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81. 发明申请

US20150036304A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20150036304A1
公开(公告)日：2015-02-05
申请号：US14326071
申请日：2014-07-08
申请人： TAIYO YUDEN CO., LTD.
发明人： Motoi YAMAUCHI , Osamu KAWACHI
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H01L21/561 , H01L23/04 , H01L24/95 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12042 , H01L2924/15174 , H01L2924/15787 , H01L2924/181 , H03H9/02913 , H03H9/1007 , H03H9/1085 , H03H2009/0019 , H05K1/0209 , H05K1/0216 , H05K1/0243 , H05K1/141 , H05K3/284 , H05K3/303 , H05K3/3436 , H05K2201/0305 , H05K2201/049 , H05K2201/068 , H05K2201/10068 , H05K2201/10371 , H05K2201/10537 , H05K2201/1056 , H05K2201/10674 , H05K2203/1316 , H01L2924/00
摘要： An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.
摘要翻译：电子设备包括：布线基板; 通过凸块倒装安装在布线基板的上表面上的多个器件芯片具有露出器件芯片与布线基板的上表面之间的凸块的间隙，并且包括至少一个器件芯片，具有大于所述布线基板的热膨胀系数的热膨胀系数的基板; 连接到所述多个器件芯片的接合衬底，并且具有等于或小于所述至少一个器件芯片中包括的衬底的热膨胀系数的热膨胀系数; 以及覆盖接合基板的密封件，并且密封多个器件芯片。

82. 发明申请

US20140126161A1 ELECTRONIC PACAKGE MODULE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电子PACAKGE模块及其制造方法
公开(公告)号：US20140126161A1
公开(公告)日：2014-05-08
申请号：US13745766
申请日：2013-01-19
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. , UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
发明人： JEN-CHUN CHEN , HSIN-CHIN CHANG
IPC分类号： H05K3/30 , H05K1/18
CPC分类号： H05K1/186 , H01L23/3135 , H01L23/552 , H01L25/16 , H01L2224/48091 , H01L2924/0002 , H01L2924/1531 , H01L2924/181 , H05K3/284 , H05K3/30 , H05K2201/1056 , H05K2203/1316 , H05K2203/1327 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.
摘要翻译：电子封装模块包括具有支撑表面的电路板，至少一个第一电子部件，至少一个第二电子部件和至少一个模制化合物。第一和第二电子部件安装在支撑表面上。模制化合物设置在支撑表面上并且部分地覆盖支撑表面。模制化合物封装第一电子部件而不是第二电子部件。

83. 发明申请

US20140054077A1 ELECTRICAL COMPONENT RESIN, SEMICONDUCTOR DEVICE, AND SUBSTRATE 有权
标题翻译：电气部件树脂，半导体器件和衬底
公开(公告)号：US20140054077A1
公开(公告)日：2014-02-27
申请号：US13994253
申请日：2012-10-18
申请人： Panasonic Corporation
发明人： Masanori Minamio , Hiroki Ikeuchi
IPC分类号： H05K1/03
CPC分类号： H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.
摘要翻译：半导体器件是包括用第一树脂6模制的半导体元件T1的树脂封装结构。第一树脂6包含填充物7，填充物7包括用相变材料包围的电绝缘胶囊，其吸收周围热量和相变以提高介电强度。填料7的效果达到具有令人满意的散热和高耐受电压的结构。

84. 发明授权

US08472190B2 Stacked semiconductor chip device with thermal management 有权
标题翻译：堆叠的半导体芯片器件具有热管理功能
公开(公告)号：US08472190B2
公开(公告)日：2013-06-25
申请号：US12889590
申请日：2010-09-24
申请人： Gamal Refai-Ahmed , Bryan Black , Michael Z. Su
发明人： Gamal Refai-Ahmed , Bryan Black , Michael Z. Su
IPC分类号： H05H7/20
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/42 , H01L23/49816 , H01L23/49827 , H01L25/0652 , H01L2023/4062 , H01L2224/1403 , H01L2224/141 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2224/81192 , H01L2224/83192 , H01L2224/92225 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06589 , H01L2924/01322 , H01L2924/15151 , H01L2924/15311 , H01L2924/15321 , H05K1/0204 , H05K1/141 , H05K1/181 , H05K2201/09072 , H05K2201/10378 , H05K2201/10416 , H05K2201/10515 , H05K2201/1056
摘要： A method of manufacturing is provided that includes placing a thermal management device in thermal contact with a first semiconductor chip of a semiconductor chip device. The semiconductor chip device includes a first substrate coupled to the first semiconductor chip. The first substrate has a first aperture. At least one of the first semiconductor chip and the thermal management device is at least partially positioned in the first aperture.
摘要翻译：提供了一种制造方法，其包括将热管理装置放置成与半导体芯片装置的第一半导体芯片热接触。半导体芯片器件包括耦合到第一半导体芯片的第一衬底。第一基板具有第一孔。第一半导体芯片和热管理装置中的至少一个至少部分地位于第一孔中。

