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81. 发明授权

US09437820B2 Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same 有权
标题翻译：基板层叠下膜和基板层压结构以及使用其形成有机发光显示装置的方法
公开(公告)号：US09437820B2
公开(公告)日：2016-09-06
申请号：US14040540
申请日：2013-09-27
申请人： Samsung Display Co., Ltd.
发明人： Jin Han Park
IPC分类号： B32B3/10 , B32B7/06 , B32B7/14 , B32B37/12 , B32B37/18 , B32B37/30 , B32B38/10 , B32B43/00 , H01L51/56 , H01L51/00 , H01L51/50 , B32B37/00 , B32B3/26
CPC分类号： H01L51/003 , B32B3/26 , B32B7/06 , B32B7/14 , B32B37/025 , B32B37/12 , B32B37/1207 , B32B37/1292 , B32B37/18 , B32B37/185 , B32B37/187 , B32B38/10 , B32B43/00 , H01L51/0013 , H01L51/50 , Y10T156/10 , Y10T428/23 , Y10T428/24331 , Y10T428/24752 , Y10T428/24802 , Y10T428/24843 , Y10T428/24942 , Y10T428/24959 , Y10T428/2843 , Y10T428/2848
摘要： A substrate laminating low film, a substrate laminated structure and a method of manufacturing an organic light emitting display are disclosed. One inventive aspect includes a base member, a first adhesion layer formed on the base member, and a second adhesion layer formed on the first adhesion layer. The second adhesion layer has a second adhesion strength less than the first adhesion strength of the first adhesion layer.
摘要翻译：公开了一种基板层叠低膜，基板层叠结构和制造有机发光显示器的方法。本发明的一个方面包括基底构件，形成在基底构件上的第一粘合层和形成在第一粘合层上的第二粘附层。第二粘附层具有小于第一粘合层的第一粘附强度的第二粘合强度。

82. 发明申请

US20160251548A1 CYANOACRYLATE COMPOSITION 审中-公开
标题翻译：氰基丙烯酸酯组合物
公开(公告)号：US20160251548A1
公开(公告)日：2016-09-01
申请号：US15027302
申请日：2014-10-22
申请人： AFINITICA TECHNOLOGIES, S. L.
发明人： Ciaran MCARDLE , Arnau PEJOAN JIMÉNEZ , Juan Andrés LÓPEZ MAESO , Stefano GHERARDI
IPC分类号： C09J4/00 , B32B43/00 , C09J5/00 , C08F122/32 , C04B28/18
CPC分类号： C09J4/00 , B29C65/484 , B29C73/02 , B32B43/00 , B32B2037/1261 , C04B28/188 , C04B2103/0046 , C04B2103/0085 , C04B2103/10 , C04B2103/44 , C04B2111/00663 , C08F122/32 , C08F222/32 , C08K3/34 , C09J5/00 , C09J11/04 , C09J2433/00
摘要： The present invention relates to a cyanoacrylate composition having a heterogeneous curing initiator which is a hydrated calcium silicate. The composition is suitable for repairing and filling depressions, cracks, or holes in a substrate or between substrates to be bonded. It also relates to an adhesive comprising said composition, to a syringe containing it, to a method for bonding substrates, to the use of said composition, and to the use of said hydrated calcium silicate as curing agent for cyanoacrylate compositions.
摘要翻译：本发明涉及具有水合硅酸钙的非均相固化引发剂的氰基丙烯酸酯组合物。该组合物适用于修补和填充衬底中或要接合的衬底之间的凹陷，裂缝或孔。它还涉及包含所述组合物的粘合剂，含有它的注射器，用于粘合基材的方法，所述组合物的用途以及所述水合硅酸钙作为氰基丙烯酸酯组合物的固化剂的用途。

83. 发明申请

US20160229171A1 Multi-Stage Debulk and Compaction of Thick Composite Repair Laminates 审中-公开
公开(公告)号：US20160229171A1
公开(公告)日：2016-08-11
申请号：US15132328
申请日：2016-04-19
申请人： Textron Innovations Inc.
发明人： Denver Ray Whitworth , Vance Newton Cribb, III , Dumitru Radu Jitariu
IPC分类号： B32B43/00 , B32B37/06 , B32B37/10
CPC分类号： B32B37/1018 , B29C37/0075 , B29C73/10 , B32B37/06 , B32B38/10 , B32B43/00 , B32B2305/72 , B32B2605/18 , Y10T428/20
摘要： A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a release film to the exposed surface and forming an uncured ply stack assembly on the release film. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The release film and ply stack assembly is then removed from the exposed surface. A bonding material is then applied to the exposed surface, and the uncured ply stack assembly is applied to the bonding material. The ply stack assembly and bonding material are then cured.

