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81. 发明申请

US20080055873A1 Electronic part module and method of making the same 有权
标题翻译：电子零件模块及其制作方法
公开(公告)号：US20080055873A1
公开(公告)日：2008-03-06
申请号：US11896036
申请日：2007-08-29
申请人： Xiaoyu Mi , Tsuyoshi Matsumoto , Satoshi Ueda
发明人： Xiaoyu Mi , Tsuyoshi Matsumoto , Satoshi Ueda
IPC分类号： H05K1/16 , H05K3/00 , H05K7/02
CPC分类号： H05K1/165 , H01L23/5389 , H01L23/642 , H01L23/645 , H01L25/16 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16152 , H01L2924/19015 , H05K1/162 , H05K3/0052 , H05K3/4685 , H05K2201/0394 , H05K2201/10674 , H05K2203/0574 , H05K2203/308 , Y10T29/49124 , H01L2224/0401
摘要： An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.
摘要翻译：电子部件模块包括布线基板，形成在布线基板上的无源器件的无源器件组以及安装在布线基板上的器件芯片。这样的电子部件模块以如下方式制成。首先，制造布线基板晶片，以包括多个电子部件模块形成区域。然后，在布线基板晶片上的每个电子部件模块形成区域中形成多个无源器件。然后，在布线基板晶片上的每个电子部件模块形成区域上形成器件芯片。最后，分配布线基板晶片。

82. 发明申请

US20070172988A1 Microstructure manufacturing method and microstructure 审中-公开
标题翻译：微结构制造方法和微观结构
公开(公告)号：US20070172988A1
公开(公告)日：2007-07-26
申请号：US11656390
申请日：2007-01-23
申请人： Tadashi Nakatani , Anh Tuan Nguyen , Satoshi Ueda , Yu Yonezawa , Naoyuki Mishima
发明人： Tadashi Nakatani , Anh Tuan Nguyen , Satoshi Ueda , Yu Yonezawa , Naoyuki Mishima
IPC分类号： H01L21/00
CPC分类号： B81C1/00944
摘要： A microstructure, suitable for avoiding sticking phenomena, includes a base, a first structural portion joined to the base, and a second structural portion opposed to the base and having a fixed end fixed to the first structural portion. Such a microstructure is made by a method including the step of processing a material substrate having a stacked structure made of a first layer, a second layer, and an intermediate layer between the first and second layers. By this method, the first layer is formed with the first structural portion, the second structural portion having the fixed end fixed to the first structural portion, and a support beam bridging the first and second structural portions. Thereafter, wet etching is performed to remove a region of the intermediate layer between the second layer and the second structural portion, followed by a drying step, and a cutting step with respect to the support beam.
摘要翻译：适于避免粘附现象的微细结构包括基部，与基部接合的第一结构部分和与基部相对的第二结构部分，并且具有固定到第一结构部分的固定端部。这种微观结构通过包括在第一和第二层之间处理具有由第一层，第二层和中间层制成的层叠结构的材料基板的步骤的方法制成。通过该方法，第一层形成有第一结构部分，第二结构部分具有固定到第一结构部分的固定端，以及支撑梁桥接第一和第二结构部分。此后，进行湿式蚀刻以去除第二层和第二结构部分之间的中间层的区域，随后进行干燥步骤和相对于支撑梁的切割步骤。

83. 发明申请

US20070045773A1 Integrated electronic device and method of making the same 有权
标题翻译：集成电子设备及其制作方法
公开(公告)号：US20070045773A1
公开(公告)日：2007-03-01
申请号：US11509577
申请日：2006-08-25
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L29/00 , H01L23/52 , H01F27/28 , H01F5/00
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
摘要翻译：集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。无源部件包括设置在基板上的多级线圈电感器。多级线圈电感器具有多个以多层布置的线圈。相互相邻的线圈线彼此间隔开。三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。

