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    • 82. 发明授权
    • Nonvolatile semiconductor memory and a fabrication method for the same
    • 非易失性半导体存储器及其制造方法
    • US07560320B2
    • 2009-07-14
    • US11947396
    • 2007-11-29
    • Makoto SakumaAtsuhiro Sato
    • Makoto SakumaAtsuhiro Sato
    • H01L29/72
    • H01L27/11524H01L27/115H01L27/11521H01L29/66825
    • A nonvolatile semiconductor memory includes a plurality of memory cell transistors configured with a first floating gate, a first control gate, and a first inter-gate insulating film each arranged between the first floating gate and the first control gate, respectively, and which are aligned along a bit line direction; device isolating regions disposed at a constant pitch along a word line direction making a striped pattern along the bit line direction; and select gate transistors disposed at each end of the alignment of the memory cell transistors, each configured with a second floating gate, a second control gate, a second inter-gate insulator film disposed between the second floating gate and the second control gate, and a sidewall gate electrically connected to the second floating gate and the second control gate.
    • 非易失性半导体存储器包括:多个存储单元晶体管,其配置有分别布置在第一浮置栅极和第一控制栅极之间的第一浮动栅极,第一控制栅极和第一栅极间绝缘膜,并且它们对准 沿着位线方向; 器件隔离区沿着字线方向以恒定的间距设置,沿着位线方向形成条纹图案; 并且选择栅极晶体管,其设置在存储单元晶体管的对准的每一端,每个配置有第二浮置栅极,第二控制栅极,设置在第二浮置栅极和第二控制栅极之间的第二栅极间绝缘膜,以及 电连接到第二浮动栅极和第二控制栅极的侧壁栅极。
    • 83. 发明授权
    • Nonvolatile semiconductor memory and manufacturing method for the same
    • 非易失性半导体存储器及其制造方法相同
    • US07183615B2
    • 2007-02-27
    • US10868773
    • 2004-06-17
    • Hiroki YamashitaYoshio OzawaAtsuhiro Sato
    • Hiroki YamashitaYoshio OzawaAtsuhiro Sato
    • H01L29/76H01L29/94H01L31/00
    • H01L27/11521G11C16/0416G11C16/0483H01L27/115H01L29/42324Y10T428/24256
    • A semiconductor memory has a memory cell matrix encompassing (a) device isolation films running along the column-direction, arranged alternately between the memory cell transistors aligned along the row-direction, (b) first conductive layers arranged along the row and column-directions, top surfaces of the first conductive layers lie at a lower level than top surfaces of the device isolation films, (c) an inter-electrode dielectric arranged both on the device isolation films and the first conductive layers so that the inter-electrode dielectric can be shared by the memory cell transistors belonging to different cell columns' relative dielectric constant of the inter-electrode dielectric is higher than relative dielectric constant of the device isolation films, and (d) a second conductive layer running along the row-direction, arranged on the inter-electrode dielectric. Here, upper corners of the device isolation films are chamfered.
    • 半导体存储器具有存储单元阵列,其包括(a)沿着列方向延伸的器件隔离膜,交替地布置在沿着行方向排列的存储单元晶体管之间,(b)沿行和列方向排列的第一导电层 第一导电层的顶表面位于比器件隔离膜的顶表面更低的水平面上,(c)布置在器件隔离膜和第一导电层上的电极间电介质,使得电极间电介质可以 由属于不同单元列的存储单元晶体管所共用,电极间电介质的相对介电常数高于器件隔离膜的相对介电常数,(d)沿着行方向延伸的第二导电层, 在电极间电介质上。 这里,器件隔离膜的上角被倒角。
    • 85. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US07928496B2
    • 2011-04-19
    • US11808147
    • 2007-06-07
    • Wakako TakeuchiHiroshi AkahoriAtsuhiro Sato
    • Wakako TakeuchiHiroshi AkahoriAtsuhiro Sato
    • H01L29/788H01L29/792
    • H01L27/115H01L27/11521H01L27/11568H01L29/42324H01L29/513H01L29/7881
    • A nonvolatile semiconductor memory device having high charge retention characteristics and capable of improving leakage characteristics of a dielectric film disposed between a charge storage layer and a control gate electrode, and manufacturing method thereof is disclosed. According to one aspect, there is provided a semiconductor memory device comprising a first electrode disposed on a first insulator on a semiconductor substrate, a second insulator disposed on the first electrode, a second electrode disposed on the second insulator, and diffusion layers disposed in the semiconductor substrate, wherein the second insulator including a silicon-rich silicon nitride film containing more silicon than that in a stoichiometric silicon nitride film, and a silicon oxide film formed on the silicon-rich silicon nitride film, and wherein the silicon-rich silicon nitride film has a ratio of a silicon concentration and a nitrogen concentration set to 1:0.9 to 1:1.2.
    • 公开了一种具有高电荷保持特性并且能够改善设置在电荷存储层和控制栅电极之间的电介质膜的漏电特性的非易失性半导体存储器件及其制造方法。 根据一个方面,提供了一种半导体存储器件,包括设置在半导体衬底上的第一绝缘体上的第一电极,设置在第一电极上的第二绝缘体,设置在第二绝缘体上的第二电极和设置在第二绝缘体上的扩散层 半导体衬底,其中包括比在化学计量的氮化硅膜中含有更多的硅的富含硅的氮化硅膜的第二绝缘体和形成在富硅氮化硅膜上的氧化硅膜,并且其中富硅氮化硅 膜的硅浓度和氮浓度的比率设定为1:0.9至1:1.2。
    • 86. 发明申请
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US20070287253A1
    • 2007-12-13
    • US11808147
    • 2007-06-07
    • Wakako TakeuchiHiroshi AkahoriAtsuhiro Sato
    • Wakako TakeuchiHiroshi AkahoriAtsuhiro Sato
    • H01L21/336
    • H01L27/115H01L27/11521H01L27/11568H01L29/42324H01L29/513H01L29/7881
    • A nonvolatile semiconductor memory device having high charge retention characteristics and capable of improving leakage characteristics of a dielectric film disposed between a charge storage layer and a control gate electrode, and manufacturing method thereof is disclosed. According to one aspect, there is provided a semiconductor memory device comprising a first electrode disposed on a first insulator on a semiconductor substrate, a second insulator disposed on the first electrode, a second electrode disposed on the second insulator, and diffusion layers disposed in the semiconductor substrate, wherein the second insulator including a silicon-rich silicon nitride film containing more silicon than that in a stoichiometric silicon nitride film, and a silicon oxide film formed on the silicon-rich silicon nitride film, and wherein the silicon-rich silicon nitride film has a ratio of a silicon concentration and a nitrogen concentration set to 1:0.9 to 1:1.2.
    • 公开了一种具有高电荷保持特性并且能够改善设置在电荷存储层和控制栅电极之间的电介质膜的漏电特性的非易失性半导体存储器件及其制造方法。 根据一个方面,提供了一种半导体存储器件,包括设置在半导体衬底上的第一绝缘体上的第一电极,设置在第一电极上的第二绝缘体,设置在第二绝缘体上的第二电极和设置在第二绝缘体上的扩散层 半导体衬底,其中包括比在化学计量的氮化硅膜中含有更多的硅的富含硅的氮化硅膜的第二绝缘体和形成在富硅氮化硅膜上的氧化硅膜,并且其中富硅氮化硅 膜的硅浓度和氮浓度的比率设定为1:0.9至1:1.2。