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81. 发明授权

US5438479A High density, heat-dissipating circuit assembly with accessible components 失效
标题翻译：高密度，散热电路组件，可访问组件
公开(公告)号：US5438479A
公开(公告)日：1995-08-01
申请号：US148972
申请日：1993-11-08
申请人： Heinrich Heilbronner
发明人： Heinrich Heilbronner
IPC分类号： H01L25/07 , H01L25/18 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/32 , H05K3/36 , H05K7/20
CPC分类号： H05K3/368 , H05K7/20454 , H01L2924/0002 , H05K1/0203 , H05K1/144 , H05K2201/09036 , H05K2201/10378 , H05K3/0061 , H05K3/325
摘要： A circuit assembly includes a platen for pressing carrier plates, bearing heat-dissipating components, against a heat sink. Circuits on one carrier plate are electrically connected with circuits on the other carrier plate by corresponding contacts on each carrier plate which the platen presses into mutual contact as it presses the carrier plates against the heat sink. The surfaces to which the carrier plates are pressed is stepped, which serves to align the carrier plates with respect to each other. One or more substrates, bearing other circuit elements, are attached to the platen and electrically connected to circuits on the carrier plate by resilient contact elements attached to the platen. The resilient contact elements press against contact surfaces of the carrier plates and substrates to make connections. Recesses in the platen also facilitate alignment of the carrier plates and components thereon. The interconnection of components by the resilient contact elements, and the locating effect of recesses in the heat sink and platen makes it possible to assemble and disassemble the circuit assembly rapidly and conveniently.
摘要翻译：电路组件包括用于将承载板压紧的承载散热部件的压板。一个承载板上的电路通过在每个承载板上的相应触点与另一承载板上的电路电连接，当压板将承载板压靠在散热片上时，该压板相互接触。承载板被按压的表面是阶梯形的，其用于使承载板相对于彼此对准。承载其他电路元件的一个或多个基板被附接到压板并且通过附接到压板的弹性接触元件电连接到承载板上的电路。弹性接触元件压靠承载板和基板的接触表面以进行连接。压盘中的凹口还有助于支撑板和其上的部件对准。通过弹性接触元件的部件互连以及散热器和压板中的凹槽的定位效果使得可以快速方便地组装和拆卸电路组件。

82. 发明授权

US3586102A Heat sink pillow 失效
标题翻译：散热垫
公开(公告)号：US3586102A
公开(公告)日：1971-06-22
申请号：US3586102D
申请日：1969-02-17
申请人： TELEDYNE INC
发明人： GILLES RICHARD F
IPC分类号： H01L23/36 , H05K7/20 , F28F7/00
CPC分类号： H05K7/20454 , H01L23/36 , H01L2224/16
摘要： The invention disclosed herein describes a thermal pad having a pair of strips of film being adhered to each other with a quantity of thermal grease or the like being encapsulated therebetween. The thermal pad is adapted to be inserted between a heat-dissipating component and a heat-sinking component to provide a highly efficient thermal path between the two components.

83. 发明公开

US20240292570A1 ELASTIC HEAT CONDUCTION MECHANISM FOR ELECTRONIC DEVICES 审中-公开
公开(公告)号：US20240292570A1
公开(公告)日：2024-08-29
申请号：US18174459
申请日：2023-02-24
申请人： ADLINK TECHNOLOGY INC.
发明人： Hsiu-Ling YU , MILO LI , Hsuan-Chan CHIANG
IPC分类号： H05K7/20
CPC分类号： H05K7/20454 , H05K7/20418
摘要： An elastic heat conduction mechanism for electronic devices includes a heat-conducting unit and a heat-exchanging member that are tightly assembled in an elastic and floating docking adjustment to achieve the effect of preset heating element cooling. The base and heat-conducting assembly of the heat-conducting unit are floatingly assembled in the storage space of the heat-exchanging member to form a floating adjustment and a stable fit to assist the preset heating element to quickly dissipate heat.

84. 发明授权

US12069842B2 Cooling device for a power electronics module with cooling adapter, power electronics module and motor vehicle 有权
公开(公告)号：US12069842B2
公开(公告)日：2024-08-20
申请号：US17741014
申请日：2022-05-10
申请人： Bayerische Motoren Werke Aktiengesellschaft
发明人： Ludwig Schmid , Peter Schreivogel
IPC分类号： H05K7/20
CPC分类号： H05K7/209 , H05K7/2049 , H05K7/20445 , H05K7/20454
摘要： A cooling device for a power electronics module for cooling a power electronic assembly of the power electronics module includes a heatsink for dissipating waste heat from at least one power electronic component arranged on a circuit board, and at least one heat-conducting element for providing a local heat-conducting path between the at least one power electronic component and the heatsink. Heat-conducting element is formed as a cooling adapter and is separate from the heatsink and has a heat-conducting core, which can be arranged between the heat sink and the power electronic assembly and is designed to bridge a distance between the at least one power electronic component and the heatsink.

