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81. 发明授权

US07241637B2 Method of producing LED bodies with the aid of a cross-sectional constriction 有权
标题翻译：借助横截面收缩制造LED体的方法
公开(公告)号：US07241637B2
公开(公告)日：2007-07-10
申请号：US10528007
申请日：2003-09-15
申请人： Thomas Manth
发明人： Thomas Manth
IPC分类号： H01L21/44
CPC分类号： B29C45/14655 , B29C45/0046 , B29C45/14836 , B29C45/33 , H01L33/52 , H01L2924/0002 , H01L2924/00
摘要： Method of producing light-conducting LED bodies of a free-flowing material by introduction into a mold. Here, the volumetric flow of a free-flowing material, at a distance of the electrode plane from the charging point that is greater than 35% of the distance between the charging point and the mold side of the mold situated opposite the charging point—above the charging point and below the chip plane on the mold side of the charging point, is choked by at least one cross-sectional constriction, while—at a distance that is smaller than or equal to 35% of this distance—choking takes place on the mold side situated opposite the charging point. The present invention develops a method of producing light-conducting LED bodies in which, at customary output capacities of the molding operation, the LED electronics are not damaged.
摘要翻译：通过引入模具制造自由流动材料的导光LED体的方法。这里，自由流动材料的体积流量在电极平面与充电点的距离处大于充电点和模具侧的模具侧之间的距离的35％，位于与充电点相对的模具侧在充电点的模具侧的充电点和芯片平面下方的至少一个横截面收缩被阻塞，而在该距离扼流的小于或等于35％的距离处发生模具侧与充电点相对。本发明开发了一种制造导光LED体的方法，其中在模制操作的常规输出容量下，LED电子器件不被损坏。

82. 发明申请

US20070152229A1 Light emitting apparatus method for producing it and assembly incorporating it 有权
标题翻译：用于制造它的发光装置方法及其结合的装置
公开(公告)号：US20070152229A1
公开(公告)日：2007-07-05
申请号：US11647603
申请日：2006-12-29
申请人： Kazuhiro Yoshida , Mitsunori Ishizaka
发明人： Kazuhiro Yoshida , Mitsunori Ishizaka
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： B29C45/14655 , B29C45/34 , B29L2011/0016 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48227 , H01L2924/1815 , H01L2924/00014
摘要： A light emitting apparatus including a substrate, at least one light emitting diode chip mounted on the substrate, a light-transmitting member disposed on the substrate to form a space between the light-transmitting member and the substrate, and a resin disposed in the space to seal the light emitting diode chip, the light-transmitting member including at least one resin-injection inlet and at least one air vent, the space being filled with the resin injected into the space through the resin-injection inlet.
摘要翻译：一种发光装置，包括基板，安装在基板上的至少一个发光二极管芯片，设置在基板上以形成透光部件和基板之间的空间的透光部件，以及设置在该空间中的树脂为了密封发光二极管芯片，所述透光构件包括至少一个树脂注入入口和至少一个排气口，所述空间填充有通过树脂注入口注入到空间中的树脂。

83. 发明申请

US20070145255A1 LENS-EQUIPPED LIGHT-EMITTING DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：透镜装置的发光二极管装置及其制造方法
公开(公告)号：US20070145255A1
公开(公告)日：2007-06-28
申请号：US11613503
申请日：2006-12-20
申请人： Shouichi Nishikawa , Tetsuro Komatsu , Hatsuo Takezawa , Yukinori Aoki
发明人： Shouichi Nishikawa , Tetsuro Komatsu , Hatsuo Takezawa , Yukinori Aoki
IPC分类号： H01J5/02 , H01J40/14
CPC分类号： H01L33/58 , B29C45/14655 , B29C45/1671 , B29L2011/0016 , H01L33/54 , H01L2224/48247
摘要： A lens-equipped light-emitting diode device of the present invention includes a lead frame in which an electrode is formed, a light-emitting diode which is mounted on the electrode of the lead frame, an outer peripheral unit which is made of a first resin, which is provided on the lead frame, and in which a hollow portion is formed while an area including at least the light-emitting diode is exposed in the outer peripheral unit, a sealing portion which is made of a second resin filled in the lead frame of the hollow portion of the outer peripheral unit, and which seals the light-emitting diode, and a lens unit made of a third resin laminated and filled in the sealing portion.
摘要翻译：本发明的带镜头的发光二极管装置包括：其中形成有电极的引线框架，安装在引线框架的电极上的发光二极管，外部单元，其由第一树脂，其设置在引线框架上，并且其中形成中空部分，同时至少包括发光二极管的区域在外周单元中露出;密封部分，由填充在所述外部单元中的第二树脂制成; 外周单元的中空部分的引线框架，并且密封发光二极管，以及由层压并填充在密封部分中的由第三树脂制成的透镜单元。

