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81. 发明授权

US07055756B2 Deposition fabrication using inkjet technology 有权
标题翻译：使用喷墨技术的沉积制造
公开(公告)号：US07055756B2
公开(公告)日：2006-06-06
申请号：US10973106
申请日：2004-10-25
申请人： Frank E. Anderson , Yimin Guan
发明人： Frank E. Anderson , Yimin Guan
IPC分类号： G06K19/06 , H05K1/03 , H05K1/05
CPC分类号： H05K3/125 , H05K3/1208 , H05K2201/0116 , H05K2203/013 , Y10T428/24802 , Y10T436/209163
摘要： A method of fabricating an RFID antenna, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a conductive antenna. The invention also includes an RFID tag comprising: (a) a substrate including a plurality of micropores; (b) a microchip; and (c) an RFID antenna in electrical communication with the microchip and contacting the substrate, the RFID antenna comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.
摘要翻译：一种制造RFID天线的方法，所述方法包括：（a）以预定图案将浆料沉积在基底上，所述基底包括多个微孔，用于从所述基底的表面排出所述浆液的流体成分，同时将所述浆料的导电颗粒保持在所述基底的表面上; 和（b）干燥导电颗粒以将导电颗粒固定在基板的表面上并提供导电天线。本发明还包括RFID标签，其包括：（a）包括多个微孔的基底; （b）微芯片; 和（c）与微芯片电连通并接触基板的RFID天线，RFID天线包括通过从喷墨打印机喷射浆料而沉积在基板上的导电颗粒。

82. 发明申请

US20060060944A1 Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus 有权
标题翻译：形成多层结构的方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US20060060944A1
公开(公告)日：2006-03-23
申请号：US11196677
申请日：2005-08-04
申请人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L29/06 , H01L23/495 , H01L27/082
CPC分类号： H05K3/125 , H01L51/0022 , H01L2924/0002 , H05K3/1208 , H05K3/386 , H05K3/4664 , H05K2203/013 , H05K2203/1173 , H01L2924/00
摘要： A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body surface; (B) obtaining a first insulating layer by curing in the first insulating-material layer; (C) forming a pattern of an electric conductive material layer on the first insulating layer by discharging a droplet of an electric conductive material to the first insulating layer; and (D) forming a wiring pattern on the first insulating layer by activating the pattern of the electric conductive material layer.
摘要翻译：一种使用液滴喷射装置形成多层结构的方法; 该方法包括：（A）通过将包括第一感光性树脂的第一绝缘材料的液滴喷射到材料体表面而形成覆盖材料体表面的第一绝缘材料层; （B）通过在第一绝缘材料层中固化获得第一绝缘层; （C）通过将导电材料的液滴喷射到第一绝缘层，在第一绝缘层上形成导电材料层的图案; 和（D）通过激活导电材料层的图案在第一绝缘层上形成布线图案。

83. 发明申请

US20050194588A1 Fluorine compound, liquid repellent membrane using the same and product using the same 审中-公开
标题翻译：氟化合物，使用其的疏液膜和使用其的产品
公开(公告)号：US20050194588A1
公开(公告)日：2005-09-08
申请号：US11032238
申请日：2005-01-11
申请人： Hiroshi Sasaki , Yasushi Tomioka
发明人： Hiroshi Sasaki , Yasushi Tomioka
IPC分类号： H05B33/10 , C07F7/10 , C07F7/18 , C09K3/18 , G02B5/20 , H01L29/08 , H01L35/24 , H01L51/05 , H01L51/50 , H05B33/14 , H05K3/12
CPC分类号： H05K3/1208 , C07F7/1804 , G02B5/201 , H01L51/0529 , H05K3/1241 , H05K2203/1173
摘要： The present invention provides a liquid repellent membrane whose liquid repellency can be controlled by a varying physical stimulation; a novel fluorine compound which can be formed into the liquid repellent membrane; an electrical board, display device and color filter for display devices which are formed using the liquid repellent membrane by a method involving irradiation of visible light, which may be combined with a heating step, but needing no vacuum or ultraviolet ray irradiation process; methods for producing an electrical board, display device and color filter for display devices; and a pH sensor and ion sensor working on measurement of changed liquid repellency. The fluorine compound having liquid repellency is provided with a site at which it can be bound to a functional group, e.g., compound having a pigment unit.
摘要翻译：本发明提供一种防液膜，其液体排斥性可以通过变化的物理刺激来控制; 可形成防液膜的新型氟化合物; 显示装置的显示装置和显示装置的滤色器，其通过涉及可见光的照射的方法使用所述疏液膜形成，所述方法可以与加热步骤结合，但不需要真空或紫外线照射工艺; 用于制造电路板的方法，用于显示装置的显示装置和滤色器; 以及pH传感器和离子传感器，用于测量改变的液体排斥性。具有疏液性的氟化合物具有可以与官能团结合的位置，例如具有颜料单元的化合物。

