed by providing an extension to a voltage reference plane. The extension reference plane is coupled to the voltage reference plane of the adapter card by an impedance circuit. The extension reference plane causes the adapter card to have a composite reference plane which has an overall length greater than one-quarter of the wavelength of the signal to be suppressed such that the composite reference plane does not resonate at the frequency of the signal which generated the noise. The reference planes are preferably connected by a resonant circuit so that the two reference planes are effectively electrically connected at high frequencies and are electrically disconnected at low frequencies so that resonance of the boards is also suppressed at the lower frequencies.
摘要翻译：通过向电压参考平面提供扩展，有效地抑制了在调制解调器适配器卡上的计算机系统中产生的噪声。扩展参考平面通过阻抗电路耦合到适配器卡的电压参考平面。扩展参考平面使得适配器卡具有复合参考平面，其总长度大于要抑制的信号的波长的四分之一，使得复合参考平面在产生的信号的频率上不共振噪音。参考平面优选地通过谐振电路连接，使得两个参考平面在高频下被有效地电连接并且在低频下电断开，使得板的谐振也被抑制在较低的频率。

90. 发明授权

US5617299A Connecting rear wall for subracks 失效
标题翻译：连接后壁为子架
公开(公告)号：US5617299A
公开(公告)日：1997-04-01
申请号：US525675
申请日：1995-09-25
申请人： Franz-Josef Knoop , Ludger Gockel
发明人： Franz-Josef Knoop , Ludger Gockel
IPC分类号： H05K7/10 , H05K7/14 , H05K9/00
CPC分类号： H05K7/1457 , H05K9/0039
摘要： The invention relates to a connecting rear wall (10) for subracks in electronic systems. Metal plates (14, 16) are mounted parallel to a wiring board (12) by being screwed thereto and simultaneously serve to feed the supply voltages and to screen high-frequency interferences. Cutouts (26) and openings (A) in the metal plates (14, 16) have a maximum dimension which does not exceed 1/10 to 1/20 of the wavelength of the interference signal of highest frequency which is to be screened.
摘要翻译： PCT No.PCT / DE94 / 00138 Sec。 371 1995年9月25日第 102（e）1995年9月25日PCT PCT 1994年2月10日PCT公布。公开号WO94 / 22283 日期1994年9月29日本发明涉及一种用于电子系统中的支架的连接后壁（10）。金属板（14,16）通过螺纹连接而平行于布线板（12）安装，同时用于馈送电源电压并屏蔽高频干扰。金属板（14,16）中的切口（26）和开口（A）的最大尺寸不超过+ E，fra 1/10 + EE至+ E，fra 1/20 + EE 要被筛选的最高频率的干扰信号。

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