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81. 发明授权

US4723197A Bonding pad interconnection structure 失效
标题翻译：接合垫互连结构
公开(公告)号：US4723197A
公开(公告)日：1988-02-02
申请号：US809448
申请日：1985-12-16
申请人： Hem P. Takiar , Thomas George
发明人： Hem P. Takiar , Thomas George
IPC分类号： H01L23/52 , H01L21/312 , H01L21/318 , H01L21/3205 , H01L21/60 , H01L23/485 , H01L23/532 , H05K7/10
CPC分类号： H01L24/02 , H01L21/76897 , H01L23/5329 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01058 , H01L2924/01061 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/19043
摘要： Semiconductor devices having bonding pads formed over active regions on the device are fabricated by providing protective layers between the bonding pad and the underlying active region(s). The first protective layer is formed from a polyimide material which can absorb shock resulting from tape automated bonding of the bonding pad. The second protective layer is formed from a puncture-resistant material, such as a plasma nitride, which will prevent penetration of the bonding pad resulting from the downward force applied during tape automated bonding. The bonding pad is connected to active regions or metallization pads on the device substrate by a metal interconnect having a vertical run and a lateral run. The vertical run penetrates the protective layers as well as any passivation layers which may be present, while the lateral run provides an offset for the bonding pad. In this way, the bonding pad and the active region of the substrate will be separated by the protective layers.
摘要翻译：通过在焊盘和下面的有源区域之间提供保护层来制造具有在器件上的有源区上形成的焊盘的半导体器件。第一保护层由聚酰亚胺材料形成，该聚酰亚胺材料可以吸收由粘合垫的带自动键合产生的冲击。第二保护层由诸如等离子体氮化物的防刺穿材料形成，这将防止由于在带自动接合期间施加的向下的力而导致焊接垫的穿透。接合焊盘通过具有垂直行程和横向运行的金属互连件连接到器件基板上的有源区域或金属化焊盘。垂直运行穿过保护层以及可能存在的任何钝化层，而横向运行为粘合垫提供偏移。以这种方式，焊盘和衬底的有源区域将被保护层分离。

82. 发明授权

US4684975A Molded semiconductor package having improved heat dissipation 失效
标题翻译：具有改善散热性能的模制半导体封装
公开(公告)号：US4684975A
公开(公告)日：1987-08-04
申请号：US809442
申请日：1985-12-16
申请人： Hem P. Takiar , Kamal N. Mehta
发明人： Hem P. Takiar , Kamal N. Mehta
IPC分类号： H01L23/495 , H01L23/36
CPC分类号： H01L24/50 , H01L23/49568 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral bonding pads of the semiconductor and over the active region of the semiconductor device. In this way, the leads are able to conduct heat away from the active region of the device. The second aspect of the invention relates to improved heat dissipation through the individual leads. The leads are flared or otherwise increased in area in the direction away from the active region of the semiconductor device to prove the radiative dissipation.
摘要翻译：用于胶带自动接合的改进的金属带提供了从封装的半导体器件增强的散热。本发明包括两个方面。在第一方面中，单独的金属带引线向内延伸超过半导体的周边接合焊盘并超过半导体器件的有源区。以这种方式，引线能够从设备的有源区域传导热量。本发明的第二方面涉及通过各个引线改善散热。引线在远离半导体器件的有源区域的方向上以面积扩大或以其它方式增加，以证明辐射耗散。

83. 发明授权

US4595480A System for electroplating molded semiconductor devices 失效
标题翻译：电镀模制半导体器件系统
公开(公告)号：US4595480A
公开(公告)日：1986-06-17
申请号：US780157
申请日：1985-09-26
申请人： Hem P. Takiar , Jagdish Belani
发明人： Hem P. Takiar , Jagdish Belani
IPC分类号： C25D7/00 , C25D17/06 , C25D17/08 , H01L21/50 , H01L23/48 , H01L23/50
CPC分类号： C25D17/08 , H01L2924/0002
摘要： A system for electroplating metals, such as tin and solder on semiconductor lead frame strips includes a magazine for carrying the lead frames and a separate plating rack for carrying the magazines. The plating rack, which has an insulated surface, includes means for directing a current to the lead frame strips when the magazine is inserted in the plating rack. An electric coupling means is also provided for assuring that the current from the plating rack is evenly distributed among the individual lead frame strips so that uniform plating results. The magazine is suitable for transporting and storing the lead frame strips during assembly of semiconductor components, and it is unnecessary to remove the lead frame strips from the magazine for mounting on the plating rack.
摘要翻译：用于在半导体引线框架条上电镀金属（例如锡和焊料）的系统包括用于承载引线框架的托架和用于承载杂志的单独的电镀架。具有绝缘表面的电镀架包括当盒被插入电镀架时将电流引导到引线框架条的装置。还提供电耦合装置，用于确保来自电镀架的电流均匀分布在各个引线框架条之间，从而得到均匀的电镀。该杂志适用于在组装半导体部件期间传送和存放引线框条，并且不需要将引线框带从料盒中取出以安装在电镀架上。

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