84. 发明申请

US20050158528A1 Wiring substrate 审中-公开
标题翻译：接线基板
公开(公告)号：US20050158528A1
公开(公告)日：2005-07-21
申请号：US11019984
申请日：2004-12-23
申请人： Hiroshi Sasaki , Makoto Kurosawa , Kazuo Shimizu
发明人： Hiroshi Sasaki , Makoto Kurosawa , Kazuo Shimizu
IPC分类号： H05K1/09 , B32B1/00 , B32B9/00 , C08J7/12 , C09K3/18 , H05K1/02 , H05K3/10 , H05K3/12 , H05K3/38
CPC分类号： H05K3/1208 , H05K3/125 , H05K3/386 , H05K2201/015 , H05K2201/0209 , H05K2203/013 , H05K2203/1173 , Y10T428/24917
摘要： A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10−2 D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.
摘要翻译：提供一种基板，其上可以令人满意地使用金属微粒的分散液形成导线，而不会导致断开或短路。布线基板包括基板，形成在基板上的有机膜和形成在有机膜上的金属线。形成金属线的有机膜表面的轮廓的算术平均偏差Ra不小于60nm且不大于5×10 -2 D，其中D是金属丝。形成金属线的有机膜表面上的水的接触角不小于110°。

85. 发明申请

US20050126003A1 Method of manufacturing electronic component and member to be used in the same method 审中-公开
公开(公告)号：US20050126003A1
公开(公告)日：2005-06-16
申请号：US11048737
申请日：2005-02-03
申请人： Keiichi Nakao
发明人： Keiichi Nakao
IPC分类号： H01G4/008 , H01G4/12 , H01G13/00 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/38 , B41J2/045
CPC分类号： H01G4/12 , H01G4/0085 , H01L21/4867 , H05K1/0306 , H05K1/092 , H05K3/1208 , H05K3/125 , H05K3/386 , H05K2203/013 , H05K2203/0783 , H05K2203/1163 , Y10T29/49155 , Y10T29/49401
摘要： A base layer, which is supposed to be burnt off by baking, is formed on an unbaked member such as ceramic green sheet or laminated ceramic green sheets. This base layer improves ink acceptability of the unbaked ceramic member particularly for low viscosity ink such as jet-ink, and prevents oozing, draining, uneven thickness. This structure thus allows the inkjet to form a precise pattern. The base layer is burnt off at the baking step in the manufacturing process of electronic components, thus it does not adversely affect the reliability of the electronic component.