84. 发明授权

US07220615B2 Alternative method used to package multimedia card by transfer molding 有权
标题翻译：用于通过传递成型封装多媒体卡的替代方法
公开(公告)号：US07220615B2
公开(公告)日：2007-05-22
申请号：US09878302
申请日：2001-06-11
申请人： Todd O. Bolken
发明人： Todd O. Bolken
IPC分类号： H01L21/66 , H01L21/00 , H01L21/44 , H05K1/14 , H05K5/00
CPC分类号： H05K3/284 , B29C45/1418 , B29C45/14647 , B29C45/14655 , H01L21/565 , H01L23/3121 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/01087 , H01L2924/181 , H01L2924/19041 , H05K3/0052 , Y10T29/49144 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor card is made by a disclosed method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral opening. The connecting segments are motivated downward by pins outside of the card periphery, holding the substrate against a lower level of the mold cavity during molding. Molded wings extending laterally from the card periphery are also formed. Following molding and curing, the casting is removed and the card singulated by excising the wings from the card. The resulting card has smooth edge surfaces and precise dimensions. Separate glob top encapsulation is avoided.
摘要翻译：通过公开的方法制造半导体卡，在一个模制步骤中，通过跨越周边开口的窄连接段在附接到周围框架的基板上形成塑料体。连接段通过卡周围的销钉向下推动，在模制期间将基板保持在模腔的较低水平面上。还形成了从卡周边横向延伸的成型翼。在模制和固化之后，移除铸件并且通过从卡片上切下翅膀将卡片分割开来。所得到的卡片具有光滑的边缘表面和精确的尺寸。避免了单独的球顶封装。

85. 发明申请

US20070102848A1 Apparatus for Extruding Polymers Employing Microwave Energy 失效
标题翻译：用于挤出使用微波能量的聚合物的装置
公开(公告)号：US20070102848A1
公开(公告)日：2007-05-10
申请号：US11563315
申请日：2006-11-27
申请人： Jan Weber , Scott Schewe
发明人： Jan Weber , Scott Schewe
IPC分类号： H05B6/64 , B29C35/10
CPC分类号： A61M25/1029 , A61M25/1027 , A61M25/1034 , A61M25/1036 , B29B13/024 , B29C33/06 , B29C35/0805 , B29C45/14655 , B29C47/0023 , B29C47/0026 , B29C47/0033 , B29C47/0071 , B29C47/86 , B29C47/862 , B29C47/8835 , B29C47/884 , B29C47/8895 , B29C47/903 , B29C47/907 , B29C49/0042 , B29C49/64 , B29C49/66 , B29C49/78 , B29C49/783 , B29C2035/0855 , B29C2049/0089 , B29C2793/009 , B29K2105/258 , B29L2022/022 , B29L2031/7542 , H05B6/80
摘要： An apparatus and method for molding balloon catheters is disclosed. The balloon may be molded by providing a polymeric tube within a mold having an interior cavity in the shape of the desired balloon. Microwave energy, which may be generated by a gyrotron, may then be directed toward the mold, to heat the polymeric material without heating the mold. Once heated, pressurized fluid may be injected into the tube to blow the polymeric material against the interior cavity whereupon the material can cool to form the balloon or can be further heatset by additional microwave energy and be cooled to form the balloon. In accordance with one embodiment, microwave energy can also be used without a mold to form a medical device. A polymer extrusion apparatus is disclosed utilizing a microwave energy for heating polymer feedstock material within the extruder tip and die unit just prior to formation of the extrudate product. A cooling bath mechanism, which in one embodiment can also include a cooling tube member having a cooling medium forced therethrough, is also disclosed. An apparatus for preparing polymer disk members, to use as the polymer feedstock material for the microwave extrusion apparatus, is also disclosed. Apparatus for interconnecting and rotating the polymer disk members, the die tip, or the die, or any combination thereof, for creating angularity characteristics in the polymer extrudate, is also disclosed.
摘要翻译：公开了一种用于模制球囊导管的装置和方法。可以通过在具有所需球囊形状的内部空腔的模具内提供聚合物管来模制球囊。可以由陀螺仪产生的微波能量然后可以被引向模具，以加热聚合材料而不加热模具。一旦加热，加压流体可以被注入到管中以将聚合物材料吹向内部空腔，由此该材料可以冷却以形成球囊，或者可以通过额外的微波能量进一步热固并被冷却以形成气囊。根据一个实施例，微波能量也可以在没有模具的情况下用于形成医疗装置。公开了一种聚合物挤出设备，其利用微波能量来在挤出物产物形成之前在挤出机顶端和模具单元内加热聚合物原料。还公开了一种冷却浴机构，其在一个实施例中还可以包括具有强制通过其中的冷却介质的冷却管构件。还公开了一种用于制备用于微波挤出装置的聚合物原料的聚合物盘构件的装置。还公开了用于互连和旋转聚合物盘构件，模头或模具或其任何组合的装置，用于在聚合物挤出物中产生角度特性。