84. 发明授权

US09393768B2 Discretely tailored multi-zone bondline for fail-safe structural repair 有权
公开(公告)号：US09393768B2
公开(公告)日：2016-07-19
申请号：US14085514
申请日：2013-11-20
申请人： The Boeing Company
发明人： Eugene A. Dan-Jumbo , Russell L. Keller , Everett A. Westerman
IPC分类号： B29C73/10 , B32B43/00 , B64F5/00 , B29L31/30 , B64C1/00
CPC分类号： B32B43/00 , B29C73/10 , B29L2031/3076 , B64C2001/0072 , B64F5/40 , Y02T50/43 , Y10T428/20 , Y10T428/21 , Y10T428/24942 , Y10T428/24959 , Y10T428/24992 , Y10T428/26
摘要： A repair patch for reworking an inconsistent area of a composite structure includes a patch body adapted to cover the inconsistent area and having a first patch region, a second patch region outside the first patch region and a first separation zone between the first patch region and the second patch region, with the first patch region, the first separation zone and the second patch region having increasing interlaminar fracture toughness from a center to an edge of the patch body; and a layer of adhesive for bonding the patch body to the composite structure.

85. 发明授权

US09314979B1 Trapezoidal rework patch 有权
标题翻译：梯形返修片
公开(公告)号：US09314979B1
公开(公告)日：2016-04-19
申请号：US13943124
申请日：2013-07-16
申请人： The Boeing Company
发明人： Eugene A. Dan-Jumbo , Russell Lee Keller
IPC分类号： B29C73/10 , B32B7/14 , B32B43/00
CPC分类号： B29C73/10 , B32B5/22 , B32B5/26 , B32B7/12 , B32B7/14 , B32B43/00 , B32B2250/20 , B32B2250/44 , B32B2260/021 , B32B2260/046 , B32B2307/50 , B32B2307/718 , B32B2605/18 , Y10T428/20
摘要： A composite rework patch and method. The composite rework patch comprises a trapezoidal shape, a first region, and a second region. The trapezoidal has a first base and a second base, the first base parallel to the second base. The first region comprises a first composite material portion and a first adhesive portion. The second region comprises a second composite material portion and a second adhesive portion.
摘要翻译：复合返修补丁和方法。所述复合返修贴片包括梯形形状，第一区域和第二区域。梯形具有第一基座和第二基座，第一基座平行于第二基座。第一区域包括第一复合材料部分和第一粘合剂部分。第二区域包括第二复合材料部分和第二粘合剂部分。

86. 发明授权

US09180632B2 Composite self-healing system 有权
标题翻译：复合自愈系统
公开(公告)号：US09180632B2
公开(公告)日：2015-11-10
申请号：US14198091
申请日：2014-03-05
申请人： Cornerstone Research Group, Inc.
发明人： Christopher Douglas Hemmelgarn , Thomas Wood Margraf , David Ernest Havens , John Lewis Reed , Logan Wayne Snyder , Anthony Louderbough , Benjamin Allen Dietsch
IPC分类号： B29C73/18 , B29C35/02 , B29C73/22 , B32B43/00
CPC分类号： B29C73/18 , B29C35/0272 , B29C73/22 , B32B43/00
摘要： An advanced reflexive structure system is disclosed. The reflexive system mimics the pain withdrawal reflex on which the human body relies. The reflexive system incorporates a continuous health and performance monitoring system via an embedded dielectric film, an adaptive composite structure based on shape memory composite material, and an intelligence system which will be interfaced with both the health/performance sensors and the adaptive structure. When activated shape memory polymer will recover its structural integrity via shape recovery and a reptation healing process. These features enable the use of SMP as an adaptive structure in the proposed reflexive system. The development of a reflexive system for structures will enable increased safety and security and demonstrate a better understanding of integrated performance systems. This reflexive technology could find immediate implementation on all current and future systems and future implementation on platforms such as the International Space Station, Lunar, and Martian habitats.
摘要翻译：公开了一种先进的反射结构系统。反身系统模仿人体所依赖的止痛反射。反射系统通过嵌入式电介质膜，基于形状记忆复合材料的自适应复合结构和将与健康/性能传感器和自适应结构接口的智能系统结合了连续的健康和性能监测系统。当活化的形状记忆聚合物将通过形状恢复和爬行愈合过程恢复其结构完整性。这些特征使得在建议的反身系统中使用SMP作为自适应结构。开发结构的反身系统将增强安全性和安全性，并更好地了解综合性能系统。这种反身技术可以立即实施所有当前和未来的系统，以及将来在国际空间站，农历和火星栖息地等平台上的实施。