85. 发明申请

US20130119792A1 ELECTRICAL POWER TOOLS 审中-公开
标题翻译：电动工具
公开(公告)号：US20130119792A1
公开(公告)日：2013-05-16
申请号：US13741004
申请日：2013-01-14
申请人： MAKITA CORPORATION
发明人： Takeshi NISHIMIYA , Yutaka MATSUNAGA
IPC分类号： H02K7/14 , H02K11/00
CPC分类号： H02K7/145 , B25F5/008 , H01L2924/0002 , H02K11/33 , H05K1/0203 , H05K7/20463 , H05K2201/10166 , H05K2201/10371 , H05K2201/1056 , H01L2924/00
摘要： An electrical power tool may include a switching device capable of controlling output power of a motor, a circuit board supporting the switching device, and a metal case receiving the circuit board. The switching device includes a conductive part and an insulated portion that is covered by an insulating covering material. The conductive part of the switching device contacts the circuit board. The insulated portion of the switching device contacts the metal case via the insulating covering material.
摘要翻译：电动工具可以包括能够控制电动机的输出功率的开关装置，支撑开关装置的电路板以及接收电路板的金属壳体。开关装置包括被绝缘覆盖材料覆盖的导电部分和绝缘部分。开关装置的导电部分接触电路板。开关装置的绝缘部分经由绝缘覆盖材料接触金属外壳。

86. 发明申请

US20130050954A1 Thermal Management System and Method 有权
标题翻译：热管理系统和方法
公开(公告)号：US20130050954A1
公开(公告)日：2013-02-28
申请号：US13659066
申请日：2012-10-24
申请人： TDK-Lambda Americas, Inc.
发明人： L. Ray Albrecht, III , Gordon K.Y. Lee , Jin He
IPC分类号： H05K7/20 , H05K3/34
CPC分类号： H05K7/20463 , H05K1/0203 , H05K1/0204 , H05K1/144 , H05K7/20454 , H05K7/205 , H05K2201/042 , H05K2201/10303 , H05K2201/10409 , H05K2201/1056 , H05K2201/10871 , Y10T29/49144
摘要： A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermal conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.
摘要翻译：公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性同时允许两个PCB之间的受控电导率。两个PCB之间的受控电气隔离被提供用于使用也可以是导热的间隔垫。在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

87. 发明授权

US08345427B2 Module having at least two surfaces and at least one thermally conductive layer therebetween 有权
标题翻译：模块具有至少两个表面和其间的至少一个导热层
公开(公告)号：US08345427B2
公开(公告)日：2013-01-01
申请号：US12939915
申请日：2010-11-04
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.
摘要翻译：模块可电连接到计算机系统。模块包括耦合到第一表面的第一表面和第一多个电路封装。该模块还包括耦合到第二表面的第二表面和第二多个电路封装。第二表面面向第一表面。模块还包括位于第一表面和第二表面之间的至少一个热导管。所述至少一个热导管与所述第一多个电路封装件和所述第二多个电路封装体热连通。