86. 发明申请

US20070054530A1 Plastic housing composition for embedding semicondutor devices in a plastic housing and use of the plastic housing composition 有权
标题翻译：塑料外壳组合物，用于将半导体器件嵌入塑料外壳中并使用塑料外壳组合物
公开(公告)号：US20070054530A1
公开(公告)日：2007-03-08
申请号：US11511518
申请日：2006-08-29
申请人： Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
发明人： Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
IPC分类号： H01R13/52
CPC分类号： H01L23/293 , B29C45/0001 , B29C45/0013 , B29C45/14655 , B29K2101/10 , C08J3/241 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A plastic housing composition for embedding semiconductor devices in a plastic housing includes a multicomponent plastic material, where at least one component is distributed in the plastic material in drop-shaped and/or spherical units. The drop-shaped and/or spherical units are surrounded by dimensionally stable sheaths made from a plastic sheath material. The multicomponent plastic further includes a reactive curing system that cures when the plastic sheaths are torn open. The dimensionally stable plastic sheath material is deformation-sensitive, so that the sheaths tear open under mechanical deformation loading, which initiates and/or accelerates the curing process.
摘要翻译：用于将半导体器件嵌入塑料壳体中的塑料外壳组合物包括多组分塑料材料，其中至少一种组分以液滴形式和/或球形单元分布在塑料材料中。液滴形状和/或球形单元被由塑料护套材料制成的尺寸稳定的护套包围。多组分塑料还包括当塑料护套被撕开时固化的反应性固化体系。尺寸稳定的塑料护套材料是变形敏感的，使得护套在机械变形负载下撕开，这引发和/或加速固化过程。

87. 发明申请

US20070013040A1 PACKAGING OF A MICROCHIP DEVICE 失效
标题翻译： MICROCHIP设备的包装
公开(公告)号：US20070013040A1
公开(公告)日：2007-01-18
申请号：US11534034
申请日：2006-09-21
申请人： Wang Khiang
发明人： Wang Khiang
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L21/565 , B29C45/0046 , B29C45/14655 , H01L21/56 , H01L23/13 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L24/48 , H01L24/97 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32225 , H01L2224/45014 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention is directed to an interposer for packaging a microchip device, which includes a plurality of electrical contacts on an outer side of the interposer, for electrically contacting the packaged microchip device and to be electrically connected with the microchip device. There is an aperture extending from the outer side into the interposer. The aperture may be divided into at least two openings, and at least a first of the openings may extend from the outer side through the interposer in order to allow connection to the microchip device.
摘要翻译：本发明涉及一种用于封装微芯片器件的插入器，其包括在插入器的外侧上的多个电触头，用于电接触封装的微芯片器件并与微芯片器件电连接。存在从外侧延伸到插入件中的孔。孔可以被分成至少两个开口，并且至少第一个开口可以从外侧延伸穿过插入件，以便允许连接到微芯片器件。