87. 发明申请

US20150314585A1 Methods to form and to dismantle hermetically sealed chambers 有权
标题翻译：形成和拆除密封室的方法
公开(公告)号：US20150314585A1
公开(公告)日：2015-11-05
申请号：US14270265
申请日：2014-05-05
申请人： Raymond Miller Karam , Thomas Wynne , Anthony Thomas Chobot
发明人： Raymond Miller Karam , Thomas Wynne , Anthony Thomas Chobot
IPC分类号： B32B43/00 , B32B38/00
CPC分类号： B32B43/006 , B01L3/50273 , B01L2200/0689 , B01L2300/0816 , B01L2300/0887 , B01L2400/0481 , B32B37/0076 , B32B37/06 , B32B38/0008 , B32B38/0036 , B32B43/00 , B32B2037/0092 , B32B2310/00 , B32B2310/0843 , B32B2439/80 , B32B2535/00 , Y10T156/1195 , Y10T156/1972
摘要： Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.
摘要翻译：实施例通常涉及用于形成和拆除密封室的方法。在一个实施例中，该方法包括使用室温激光焊接以在第一元件和第二元件之间产生气密密封以形成腔室。气密密封件的粘合界面构造成允许气密密封件在受控条件下使用释放技术打开。在一个实施例中，腔室形成在微流体芯片内并且腔室被配置为保持流体。在一个实施例中，芯片包括接合第一和第二元件以形成第一腔室的第一密封密封件和粘合第三和第四元件的第二密封件，以形成包围第一腔室的第二腔室。通过应用机械或热技术，第一密封件可以独立于第二密封件而断开。

88. 发明授权

US09095944B2 Work setting apparatus, work setting method, and work holder removing method 有权
标题翻译：工作设定装置，工作设定方法以及工位拆除方法
公开(公告)号：US09095944B2
公开(公告)日：2015-08-04
申请号：US13691574
申请日：2012-11-30
申请人： Toshiba Kikai Kabushiki Kaisha
发明人： Mitsunori Kokubo , Yuki Sugiura , Toru Suzuki , Hidetoshi Kitahara
IPC分类号： B23Q3/08 , B23Q7/00 , B25B11/00 , B29C43/36 , B32B37/10 , B32B43/00 , B29C43/02 , B32B37/00 , B32B37/12 , B32B38/18 , B32B41/00 , B32B38/06 , B29C43/50 , B29C43/58
CPC分类号： B23Q7/00 , B23Q3/088 , B25B11/005 , B29C43/021 , B29C43/36 , B29C2043/025 , B29C2043/5092 , B29C2043/5833 , B32B37/0007 , B32B37/003 , B32B37/10 , B32B37/1009 , B32B37/1018 , B32B37/1207 , B32B38/06 , B32B38/1841 , B32B38/1858 , B32B43/00 , B32B2041/04 , B32B2309/68 , B32B2309/70 , B32B2310/0831 , B32B2315/08 , B32B2457/202 , B32B2551/00 , Y10T29/49822 , Y10T29/49826 , Y10T29/53096 , Y10T29/53535
摘要： A work setting apparatus includes a lower table 15, an upper table 17, and a work holding unit 19 provided with a plurality of work holders 25 each having an adhesive to hold a work. A work setting method sets a second work W2 held by the work holders 25 onto a first work W1 set on the lower table 17. A work holder removing method removes the work holders 25 from the second work W2 set on the first work W1 by vibrating the first and second works W1 and W2 on the lower table 15.
摘要翻译：工作设定装置包括下台15，上台17和工件保持单元19，工件保持单元19设置有多个工件保持件25，每个工件保持件25具有用于保持工件的粘合剂。工件设定方法将由工件保持器25保持的第二工件W2设置在设置在下台17上的第一工件W1上。工件保持件拆除方法通过振动从设置在第一工件W1上的第二工件W2移除工件保持件25 下表15上的第一和第二工件W1和W2。