84. 发明授权

US07077520B2 Electrophotographic apparatus 有权
标题翻译：电子照相设备
公开(公告)号：US07077520B2
公开(公告)日：2006-07-18
申请号：US10864634
申请日：2004-06-10
申请人： Yoshimichi Ikeda , Yoshihiko Sano , Satoshi Ueda
发明人： Yoshimichi Ikeda , Yoshihiko Sano , Satoshi Ueda
IPC分类号： G03G15/00
CPC分类号： G03G15/553 , G03G15/0863 , G03G15/55 , G03G2215/0697
摘要： An electrophotographic apparatus is equipped with one or more printing sections including a photoreceptor, a charger that electrically charges the surface of the photoreceptor, an optical scanning section that optically scans the surface of the charged photoreceptor with a laser beam, a developer that develops image areas formed by optical scanning, a toner hopper that supplies toner to the developer, and an image transfer unit that transfers the developed image to a recording member. In this apparatus, the developer and toner hopper can be mounted and demounted separately and a plurality of toner hoppers and developers are changeable according to the kinds of toner colors to be used. Thus, of the developers and toner hoppers is equipped with a device that outputs electric signals to detect the correspondences of the toner hoppers and the developers.
摘要翻译：电子照相设备配备有一个或多个印刷部分，包括感光体，对感光体的表面进行电荷的充电器，用激光束光学扫描带电感光体的表面的光学扫描部分，显影图像区域的显影剂通过光学扫描形成，向显影剂供给调色剂的调色剂料斗，以及将显影图像转印到记录部件的图像转印单元。在该装置中，显影剂和调色剂料斗可以单独地安装和拆卸，并且多个调色剂料斗和显影剂可根据要使用的调色剂颜色的种类而改变。因此，显影剂和调色剂料斗配备有输出电信号以检测调色剂料斗和显影剂的对应关系的装置。

85. 发明申请

US20060120425A1 Micro oscillating element 有权
标题翻译：微振荡元件
公开(公告)号：US20060120425A1
公开(公告)日：2006-06-08
申请号：US11290489
申请日：2005-12-01
申请人： Norinao Kouma , Osamu Tsuboi , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
发明人： Norinao Kouma , Osamu Tsuboi , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
IPC分类号： H01S5/00
CPC分类号： G02B26/0841
摘要： A micro oscillating element is formed integrally from a material substrate made up of a first conductive layer, a second conductive layer and an insulating layer disposed between the first conductive layer and the second conductive layer. This oscillating element includes an oscillation section, an oscillation section supporting frame, and a torsional joining section. The oscillation section includes a movable functional section. The torsional joining section joins the oscillation section and the frame, and also defines an oscillation axis for oscillating action of the oscillation section. The movable functional section is a part formed in the first conductive layer, while the frame is a part formed in the second conductive layer.
摘要翻译：从由第一导电层，第二导电层和布置在第一导电层和第二导电层之间的绝缘层构成的材料基板一体地形成微振荡元件。该振动元件包括振动部，振动部支承框和扭转接合部。振荡部包括可动功能部。扭转接合部连接振动部和框架，并且还限定振动部的摆动动作的摆动轴。可动功能部是形成在第一导电层中的部分，而框架是形成在第二导电层中的部分。

86. 发明申请

US20060114077A1 Electronic device and method of manufacturing the same 有权
公开(公告)号：US20060114077A1
公开(公告)日：2006-06-01
申请号：US11288142
申请日：2005-11-29
申请人： Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Takeo Takahashi
发明人： Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H03H7/38
CPC分类号： H01L23/5227 , H01F17/0006 , H01F27/40 , H01L21/84 , H01L23/5223 , H01L27/016 , H01L27/13 , H01L2924/0002 , H01L2924/09701 , H01L2924/19011 , H01L2924/00
摘要： An electronic device includes: an insulating substrate; at least one capacitor and an inductor that are formed directly on the insulating substrate; a line that connects the capacitor and the inductor from the above; and an external connecting pad unit that is made of the same conductor as the line and is disposed on the insulating substrate.

