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81. 发明授权

US06791696B1 Automated optical measurement apparatus and method 有权
标题翻译：自动光学测量装置及方法
公开(公告)号：US06791696B1
公开(公告)日：2004-09-14
申请号：US09328972
申请日：1999-06-09
申请人： Stephen D. Fantone , Stephen R. Wilk , Jian Zhang , Daniel J. Braunstein
发明人： Stephen D. Fantone , Stephen R. Wilk , Jian Zhang , Daniel J. Braunstein
IPC分类号： G01B1124
CPC分类号： G01M11/025 , G01B11/00 , G01B11/24 , G01J9/00 , G01M11/0228 , G01M11/0235 , G01M11/0242 , G01M11/0257
摘要： An automated apparatus and method for measuring properties of optical components based on wavefront sensing and analysis. A wavefront of predetermined profile is directed at a surface to be measured so that it is more or less distorted in accordance with the shape of the surface and the distorted wavefront is sensed and analyzed. From the information derived from the distorted wavefront and other knowledge of the relationship between the surface and position of the wavefront of predetermined profile, the shape of the surface may be inferred along with other properties such as radius of curvature, focal length, conic constants, asphericity, toricity, tilt, and decentering. Concave, convex, cylindrical, and flat parts may be measured along with wavefront errors in bandpass transmitting components such as lenses, filters, and windows.
摘要翻译：一种用于基于波前感测和分析来测量光学部件的性质的自动化装置和方法。预定轮廓的波前指向要测量的表面，使得其根据表面的形状或多或少失真，并且检测和分析失真的波前。根据从失真的波前得到的信息和预定轮廓的波面的表面和位置之间的关系的其他知识，可以推断表面的形状以及其他属性，例如曲率半径，焦距，圆锥常数，非球面性，复曲面，倾斜和偏心。可以测量凹凸，圆柱形和平坦部分以及带通传输部件如透镜，滤光片和窗口中的波前误差。

82. 发明授权

US06722920B2 Electrical connector assembly with securement device 失效
标题翻译：带固定装置的电气连接器组件
公开(公告)号：US06722920B2
公开(公告)日：2004-04-20
申请号：US10266739
申请日：2002-10-07
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： H01R1373
CPC分类号： H01R13/639 , H01R12/7047 , H01R43/26
摘要： An electrical connector assembly (1) comprises an electric card (4), an insulative housing (20), an upper and lower rows of contacts (21) accommodated in the housing, and a pair of securement devices (3) assembled into the housing. The electric card defines a pair of through holes (41) therein. The housing comprises a main body (201) and a pair of support portions (200). Each support portion defines a groove (2020) and a receiving hole (2021) defined in the support portion from a bottom face of the groove. The securement device comprises a base portion (31), a protrusion (32) protruding downwardly from the base portion for being received into the groove, and a pair of opposite legs (33) extending downwardly from the protrusion. Each leg has an engaging face (332) abutting against a lower face (44) of the electric card to fix the electric card with the housing.
摘要翻译：电连接器组件（1）包括电卡（4），绝缘壳体（20），容纳在壳体中的上排和下排触点（21），以及一对组装到壳体中的固定装置（3）。电卡在其中限定一对通孔（41）。壳体包括主体（201）和一对支撑部分（200）。每个支撑部分从凹槽的底面限定在支撑部分中限定的凹槽（2020）和容纳孔（2021）。所述固定装置包括基部（31），从所述基部向下突出以被容纳在所述槽中的突起（32）以及从所述突起向下延伸的一对相对的支脚（33）。每个腿具有抵靠电卡的下表面（44）的接合面（332），以将电卡与壳体固定。

