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    • 81. 发明申请
    • PACKAGE OF ENVIRONMENTAL SENSITIVE ELEMENT AND ENCAPSULATION METHOD THEREOF
    • 环境敏感元件的包装及其包装方法
    • US20120064278A1
    • 2012-03-15
    • US12915018
    • 2010-10-29
    • Kuang-Jung Chen
    • Kuang-Jung Chen
    • B32B33/00B44C1/22B32B3/02
    • H01L51/5246Y10T428/239
    • A package of environmental sensitive element including a first substrate, a second substrate, an environmental sensitive element and a filler is provided. The second substrate is disposed above the first substrate and has a first barrier structure. The first barrier structure is located between the first substrate and the second substrate. The first barrier structure and the second substrate are integrally formed and made of the same material. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The first barrier structure surrounds the environmental sensitive element. The filler is disposed between the first substrate and the second substrate and covers the environmental sensitive element and the first barrier structure.
    • 提供包括第一基板,第二基板,环境敏感元件和填充物的环境敏感元件的封装。 第二基板设置在第一基板上方并具有第一阻挡结构。 第一阻挡结构位于第一基板和第二基板之间。 第一阻挡结构和第二基板一体地形成并由相同的材料制成。 环境敏感元件设置在第一基板上并且位于第一基板和第二基板之间。 第一屏障结构围绕环境敏感元件。 填料设置在第一基板和第二基板之间并且覆盖环境敏感元件和第一阻挡结构。