87. 发明授权

US07033515B2 Method for manufacturing microstructure 有权
标题翻译：微结构制造方法
公开(公告)号：US07033515B2
公开(公告)日：2006-04-25
申请号：US10686764
申请日：2003-10-17
申请人： Norinao Kouma , Yoshihiro Mizuno , Osamu Tsuboi , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki , Yoshitaka Nakamura
发明人： Norinao Kouma , Yoshihiro Mizuno , Osamu Tsuboi , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki , Yoshitaka Nakamura
IPC分类号： H01L21/00
CPC分类号： B81C1/00182 , B81B2201/0235 , B81B2201/033 , B81B2201/042 , B81C2201/014 , B81C2201/0174 , G02B26/0841
摘要： A method is for manufacturing a microstructure having a thin-walled portion with use of a material substrate. The material substrate has a laminated structure which includes a first conductor layer 101, a second conductor layer 102, a third conductor layer 103, a first insulating layer 104 interposed between the first conductor layer and the second conductor layer, and a second insulating layer 105 interposed between the second conductor layer and the third conductor layer. The first insulating layer is patterned to have a first masking part for covering a thin-wall forming region of the second conductor layer. The second insulating layer is patterned to have a second masking part for covering the thin-wall forming region of the second conductor layer. The method includes forming the thin-walled portion in the second conductor portion by etching the material substrate from the first conductor layer down to the second insulating layer via a mask pattern 58 including a non-masking region corresponding to the thin-wall forming region of the second conductor layer.
摘要翻译：一种使用材料基板制造具有薄壁部分的微结构的方法。材料基板具有包括第一导体层101，第二导体层102，第三导体层103，插入在第一导体层和第二导体层之间的第一绝缘层104和第二绝缘层105的层叠结构插入在第二导体层和第三导体层之间。第一绝缘层被图案化以具有用于覆盖第二导体层的薄壁形成区域的第一掩模部分。图案化第二绝缘层以具有用于覆盖第二导体层的薄壁形成区域的第二掩模部分。该方法包括：通过掩模图案58将材料基板从第一导体层蚀刻到第二绝缘层，从而在第二导体部分中形成薄壁部分，掩模图案58包括对应于薄壁形成区域的非屏蔽区域第二导体层。

88. 发明申请

US20050145170A1 Substrate processing apparatus and cleaning method therefor 审中-公开
标题翻译：基板加工装置及其清洗方法
公开(公告)号：US20050145170A1
公开(公告)日：2005-07-07
申请号：US11004897
申请日：2004-12-07
申请人： Toshio Matsubara , Satoshi Ueda , Hiroyuki Satou , Hideto Uchijima
发明人： Toshio Matsubara , Satoshi Ueda , Hiroyuki Satou , Hideto Uchijima
IPC分类号： C23C16/44 , C23C16/455 , H01L21/3065 , H01L21/31 , B08B3/00
CPC分类号： C23C16/4405 , C23C16/45565
摘要： A substrate processing apparatus has a pressure-reducible reaction chamber, a substrate support provided in the reaction chamber, a gas inlet port provided in a wall portion of the reaction chamber to introduce a gas into the reaction chamber, a first plate provided between the substrate support and the gas inlet port in the reaction chamber and having a plurality of first holes for dispersing the gas introduced from the gas inlet port into the reaction chamber, and a second plate provided between the substrate support and the first plate in the reaction chamber in opposing relation to the first plate and having a plurality of second holes for further dispersing the gas dispersed by the first plate. The first and second plates can be moved relatively to each other such that a spacing between the first and second plates is variable.
摘要翻译：基板处理装置具有减压反应室，设置在反应室中的基板支撑体，设置在反应室壁部的气体导入口，将气体导入反应室，设置在基板之间的第一板支撑件和气体入口，并且具有多个用于将从气体入口引入的气体分散到反应室中的第一孔，以及设置在反应室中的基板支撑件和第一板之间的第二板与第一板相对，并且具有多个用于进一步分散由第一板分散的气体的第二孔。第一和第二板可以相对移动，使得第一和第二板之间的间隔是可变的。