83. 发明授权

US06512795B1 Error concealment for video services 失效
标题翻译：错误隐藏视频服务
公开(公告)号：US06512795B1
公开(公告)日：2003-01-28
申请号：US09508546
申请日：2000-06-26
申请人： Jian Zhang , John Frederick Arnold , Michael Robert Frater
发明人： Jian Zhang , John Frederick Arnold , Michael Robert Frater
IPC分类号： H04N764
CPC分类号： H04N19/895 , G06T9/00 , H04N9/888
摘要： In compressed video signals, lost or erroneous information in a current image signal received at the receiving end of a transmission channel is concealed by identifying a motion compensated equivalent region in a previously transmitted image and substituting the equivalent region as a prediction of the lost or erroneous information in the current image.
摘要翻译：在压缩视频信号中，通过识别先前发送的图像中的运动补偿等效区域来隐藏在传输信道的接收端接收的当前图像信号中的丢失或错误的信息，并将等效区域替换为丢失或错误的预测当前图像中的信息。

84. 发明授权

US06449312B1 Method of estimating motion in interlaced video 有权
标题翻译：交错视频中运动估计方法
公开(公告)号：US06449312B1
公开(公告)日：2002-09-10
申请号：US09589705
申请日：2000-06-08
申请人： Jian Zhang , Reji Mathew
发明人： Jian Zhang , Reji Mathew
IPC分类号： H04N712
CPC分类号： H04N5/145 , H04N19/105 , H04N19/112 , H04N19/137
摘要： A method of estimating motion in interlaced video involves, firstly, a frame search (61), where a search is conducted for the frame structure using a sub-sampled block matching metric (e.g. sub-sampled SAD). The locations to be searched are either fixed or dynamically determined based on the minimum frame SAD (ie best frame block match). Next, pixel errors are calculated (62) for all pixels included in the sub-sampled block matching metric. Each pixel error is first identified as belonging to one of four field patterns (e.g. even-even, even-odd, odd-even and odd-odd). For each location, pixel errors can be classified into two field patterns, either even-even and odd-odd or even-odd and odd-even (63). The pixel errors belonging to the same field pattern are added together (64) to obtain field error values (eg field SAD values). The individual field error (or field SAD) values are used to determine (77-80) the field Motion Vectors. The location of the lowest field SAD value is taken as the position of best match. All pixel errors are then summed together (65) to obtain the frame error and the location of the lowest frame error (or frame SAD) is taken as the position of best match for the frame. The frame and field Motion Vectors can be refined by using a full block matching metric within the small search window (66, 73-76).
摘要翻译：估计隔行视频中的运动的方法首先涉及帧搜索（61），其中使用子采样块匹配度量（例如，子采样SAD）对帧结构进行搜索。要搜索的位置是基于最小帧SAD（即最佳帧块匹配）来固定或动态确定的。接下来，对于包括在子采样块匹配度量中的所有像素，计算（62）像素误差。首先将每个像素误差识别为属于四个场模式之一（例如，偶数均匀，偶数奇数，奇偶校验和奇数奇数）。对于每个位置，像素误差可分为偶数和奇数奇偶奇数奇数两种场模式（63）。属于相同场模式的像素误差被加在一起（64）以获得场误差值（例如场SAD值）。单个字段错误（或字段SAD）值用于确定（77-80）字段运动矢量。最低字段SAD值的位置作为最佳匹配的位置。然后将所有像素误差相加在一起（65）以获得帧错误，并且将最低帧错误（或帧SAD）的位置作为帧的最佳匹配位置。可以通过在小搜索窗口（66,73-76）内使用完整的块匹配度量来改进帧和场运动矢量。