88. 发明授权

US08183590B2 Image display apparatus having raised parts disposed on a substrate 有权
标题翻译：图像显示装置具有设置在基板上的凸起部分
公开(公告)号：US08183590B2
公开(公告)日：2012-05-22
申请号：US12656297
申请日：2010-01-25
申请人： Takahito Suzuki , Tomoki Igari
发明人： Takahito Suzuki , Tomoki Igari
IPC分类号： H01L33/00
CPC分类号： H05K3/303 , H01L33/62 , H01L2224/48464 , H01L2224/49107 , H01L2224/73265 , H01L2924/01322 , H01L2924/3025 , H05K1/183 , H05K2201/09045 , H05K2201/10106 , H05K2201/1056 , H05K2203/049 , Y02P70/613 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An image display apparatus displaying an image by selectively emitting light from a plurality of semiconductor light emitting elements being regularly arranged, includes a substrate; a first conductive wiring layer being formed on the substrate and supplying a first electric potential; a second conductive wiring layer supplying a second electric potential; the plurality of semiconductor light emitting elements each including a first electrode layer being electrically connected to the first conductive wiring layer and a second electrode layer being electrically connected to the second conductive wiring layer; and a plurality of raised parts being disposed on the substrate, each of the raised parts having an upper surface which is higher than an upper surface of the first conductive wiring layer; wherein the plurality of semiconductor light emitting elements is fixed on the plurality of raised parts respectively.
摘要翻译：通过选择性地发射来自规则排列的多个半导体发光元件的光来显示图像的图像显示装置包括基板; 第一导电布线层，形成在所述基板上并提供第一电位; 提供第二电位的第二导电布线层; 所述多个半导体发光元件各自包括电连接到所述第一导电布线层的第一电极层和与所述第二导电布线层电连接的第二电极层; 并且在所述基板上设置多个凸起部，所述凸起部的每一个具有比所述第一导电布线层的上表面高的上表面; 其中所述多个半导体发光元件分别固定在所述多个凸起部分上。

89. 发明授权

US08159828B2 Low profile flip chip power module and method of making 有权
标题翻译：低调倒装芯片功率模块及其制作方法
公开(公告)号：US08159828B2
公开(公告)日：2012-04-17
申请号：US11678061
申请日：2007-02-23
申请人： Ming Sun , Demei Gong
发明人： Ming Sun , Demei Gong
IPC分类号： H05K1/18
CPC分类号： H05K1/183 , H01L23/552 , H01L25/072 , H01L25/16 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2924/13091 , H01L2924/1461 , H01L2924/15153 , H01L2924/15311 , H01L2924/19105 , H05K1/0203 , H05K1/141 , H05K3/3436 , H05K3/4611 , H05K3/4697 , H05K2201/1056 , H05K2201/10674 , Y10T29/49124 , Y10T29/53174 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit laminate includes recessed pockets each having printed circuit traces atop its floor. Inside the recessed pockets are power MOSFET and other circuit components bonded to the printed circuit traces. As the circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity. Additionally, some circuit components can be provided with a front-side bonding layer that is also bonded to the front surface cover board to realize a double-side bonding to the interior of the power module. Methods for making the low profile power module are also described.
摘要翻译：提出了一种功率模块来封装具有倒装芯片功率MOSFET器件的电子系统。功率模块包括前表面盖板和与其结合的多层印刷电路层压板。值得注意的是，印刷电路层压板的前表面包括各自在其地板的顶部具有印刷电路迹线的凹陷凹坑。凹槽内的是功率MOSFET和其他与印刷电路迹线结合的电路元件。由于电路组件被封装在功率模块内，因此具有低外形，增加的机械稳定性和EMI / RFI抗扰度。此外，一些电路部件可以设置有前结合层，其也结合到前表面盖板，以实现与电源模块的内部的双面接合。还描述了制造低轮廓功率模块的方法。

90. 发明授权

US08050037B2 Electronic control device using LC module structure 失效
标题翻译：电子控制装置采用LC模块结构
公开(公告)号：US08050037B2
公开(公告)日：2011-11-01
申请号：US12190624
申请日：2008-08-13
申请人： Nobutake Tsuyuno , Hideto Yoshinari , Hiroshi Hozoji , Masahiko Asano , Masahide Harada , Shinya Kawakita
发明人： Nobutake Tsuyuno , Hideto Yoshinari , Hiroshi Hozoji , Masahiko Asano , Masahide Harada , Shinya Kawakita
IPC分类号： H05K7/20
CPC分类号： H05K7/20454 , H05K1/0203 , H05K1/141 , H05K7/20854 , H05K2201/10015 , H05K2201/1003 , H05K2201/10189 , H05K2201/10303 , H05K2201/1056 , Y10T29/49147
摘要： In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.
摘要翻译：在包括至少包括线圈和电容器的两种或更多种引线插入型部件的电子控制装置中，将部件安装在具有布线，端子结构和机械固定部分的支撑件上; 上述部件的引线分别插入形成在支撑体的布线部分中的孔并与其电连接; 部件和支撑件用粘合材料固定在一起，用于固定; 部件的上表面附着在介于其间的具有低弹性模量的导热材料的金属凹槽; 支撑体的机械固定部分固定在金属凹槽上; 并且支撑件的端子结构电连接到安装至少一个控制元件的电路板。

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