88. 发明申请

US20060281229A1 Method for molding a small form factor digital memory card 有权
标题翻译：用于成型小型数字存储卡的方法
公开(公告)号：US20060281229A1
公开(公告)日：2006-12-14
申请号：US11148999
申请日：2005-06-10
申请人： Wei Koh , Ben Chen , David Chen
发明人： Wei Koh , Ben Chen , David Chen
IPC分类号： H01L21/00
CPC分类号： H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/14836 , B29C45/2708 , H01L21/565 , H01L2924/0002 , H05K1/117 , H05K2201/10159 , H05K2201/10689 , H05K2201/10734 , H05K2203/1311 , H05K2203/1316 , H05K2203/304 , H01L2924/00
摘要： A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash IC and a (e.g., land grad array) controller package for enclosing a controller IC are mounted on a printed wiring board within a mold cavity. A high melt flow index resin is injected into the mold cavity to form an integral, solid body within which to completely encapsulate the flash IC and controller packages and form a cover over top the flash IC package so as to maintain the required memory card height tolerance. In one embodiment, the resin material is injected downwardly into the mold cavity from locations above the respective rows of leads of the flash IC package. In another embodiment, the resin material is injected laterally into the mold body from locations at opposite sides thereof adjacent the respective rows of leads of the flash IC package.
摘要翻译：一种用于模制数字存储存储卡的方法，例如多媒体卡（MMC），安全数字卡（SD）和类似的小尺寸数字存储卡。包括例如用于封装闪存IC的引线框架（TSOP）封装和用于封闭控制器IC的（例如，平台梯度阵列）控制器封装件的PCA子组件安装在模具腔内的印刷线路板上。将高熔体流动指数树脂注入到模腔中以形成整体的固体，其中完全封装闪存IC和控制器封装，并在闪存IC封装之上形成盖子，以便保持所需的存储卡高度公差。在一个实施例中，将树脂材料从闪存IC封装的相应引线行上方的位置向下注入模腔中。在另一个实施例中，树脂材料从相邻于闪光IC封装的引线行的相对侧的位置侧向注入模具体。

89. 发明申请

US20060255435A1 Method for encapsulating a semiconductor device and semiconductor device 审中-公开
标题翻译：封装半导体器件和半导体器件的方法
公开(公告)号：US20060255435A1
公开(公告)日：2006-11-16
申请号：US11388551
申请日：2006-03-24
申请人： Edward Fuergut , Holger Woerner
发明人： Edward Fuergut , Holger Woerner
IPC分类号： H01L23/495
CPC分类号： B29C45/14655 , B29C45/02 , H01L21/565 , H01L23/16 , H01L23/31 , H01L23/3121 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2224/85 , H01L2924/00014 , H01L2924/01068 , H01L2924/181 , H03H9/10 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： One aspect of the invention relates to a method for encapsulating a semiconductor device which has at least one semiconductor chip arranged on a substrate. The method includes application of an elastic dam to the semiconductor chip, introduction of the semiconductor chip arranged on the substrate into a mold including a lower mold half and an upper mold half, closing of the mold so that the elastic dam is completely contacted by an inner surface of the upper mold half, and encapsulation of the semiconductor device with a molding compound.
摘要翻译：本发明的一个方面涉及一种用于封装半导体器件的方法，该半导体器件具有布置在衬底上的至少一个半导体芯片。该方法包括向半导体芯片施加弹性坝，将布置在基板上的半导体芯片引入包括下半模和上半模的模具中，关闭模具，使得弹性坝完全接触上半模的内表面，以及用模塑料封装半导体器件。

90. 发明授权

US07129115B2 Packaging of a microchip device 失效
标题翻译：微芯片器件的封装
公开(公告)号：US07129115B2
公开(公告)日：2006-10-31
申请号：US10312588
申请日：2002-06-19
申请人： Wang Chuen Khiang
发明人： Wang Chuen Khiang
IPC分类号： H01L21/44
CPC分类号： H01L21/565 , B29C45/0046 , B29C45/14655 , H01L21/56 , H01L23/13 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L24/48 , H01L24/97 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32225 , H01L2224/45014 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are located to the surface of the microchip devices. Electrical contacts on the microchip device surface are accessible through the aperture in order to electrically connect the electrical contacts with the external electrical contacts of the interposer. The interposer includes separate openings or aperture regions, in particular separated by a bridge, which extend from the interposer surface where the external contacts are located into the interposer. This facilitates the handling of the finalized package and allows for satisfactory filling of the aperture with filling material.
摘要翻译：包装微芯片器件的方法，用于封装的插入器和封装的微芯片器件。插入器放置在微芯片器件上。插入器包括从外部电触点所在的插入件表面延伸到微芯片器件的表面的孔。微芯片器件表面上的电触点可通过孔径接近，以便将电触点与插入器的外部电触点电连接。插入器包括单独的开口或开口区域，特别地由桥隔开，其从外部触点所在的插入件表面延伸到插入器中。这有助于处理完成的包装并且允许用填充材料满意地填充孔。

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