86. 发明申请

US20050112810A1 Method for manufacturing conductive pattern forming body 有权
标题翻译：导电图案形成体的制造方法
公开(公告)号：US20050112810A1
公开(公告)日：2005-05-26
申请号：US10649212
申请日：2003-08-27
申请人： Hironori Kobayashi
发明人： Hironori Kobayashi
IPC分类号： C23C18/12 , G03F7/004 , G03F7/075 , G03F7/40 , H05K3/12 , H05K1/03
CPC分类号： C23C18/06 , B82Y30/00 , C23C18/1216 , C23C18/14 , G03F7/0046 , G03F7/0047 , G03F7/0757 , G03F7/405 , H05K3/1208 , H05K3/1241 , H05K2203/107 , H05K2203/1173
摘要： It is a main object of the present invention to provide a method for manufacturing a conductive pattern capable of forming a highly precise pattern, also capable of forming by using a simple process, and being free from problems such as treatment of waste fluids. In order to attain the above object, the present invention provides a method for manufacturing a conductive pattern forming body comprising: a pattern forming body substrate preparing process of preparing pattern forming body substrate comprising a base material, and a photocatalyst containing layer formed on the base material comprising a photocatalyst and a binder whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced; a wettability pattern forming process of forming wettability pattern comprising a liquid repellent area and a lyophilic area on the photocatalyst containing layer by irradiating the photocatalyst containing layer in a pattern with energy; a metal colloid coating process of adhering a metal colloid only to the lyophilic area of the surface of the photocatalyst containing layer on which the wettability pattern is formed, by coating the metal colloid; and a conductive pattern forming process of forming conductive pattern by solidifying the metal colloid adhered to the lyophilic area of the wettability pattern.
摘要翻译：本发明的主要目的是提供一种制造能够形成高精度图案的导电图案的方法，该图形也能够通过简单的工艺形成，并且没有诸如处理废液的问题。为了实现上述目的，本发明提供了一种导电图案形成体的制造方法，其特征在于，包括：图案形成体基板的准备工序，其制作包含基材的图案形成体基板和形成在基材上的光催化剂层包含光催化剂和能量照射部分的润湿性改变为与液体接触角的粘合剂的材料减少; 通过用能量照射含有光催化剂层的图案，在含有光催化剂的层上形成包含疏液性区域和亲液性区域的润湿性图案的润湿性图案形成方法; 通过涂覆金属胶体将金属胶体仅粘附到其上形成有润湿性图案的光催化剂层的表面的亲液性区域的金属胶体涂覆方法; 以及通过使附着在润湿性图案的亲液性区域上的金属胶体固化而形成导电图案的导电图案形成工艺。

87. 发明申请

US20030213614A1 Conductive layer pattern and method for forming the same, wiring board, electronic device, electronic appliances and noncontact card medium 失效
标题翻译：导电层图案及其形成方法，布线板，电子设备，电子设备和非接触卡介质
公开(公告)号：US20030213614A1
公开(公告)日：2003-11-20
申请号：US10414461
申请日：2003-04-15
发明人： Masahiro Furusawa , Takashi Hashimoto
IPC分类号： H05K001/03 , B05D005/12
CPC分类号： H05K3/125 , H01L21/288 , H01L21/4846 , H01L21/76838 , H05K1/0306 , H05K3/105 , H05K3/1208 , H05K3/38 , H05K3/4053 , H05K2201/0116 , H05K2203/013 , H05K2203/121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets or voids in the receiving layer and can be used, for example, to provide interlayer connections in laminated wiring boards. Preferably, the conductive material is provided by fine conductive particles, organometallic compounds or mixtures thereof.
摘要翻译：一种用于通过选择性地将包含导电材料的液滴沉积到多孔接收层上来形成导电层图案的方法。大部分导电材料留在用于形成布线图案的表面上，但是其中的一些渗透到接收层中的凹穴或空隙中，并且可以用于例如在叠层布线板中提供层间连接。优选地，导电材料由细小的导电颗粒，有机金属化合物或其混合物提供。