89. 发明授权

US06906255B2 Gasket and electronic apparatus having the same 有权
标题翻译：垫片和具有相同的电子设备
公开(公告)号：US06906255B2
公开(公告)日：2005-06-14
申请号：US10722121
申请日：2003-11-26
申请人： Misao Inoke , Satoshi Ueda
发明人： Misao Inoke , Satoshi Ueda
IPC分类号： F16J15/10 , H05K9/00
CPC分类号： H05K9/0016
摘要： A gasket that serves to shield electromagnetic waves from an electronic apparatus that has a housing that includes a first surface and a second surface opposite to the first surface, the gasket being squeezed into a perforation hole that perforates the first and second surfaces, and fixed onto the housing includes a lid part that contacts the first surface and serves as a flat spring, and an insertion part that is to be inserted into the perforation hole in the housing, and includes an engagement part, coupled with the support part, which at least partially projects from the perforation hole in the housing and contacts the second surface, wherein the engagement part includes a leg coupled with the the support part, and a foot that is coupled with the leg and forms an acute angle relative to the leg.
摘要翻译：一种用于屏蔽电磁波的垫片，该电子设备具有包括第一表面和与该第一表面相对的第二表面的壳体，该垫圈被挤压成穿孔第一表面和第二表面，并固定到壳体包括接触第一表面并用作平板弹簧的盖部分和插入壳体中的穿孔中的插入部分，并且包括与支撑部分耦合的接合部分，至少部分地从壳体中的穿孔孔突出并接触第二表面，其中接合部分包括与支撑部分联接的腿部，以及与腿部相连并相对于腿部形成锐角的脚部。

90. 发明申请

US20050035682A1 Micro-oscillation element and method for driving the same 失效
标题翻译：微振荡元件及其驱动方法
公开(公告)号：US20050035682A1
公开(公告)日：2005-02-17
申请号：US10790762
申请日：2004-03-03
申请人： Osamu Tsuboi , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Mi Xiaoyu , Satoshi Ueda , Ippei Sawaki , Yoshitaka Nakamura
发明人： Osamu Tsuboi , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Mi Xiaoyu , Satoshi Ueda , Ippei Sawaki , Yoshitaka Nakamura
IPC分类号： G02B26/08 , B81B3/00 , G02B26/10 , H02N1/00 , A45D24/30
CPC分类号： H02N1/008
摘要： A micro-oscillation element includes a movable main section, a first frame and a second frame, and a first connecting section that connects the movable main section and the first frame and defines a first axis of rotation for a first rotational operation of the movable main section with respect to the first frame. The element further includes a second connecting section that connects the first frame and the second frame and defines a second axis of rotation for a second rotational operation of the first frame and the movable main section with respect to the second frame. A first drive mechanism is provided for generating a driving force for the first rotational operation. A second drive mechanism is provided for generating a driving force for the second rotational operation. The first axis of rotation and the second axis of rotation are not orthogonal.
摘要翻译：微振荡元件包括可移动主体部分，第一框架和第二框架，以及第一连接部分，其连接可移动主体部分和第一框架，并且限定第一旋转轴线用于可移动主体的第一旋转操作相对于第一帧的截面。元件还包括第二连接部分，其连接第一框架和第二框架并且限定第二旋转轴线用于第一框架和可移动主体部分相对于第二框架的第二旋转操作。第一驱动机构被提供用于产生用于第一旋转操作的驱动力。提供第二驱动机构用于产生用于第二旋转操作的驱动力。第一旋转轴线和第二旋转轴线不正交。

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