85. 发明授权

US12022640B1 Multi-column graphite-over-foam assembly 有权
公开(公告)号：US12022640B1
公开(公告)日：2024-06-25
申请号：US17840268
申请日：2022-06-14
申请人： Cisco Technology, Inc.
发明人： Phong Hoang Ho , Stephen Aubrey Scearce
IPC分类号： H05K7/20 , H05K9/00
CPC分类号： H05K9/0022 , H05K7/2049 , H05K7/2039 , H05K7/20454
摘要： A multi-column graphite-over-foam (GOF) assembly includes a plurality of foam columns wherein each foam column of the plurality of foam columns are individually wrapped in a graphite sheet. A graphite layer surrounds the plurality of foam columns and an electrically conductive outer layer surrounding the graphite layer. The graphite layer is configured to thermally couple the electrically conductive outer layer to the plurality of foam columns, and the electrically conductive outer layer is configured to absorb electromagnetic interference (EMI).

86. 发明授权

US11852957B2 Thermal-control system for a security camera and associated security camera 有权
公开(公告)号：US11852957B2
公开(公告)日：2023-12-26
申请号：US17028456
申请日：2020-09-22
申请人： Google LLC
发明人： Ihab A. Ali , Arun Prakash Raghupathy , Mark Benjamin Kraz , Kok Yen Cheng , Chi-Ming Lin
IPC分类号： G03B17/55 , G08B13/196 , H05K7/20 , H04N23/52 , H04N23/51
CPC分类号： G03B17/55 , G08B13/19619 , H04N23/52 , H05K7/20472 , H05K7/20509 , H04N23/51 , H05K7/20454
摘要： This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.

87. 发明授权

US11839065B2 Temperature equalizing vehicle-mountable device 有权
公开(公告)号：US11839065B2
公开(公告)日：2023-12-05
申请号：US17574766
申请日：2022-01-13
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
IPC分类号： H05K7/20 , H05K1/02
CPC分类号： H05K7/20872 , H05K1/0203 , H05K7/20172 , H05K7/20854 , H05K7/20881 , H05K7/20254 , H05K7/20336 , H05K7/20454 , H05K7/20863
摘要： This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

88. 发明授权

US11839060B2 Thermal-control system of a video-recording doorbell and associated video-recording doorbells 有权
公开(公告)号：US11839060B2
公开(公告)日：2023-12-05
申请号：US17649529
申请日：2022-01-31
申请人： Google LLC
发明人： Arun Prakash Raghupathy , Ihab A. Ali , Jacobi Colton Grillo
IPC分类号： H05K7/20 , H04N7/18
CPC分类号： H05K7/20481 , H04N7/186 , H05K7/205 , H05K7/20218 , H05K7/20454 , H05K7/20509 , H05K7/20981
摘要： This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

89. 发明公开

US20230354536A1 ELECTRONIC APPARATUS 审中-公开
公开(公告)号：US20230354536A1
公开(公告)日：2023-11-02
申请号：US18348655
申请日：2023-07-07
申请人： KIOXIA CORPORATION
发明人： Akitoshi SUZUKI
IPC分类号： H05K5/02 , H05K7/20 , G06F3/06 , G06F1/18
CPC分类号： H05K5/0269 , H05K7/20472 , G06F3/0688 , G06F1/182 , H05K2201/10159 , H05K7/20454 , H05K2201/042 , H05K1/0275
摘要： According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

90. 发明授权

US11792912B2 Heat dissipation structure with stacked thermal interface materials 有权
公开(公告)号：US11792912B2
公开(公告)日：2023-10-17
申请号：US17673950
申请日：2022-02-17
申请人： Wistron NeWeb Corporation
发明人： Bo-Yen Chen
IPC分类号： H05K1/02 , H05K7/20 , F28D15/02
CPC分类号： H05K1/021 , H05K7/20454 , F28D15/02 , H05K7/20336 , H05K7/20472 , H05K2201/066
摘要： A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.

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