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    • 89. 发明申请
    • WIRING BOARD RECEIVING PLATE, AND DEVICE AND METHOD FOR CONNECTION OF WIRING BOARD USING THE SAME
    • 接线板接线板,以及用于连接使用该接线板的接线板的设备和方法
    • US20100251541A1
    • 2010-10-07
    • US12734285
    • 2008-09-04
    • Masao Saito
    • Masao Saito
    • H05K3/36
    • H05K3/361H05K3/323H05K2203/0173H05K2203/0195H05K2203/0278Y10T29/49126Y10T29/4913Y10T29/49144Y10T29/5317
    • Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.
    • 与ACF的连接相对于具有安装在其后表面上的电子部件的布线板实现,具有高连接可靠性和均匀的热压接合。 使用热压接头12相对于具有安装在其上的电子部件6的母板基板1对柔性印刷电路板4和5施加压力,并加热各向异性导电膜,从而将母板基板1与ACF连接到 作为连接构件的柔性印刷电路板4和5。 此时,在由主体基板1的电子部件6的安装位置设置有由弹性材料制成的接收板13,例如硅橡胶的状态下,在主板基板1的电子部件6的安装位置, 电子部件6在其上支撑母板基板1的背面,进行热压接。