85. 发明授权

US5952454A Linking compounds useful for coupling carbohydrates to amine-containing carriers 有权
标题翻译：用于将碳水化合物偶联至含胺载体的连接化合物
公开(公告)号：US5952454A
公开(公告)日：1999-09-14
申请号：US183053
申请日：1998-10-30
申请人： Pavol Kovac , Jian Zhang
发明人： Pavol Kovac , Jian Zhang
IPC分类号： A61K39/385 , C07H15/12 , C08G69/26
CPC分类号： C07H15/12 , A61K39/385 , A61K2039/6081 , A61K2039/627
摘要： The present invention provides a method to couple a glycosyl donor to an amine-containing carrier or substrate material using as a spacer a compound of the general formula I: ##STR1## in which n and m are each independently an integer of from 1 to 12, R.sub.1 and R.sub.2 are each independently H, lower alkyl, a hydroxyl group, or a substituent which does not interfere with the linking reactions, R.sub.4 and R.sub.5 are each independently H, lower alkyl, a hydroxyl group, or a substituent which does not interfere with the linking reactions, R.sub.3 and R'.sub.3 are each independently an optionally substituted lower alkyl or R.sub.3 and R'.sub.3 can be joined to form an optionally substituted cyclic moiety having from 2 to 5 carbon atoms.
摘要翻译：本发明提供了使用通式I化合物作为间隔物将糖供体偶联到含胺载体或底物材料的方法：其中n和m各自独立地为1至12的整数，R 1和 R2各自独立地为H，低级烷基，羟基或不干扰连接反应的取代基，R4和R5各自独立地为H，低级烷基，羟基或不干扰连接的取代基反应，R 3和R'3各自独立地是任选取代的低级烷基或R 3，且R'3可以连接形成任选取代的具有2至5个碳原子的环状部分。

86. 外观设计

USD984612S1 Fan heater 有权
公开(公告)号：USD984612S1
公开(公告)日：2023-04-25
申请号：US29856827
申请日：2022-10-18
申请人： Jian Zhang
设计人： Jian Zhang

87. 发明授权

US11440117B2 Multiple module chip manufacturing arrangement 有权
公开(公告)号：US11440117B2
公开(公告)日：2022-09-13
申请号：US16602396
申请日：2019-09-27
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： B23K3/00 , B23K3/047 , H01L23/00 , H01L21/68 , H01L21/687 , B23K3/06
摘要： A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.

88. 发明申请

US20200043759A1 Hot wall flux free solder ball treatment arrangement 审中-公开
公开(公告)号：US20200043759A1
公开(公告)日：2020-02-06
申请号：US15998295
申请日：2018-08-01
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： H01L21/67 , H01L21/687 , H01L21/677
摘要： A vertically oriented treatment chamber for the processing of a flux-free solder ball (or plated solder ball) loaded wafer chip. A treatment chamber comprises a first or upper heater at an upper end of the treatment chamber and a second or lower heater at a lower end of the treatment chamber. The treatment chamber includes a centrally disposed, preloaded flux free solder ball loaded wafer chip support ring movable upwardly and downwardly within the treatment chamber in response to temperature sensed monitoring of a wafer chip supported on the wafer chip support ring.

89. 发明申请

US20190243753A1 INTERMITTENT FAILURE METRICS IN TECHNOLOGICAL PROCESSES 审中-公开
公开(公告)号：US20190243753A1
公开(公告)日：2019-08-08
申请号：US16263363
申请日：2019-01-31
申请人： Jian Zhang , Minghao Lu , Xiaolu Ye , Ning He
发明人： Jian Zhang , Minghao Lu , Xiaolu Ye , Ning He
IPC分类号： G06F11/36 , G06F9/50 , G06F17/11
摘要： Systems and methods for testing a subject system with a software testing process are described. The system receives Boolean states responsive to repeatedly applying a first test case to a subject system. Each Boolean state signifies an outcome of an application of the first test case to a version of a first software feature over a span of time. The system identifies test case outcomes for the first test case that are adjacent in time and different and generates an intermittency value for the first test case. The system determines that the intermittency value for the first test case exceeds an intermittency threshold and alerts an engineering resource. Finally, the system repeats the above operations until the intermittency value for the first test case does not exceed the intermittency threshold.

90. 发明授权

US09629258B2 Reflow treating unit and substrate treating apparatus 有权
公开(公告)号：US09629258B2
公开(公告)日：2017-04-18
申请号：US14998387
申请日：2015-12-28
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： B23K37/00 , H05K3/34 , B23K3/00 , B23K37/04 , B23K1/00 , B23K1/008 , H01L21/67 , B23K3/04 , B23K3/08 , B23K101/40
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K3/00 , B23K3/04 , B23K3/08 , B23K37/04 , B23K2101/40 , H01L21/6719
摘要： Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module.

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