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    • 81. 发明申请
    • DISC WAFER INSPECTING DEVICE AND INSPECTING METHOD
    • 光盘检测设备和检查方法
    • US20100177953A1
    • 2010-07-15
    • US12376469
    • 2007-08-09
    • Yoshinori HayashiTakeki KogawaHideki MoriAkimasa Hori
    • Yoshinori HayashiTakeki KogawaHideki MoriAkimasa Hori
    • G06K9/00
    • G01B11/08G01B11/24G01N21/9503G01R31/311
    • [Problem] An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided.[Means for Solution] The inspecting device is configured having image capturing means 130a, 130b for capturing an image of an outer edge and its neighboring region of a rotating wafer 10, wafer outer edge position measuring means 200 for measuring the radial direction position of the outer edge at each of the plurality of rotational angle positions θn of the wafer 10 based on the images obtained by the image capturing means 130a, 130b, an edge-to-edge distance measuring means 200 for measuring the edge-to-edge distance Bθn, between the outer edge of the wafer 10 and the edge of an insulating film 11 at each of the plurality of rotational angle positions θn based on the images obtained by the image capturing means 130a, and an inspection information generating means 200 for generating predetermined inspection information based on the radial direction position Aθn of the outer edge of the wafer 10 and the edge-to-edge distance Bθn.
    • [问题]提供一种检查装置和对形成在半导体晶片或其他盘晶片的表面上的处理区域进行更好的精密检查的检查方法。 [解决方案]检查装置配置有用于捕获旋转晶片10的外边缘及其相邻区域的图像的图像捕获装置130a,130b,用于测量旋转晶片10的径向位置的晶片外边缘位置测量装置200 基于由图像捕获装置130a,130b获得的图像的晶片10的多个旋转角度位置& t的每一个的外边缘; n边缘到边缘距离测量装置200,用于测量边缘到边缘 距离B& N; n,基于由图像捕获装置130a获得的图像,在多个旋转角度位置& tt中的每一个的晶片10的外边缘和绝缘膜11的边缘之间; n, n是根据晶片10的外边缘的径向位置A和距离n以及边缘到边缘距离B的关系产生预定检查信息的装置; n。
    • 83. 发明申请
    • SURFACE INSPECTION APPARATUS
    • 表面检查装置
    • US20100066998A1
    • 2010-03-18
    • US12595699
    • 2008-04-25
    • Yoshinori HayashiMasao KawamuraHideki Mori
    • Yoshinori HayashiMasao KawamuraHideki Mori
    • G01N21/00
    • G01N21/9503
    • [Problem] To provide a surface inspection apparatus able to suitably inspect the outer circumference edge part of a semiconductor wafer or other plate-shaped member.[Technical Solution] A semiconductor wafer inspection apparatus 10 has a camera lens 22 arranged facing an outer circumference edge part 101 of a semiconductor wafer 100, an imaging surface 24 arranged facing an outer circumference end face of a semiconductor wafer 100 via the camera lens 22, a mirror 12 forming an image of a first outer circumference bevel surface 101b of the semiconductor wafer 100 on the imaging surface 24 via the camera lens 22, a mirror 14 forming an image of a second outer circumference bevel surface 101c of the semiconductor wafer 100 on the imaging surface 24 via the camera lens 22, a correction lens 26 forming an image of an outer circumference end face 101a of the semiconductor wafer 100 on the imaging surface 24 via the center part of the camera lens 22, and an illumination light guide lamp part 18 illuminating surfaces so that, compared with the outer circumference end face 101a, the first outer circumference bevel surface 101b and second outer circumference bevel surface 101c become brighter.
    • [问题]提供一种能够适当地检查半导体晶片或其他板状部件的外周缘部的表面检查装置。 技术方案半导体晶片检查装置10具有面向半导体晶片100的外周缘部101配置的摄像透镜22,经由照相机镜头22配置成与半导体晶片100的外周端面相对配置的摄像面24 ,通过照相机镜头22在成像面24上形成半导体晶片100的第一外周斜面101b的图像的反射镜12,形成半导体晶片100的第二外周斜面101c的图像的反射镜 通过照相机镜头22在成像表面24上,通过照相机镜头22的中心部分在成像表面24上形成半导体晶片100的外周端面101a的图像的校正透镜26和照明光导 灯部18照射表面,使得与外周端面101a相比,第一外周斜面101b和第二外圆周面 斜面101c变得更亮。
    • 85. 发明申请
    • Surface Roughness Inspection System
    • 表面粗糙度检测系统
    • US20090177415A1
    • 2009-07-09
    • US12086081
    • 2006-12-05
    • Yoshinori HayashiHideki Mori
    • Yoshinori HayashiHideki Mori
    • G01B11/30
    • G01B11/303G01N21/9501
    • [Problem] To provide a surface roughness inspection system enabling suitable inspection even when the surface of the object being inspected is curved.[Means for Solution] A system having an imaging unit 20 having a line sensor 22 and scanning the surface of an object being inspected 101 in a direction perpendicular to the direction of extension of the line sensor 22 and outputting a density signal for each pixel from the line sensor 22 and a processing unit 50 processing the density signal from the line sensor 22 of the imaging unit 20, the processing unit 50 having a means for acquiring a pixel density value based on a density signal from the line sensor 22 (S2) and a density state generating means for generating a density state information Pf showing the density state in the scan direction of the object surface based on all of the pixel density values acquired for the object surface 101 being inspected (S7).
    • [问题]提供一种表面粗糙度检查系统,即使被检查物体的表面弯曲,也能够进行适当的检查。 [解决方案]具有成像单元20的系统具有线传感器22,并且在垂直于线传感器22的延伸方向的方向上扫描被检查物体101的表面,并输出每个像素的浓度信号 线传感器22和处理单元50处理来自成像单元20的线传感器22的浓度信号,处理单元50具有用于基于来自线传感器22的密度信号获取像素密度值的装置(S2) 密度状态产生装置,用于基于对被检测物体表面101获得的所有像素密度值,生成表示物体表面的扫描方向上的浓度状态的浓度状态信息Pf(S7)。