会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 81. 发明授权
    • Multi-layered tungsten depositions for contact hole filling
    • 用于接触孔填充的多层钨沉积
    • US5700726A
    • 1997-12-23
    • US668992
    • 1996-06-21
    • Yung-Sheng HuangNun-Sian Tsai
    • Yung-Sheng HuangNun-Sian Tsai
    • H01L21/768H01L21/283H01L21/3065
    • H01L21/76877H01L21/7684
    • A process for filling small diameter contact holes, with tungsten, has been developed. This process consists of using two consecutive tungsten depositions. A first tungsten layer, that will exhibit a fast removal rate in a specific dry etch chemistry, such as RIE, is used to coat the sidewalls of the small diameter contact hole. Next a second layer of tungsten, that will exhibit a significantly slower removal rate then the first tungsten layer, is used to completely fill the contact hole. Etchback, to remove unwanted material from areas outside the contact hole, does not significantly attack the second tungsten fill, in the contact hole, thus not aggravating any seams in the second tungsten fill that may have been created during the LPCVD tungsten, contact hole fill process.
    • 已经开发了用于填充具有钨的小直径接触孔的工艺。 该过程包括使用两个连续的钨沉积。 使用在特定的干蚀刻化学品(例如RIE)中表现出快速去除速率的第一钨层来涂覆小直径接触孔的侧壁。 接下来是第二层钨,其将显示出比第一钨层显着较慢的去除速率,以完全填充接触孔。 为了从接触孔以外的区域去除不需要的材料,Etchback不会明显地攻击接触孔中的第二钨填充物,因此不会加剧在LPCVD钨期间可能产生的第二钨填充物中的任何接缝,接触孔填充 处理。
    • 86. 发明申请
    • Method and apparatus for monitoring the condition of a battery by measuring its internal resistance
    • 通过测量电池的内阻来监测电池状态的方法和装置
    • US20070194791A1
    • 2007-08-23
    • US11356117
    • 2006-02-17
    • Yung-Sheng Huang
    • Yung-Sheng Huang
    • G01N27/416
    • G01R31/389G01R31/3647G01R31/3648
    • A method comprises coupling a first power transistor as a first external load in series with the battery, coupling a second power transistor as a second external load in series with the battery, conducting each power transistor to supply a transient large current to the battery for sampling a group of sampled reference voltages and sampled load voltages in a very transient sampling time for a plurality of times and thus obtaining an internal resistance of the battery. The internal resistance of the battery can then be compared with a predetermined warning value thereof so as to determine whether the former is equal to or larger than the warning value or not, and issuing a warning through an I/O if the determination is affirmative. The invention enables a driver to correctly know the actual condition of the battery in substantially real time while consuming a minimum amount of power.
    • 一种方法包括将作为第一外部负载的第一功率晶体管与电池串联耦合,将作为第二外部负载的第二功率晶体管与电池串联耦合,将每个功率晶体管导通以向电池提供瞬态大电流以进行采样 一组采样的参考电压和采样的负载电压在非常短暂的采样时间内多次,从而获得电池的内部电阻。 然后可以将电池的内部电阻与其预定的警告值进行比较,以便确定前者是否等于或大于警告值,并且如果确定是肯定的则通过I / O发出警告。 本发明使驾驶员能够在消耗最小功率的情况下基本上实时地正确地了解电池的实际状况。
    • 90. 发明授权
    • Micro-cleavage method for specimen preparation
    • 样品制备的微裂解法
    • US6140603A
    • 2000-10-31
    • US283000
    • 1999-03-31
    • Ruey-Lian HwangYung-Sheng Huang
    • Ruey-Lian HwangYung-Sheng Huang
    • B23K26/40H01L21/304B23K26/00
    • H01L21/3043B23K26/362B23K26/40B23K2203/50
    • A micro-cleavage method for preparing a semiconductor specimen for examination by an optical or electron microscopic is disclosed. The method can be carried out by hand and thus no expensive equipment such as a polishing machine is necessary. In the method, at least two bird's beak marks are cut in a top surface of a silicon wafer that contains a target, i.e., a defect or a circuit to be examined. The bird's beak marks are formed by a wide scribe line and a narrow scribe line overlapped together. The wide scribe line of the bird's beak mark is used for visual alignment with the edge of a rigid substrate, while the fine scribe line is utilized for initiating a crack when a bending stress is applied on the bird's beak mark. The bird's beak mark can be made by using a laser cutter after a wafer slice which contains the target area is first cleaved by mechanical means such as a diamond knife. A first bird's beak mark is formed at the cleaved edge of the slice and a second bird's beak mark is formed with its fine scribe line oriented toward the target. When a bending stress is applied on the top surface of the silicon slice, stress concentrates on the bird's beak marks and creates a fine crack to propagate along a crystallographic plane in the wafer toward the target thus exposing the target in a fractured surface.
    • 公开了一种通过光学或电子显微镜制备用于检查的半导体样品的微裂纹方法。 该方法可以手工进行,因此不需要昂贵的设备如抛光机。 在该方法中,在包含目标物,即缺陷或待检查的电路的硅晶片的顶表面中切割至少两个鸟的喙标记。 鸟的喙标记由宽的划线和狭窄的划线重叠在一起形成。 鸟喙标记的宽划线用于与刚性基底的边缘的视觉对准,而当在鸟的喙标记上施加弯曲应力时,细切割线用于引发裂纹。 可以通过使用激光切割机在包含目标区域的晶片切片之后首先用诸如金刚石刀等机械手段切割来制作鸟的喙标记。 在切片的切割边缘处形成第一只鸟的喙标记,并且形成第二个鸟的喙标记,其细的划线朝向目标。 当在硅片的顶表面上施加弯曲应力时,应力集中在鸟的喙痕上,并产生细小的裂纹,沿着晶片中的晶面朝向靶传播,从而将目标暴露在断裂的表面中。