89. 发明授权

US09073299B2 Method and a spraying device for the repair of a sandwich plate 有权
标题翻译：一种用于修复夹层板的方法和喷涂装置
公开(公告)号：US09073299B2
公开(公告)日：2015-07-07
申请号：US12846116
申请日：2010-07-29
申请人： Berend Schoke , Michael Doecker
发明人： Berend Schoke , Michael Doecker
IPC分类号： B32B43/00 , B32B3/12 , B05D7/00 , B05D7/22 , B29C73/02 , B32B5/28 , B32B27/02 , B32B27/04 , B32B27/12 , B32B27/34 , B32B27/38 , B64F5/00 , B05B7/24 , B29C73/26
CPC分类号： B32B43/00 , B05B7/2472 , B05D7/22 , B29C73/02 , B29C73/025 , B29C73/26 , B32B3/12 , B32B5/02 , B32B5/22 , B32B5/26 , B32B5/28 , B32B15/20 , B32B27/02 , B32B27/04 , B32B27/12 , B32B27/34 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/106 , B32B2305/024 , B32B2305/028 , B32B2307/50 , B32B2307/714 , B32B2307/718 , B32B2307/7265 , B32B2398/10 , B32B2605/18 , B64F5/40
摘要： A method for the repair of a sandwich plate having a core structure, a top surface layer and a bottom surface layer and a plurality of honeycomb-shaped cells includes providing at least one penetrating drill hole in at least one of the top surface layer and the bottom surface layer above one of the plurality of honeycomb-shaped cells in a damaged region of the sandwich plate, injecting a stabilising material into the honeycomb-shaped cell, and filling the damaged region with a filler material.
摘要翻译：一种用于修复具有芯结构，顶表面层和底表面层和多个蜂窝状电池的夹层板的方法包括在顶表面层和第二表面层中的至少一个中提供至少一个穿透钻孔，在夹层板的受损区域中的多个蜂窝状电池中的一个上方的底面层，向蜂窝状电池注入稳定化材料，并用填充材料填充损伤区域。

90. 发明申请

US20150188085A1 ENCAPSULATION FILM 有权
标题翻译：封装膜
公开(公告)号：US20150188085A1
公开(公告)日：2015-07-02
申请号：US14323867
申请日：2014-07-03
申请人： LG CHEM, LTD.
发明人： Hyun Jee YOO , Yoon Gyung CHO , Suk Ky CHANG , Jung Sup SHIM , Seung Min LEE
IPC分类号： H01L51/52 , C09D163/00 , C09D123/22
CPC分类号： H01L51/5259 , B32B3/04 , B32B27/08 , B32B27/18 , B32B37/10 , B32B37/142 , B32B43/00 , B32B2037/1223 , B32B2037/243 , B32B2307/54 , B32B2307/7265 , B32B2309/02 , B32B2309/04 , B32B2309/10 , B32B2309/105 , B32B2310/0831 , B32B2315/08 , B32B2457/00 , B32B2457/20 , B32B2457/206 , C09D123/22 , C09D163/00 , H01L21/56 , H01L23/293 , H01L51/524 , H01L51/5253 , H01L51/56 , H01L2924/0002 , H05B33/04 , Y10T156/10 , Y10T428/24942 , Y10T428/31511 , Y10T428/31931 , Y10T428/31938 , H01L2924/00
摘要： Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.
摘要翻译：提供一种封装膜，电子器件及其制造方法。可以提供具有优异的防湿性，可操作性，可加工性和耐久性的包封膜以及包含用封装膜封装的二极管的结构。

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