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    • 87. 发明授权
    • Laser drilling system and method
    • 激光钻孔系统及方法
    • US07569794B2
    • 2009-08-04
    • US10957428
    • 2004-10-01
    • Joaquina FaourAlejandro Iseruk
    • Joaquina FaourAlejandro Iseruk
    • B41F17/36B65G47/22B23K26/36
    • B23K26/0853A61J3/10B23K26/382B23K26/389B23K26/40B23K2101/35B23K2103/50
    • The present invention provides a laser drilling system for drilling holes or cavities in a solid, in particular a solid dosage form. The system includes a loading zone, firing zone, inspection zone and delivery zone. The system also includes optional components such as a process validation system, solids detector, color detector, solids rejection/repositioning means, accepted products receptacle, rejected products receptacle and/or solids inspection system. Operation of the laser device in the firing zone and of other optional equipment is synchronized with movement of a continuous solids indexer by way of an electronic synchronizer. A solids handling system includes an optional fill level detector that directly or indirectly controls solids loading means that fills a solids reservoir. The system can be run continuously, semicontinuously or batchwise. A solids rejection system in the system provides for reduced solids loss as compared to other laser drilling systems and solids recovery rates of 100% can be achieved.
    • 本发明提供一种用于在固体,特别是固体剂型中钻孔或空腔的激光钻孔系统。 该系统包括装载区,起火区,检查区和运送区。 该系统还包括可选组件,例如过程验证系统,固体检测器,颜色检测器,固体排斥/重新定位装置,接受的产品容器,被拒绝的产品容器和/或固体检查系统。 在激发区域和其他可选设备中的激光装置的操作与通过电子同步器的连续固体分度器的运动同步。 固体处理系统包括可选的填充液位检测器,其直接或间接地控制填充固体储存器的固体装载装置。 该系统可连续运行,半连续或间歇运行。 与其他激光钻孔系统相比,系统中的固体排除系统提供减少的固体损失,并且可以实现100%的固体回收率。