88. 发明申请

US20030024103A1 Method and apparatus for making devices 失效
标题翻译：制造装置的方法和装置
公开(公告)号：US20030024103A1
公开(公告)日：2003-02-06
申请号：US10197462
申请日：2002-07-18
申请人： Seiko Epson Corporation
发明人： Hiroshi Kiguchi , Masahiro Furusawa , Hirotsuna Miura
IPC分类号： H01Q017/00 , H01R003/00 , B23P019/00
CPC分类号： H01Q1/2225 , H01Q1/22 , H05K1/165 , H05K3/1208 , H05K3/125 , H05K3/4069 , H05K2201/0162 , H05K2203/013 , H05K2203/0525 , H05K2203/1173 , Y10T29/49018 , Y10T29/49165 , Y10T29/49401 , Y10T29/5313 , Y10T29/532
摘要： A method and an apparatus for manufacturing a device are provided. The method and the apparatus can form micro wiring without undesired wetting and spreading using an inexpensive functional-liquid supplying method. A method for forming a device such as a radiofrequency identification tag 10 includes the steps of: making patterns at a plurality of sections having different degrees of affinity to the functional liquid on a substrate 11 for forming the device; and supplying the functional liquid to the selected section having high affinity to the functional liquid. The step of forming the plurality of sections having different degrees of affinity to the functional liquid includes the substeps of, for example, supplying an organosiloxane film on the substrate and exposing the organosiloxane film through an optical mask.
摘要翻译：提供了一种用于制造装置的方法和装置。该方法和装置可以使用廉价的功能液供应方法形成微布线而不需要不必要的润湿和扩散。用于形成诸如射频识别标签10的装置的方法包括以下步骤：在用于形成该装置的基板11上制作与功能液的不同程度的多个部分的图案; 并将所述功能液体供应到对所述功能液体具有高亲和力的选定部分。形成与功能性液体具有不同程度的亲和力的多个部分的步骤包括例如在基材上提供有机硅氧烷膜并通过光学掩模曝光有机硅氧烷膜的子步骤。

89. 发明公开

US20230292444A1 ASSEMBLY METHOD OF ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20230292444A1
公开(公告)日：2023-09-14
申请号：US17805028
申请日：2022-06-02
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： I-Kai Liang
IPC分类号： H05K3/12
CPC分类号： H05K3/1208
摘要： The present disclosure provides an assembly method of an electronic device. The assembly method includes: opening an upper cover of a loading mechanism on a circuit board, in which the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes a central processing unit socket located on the circuit board; snapping an elastic sheet to opposite sides of an inner edge of the opening of the upper cover through buckling portion of the elastic sheet; and closing the upper cover of the loading mechanism so that an elastic sheet body of the elastic sheet covers the central processing unit socket.

90. 发明授权

US10845924B2 Capacitive devices and methods of fabricating same 有权
公开(公告)号：US10845924B2
公开(公告)日：2020-11-24
申请号：US15768256
申请日：2016-10-18
申请人： SUN CHEMICAL CORPORATION
发明人： Mathew Mathew , Ramasamy Krishnan
IPC分类号： G06F3/045 , G06F3/044 , H05K1/09 , H05K3/12 , C09D11/52 , H05K1/16 , C09D11/101 , B41M5/00 , G06K19/077 , H05K1/02 , H05K3/28
CPC分类号： G06F3/044 , B41M5/0023 , C09D11/101 , C09D11/52 , G06K19/07722 , H05K1/0266 , H05K1/092 , H05K1/162 , H05K3/1208 , H05K3/1275 , G06F2203/04103 , H05K3/1283 , H05K3/285 , H05K3/287 , H05K2201/09936 , H05K2201/10151 , H05K2203/013 , H05K2203/0126 , H05K2203/1545 , H05K2203/1572
摘要： Described herein are capacitive devices and methods for producing same using printing methods such as flexography, gravure, offset, lithography, etc. The capacitive devices are formed from printing conductive inks, non-conductive inks, masking ink layers, graphic artwork layers, and overprint layers on a substrate. Interaction between a conductive ink layer of the capacitive device with a touch screen device of a computer, tablet, smart phone, etc. causes a capacitive effect that allows information coded in capacitive device to be read, leading to an activity such as the download of content to the device having the touch screen.

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