专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明申请

US20130068423A1 AIR-SIDE ECONOMIZER FACILITATING LIQUID-BASED COOLING OF AN ELECTRONICS RACK 有权
标题翻译：电子机架空气侧经济型基于液体的冷却
公开(公告)号：US20130068423A1
公开(公告)日：2013-03-21
申请号：US13676198
申请日：2012-11-14
申请人： International Business Machines Corporation
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20136 , H05K7/20209 , H05K7/203 , H05K7/20745 , H05K7/20781
摘要： A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.
摘要翻译：提供一种用于冷却电子机架的电子子系统的冷却装置和方法。该冷却装置包括一个局部冷却站，该冷却站具有液体 - 空气热交换器和用于引导冷却气流穿过热交换器的管道。冷却子系统与机架的电子子系统相关联，并且包括促进电子子系统的电子部件的浸入式冷却的壳体，或者向电子子系统的电子部件提供导电冷却的一个或多个液冷结构。冷却剂回路将冷却子系统连接到本地冷却站的液 - 空热交换器。在操作中，通过来自电子子系统的循环冷却剂传递热量，并将其在局部冷却站的液体 - 空气热交换器中排出到穿过液体 - 空气热交换器的冷却气流。在一个实施例中，冷却气流是室外空气。

82. 发明申请

US20200178422A1 EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS 审中-公开
公开(公告)号：US20200178422A1
公开(公告)日：2020-06-04
申请号：US16749134
申请日：2020-01-22
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20 , G05B15/02 , G05D23/19
摘要： Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

83. 发明申请

US20190150320A1 PROTECTIVE COVER ASSEMBLY FOR AIR-MOVING ASSEMBLY 审中-公开
公开(公告)号：US20190150320A1
公开(公告)日：2019-05-16
申请号：US16246661
申请日：2019-01-14
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , Robert K. MULLADY , Roger R. SCHMIDT
IPC分类号： H05K7/20 , F04D29/70
摘要： Apparatuses and methods are provided for protectively covering an air inlet or outlet of an air-moving assembly. The apparatus includes a protective cover assembly, which includes a retractable cover and a spring-biasing mechanism. The retractable cover transitions between a retracted state, when the air-moving assembly is operatively positioned within the chassis, and in extended state, when the air-moving assembly is withdrawn from the chassis. In retracted state, the retractable cover is retracted away from the air inlet or outlet, and in extended state, the retractable cover covers, at least partially, the air inlet or outlet. The spring-biasing mechanism is coupled to the retractable cover and biases the retractable cover in the extended state when the air-moving assembly is withdrawn from the chassis, and compresses to allow transition of the retractable cover to the retracted state as the air-moving assembly is inserted into operative position within the chassis.

84. 发明申请

US20170303429A1 ELECTRONICS COOLING ASSEMBLY WITH MULTI-POSITION, AIRFLOW-BLOCKING MECHANISM 有权
公开(公告)号：US20170303429A1
公开(公告)日：2017-10-19
申请号：US15131180
申请日：2016-04-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR.
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20145 , G06F1/20 , G06F1/203 , H05K7/20409 , H05K7/20727 , H05K7/20745
摘要： Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

85. 发明申请

US20170013746A1 THERMOELECTRIC-ENHANCED, INLET AIR COOLING FOR AN ELECTRONICS RACK 有权
公开(公告)号：US20170013746A1
公开(公告)日：2017-01-12
申请号：US14791681
申请日：2015-07-06
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, Jr. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/20736 , H05K7/20836
摘要： Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

86. 发明申请

US20160143190A1 FUEL VAPORIZATION USING DATA CENTER WASTE HEAT 有权
标题翻译：使用数据中心废物燃烧的燃料蒸发
公开(公告)号：US20160143190A1
公开(公告)日：2016-05-19
申请号：US14829869
申请日：2015-08-19
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20 , F01K25/08
CPC分类号： F01K25/08 , F01K5/00 , F25B15/00 , F25B19/00 , F25B27/02 , F25B49/00 , H02P9/04 , H05K7/20709 , H05K7/20818 , H05K7/20836
摘要： Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
摘要翻译：通过使用数据中心废热汽化燃料，为数据中心冷却提供了系统和方法。该系统包括例如发电组件，液体燃料储存器和传热系统。发电组件从燃料蒸汽发电，供给数据中心。液体燃料储存器连接以供应燃料蒸汽，并且传热系统与数据中心和液体燃料储存器相关联。在操作模式中，传热系统将数据中心的余热转移到液体燃料储存器，以便于液化燃料的蒸发以产生供给发电组件的燃料蒸气。该系统可以以液体燃料储存和传热系统为主要燃料蒸气源或备用燃料蒸气源来实施。

87. 发明申请

US20160143185A1 LIQUID-COOLED HEAT SINK ASSEMBLIES 有权
公开(公告)号：US20160143185A1
公开(公告)日：2016-05-19
申请号：US14546159
申请日：2014-11-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20218 , H01L23/34 , H01L23/3672 , H01L23/4006 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/20281 , H05K7/20327 , H05K7/2039 , H05K7/20436 , H05K7/20509 , H05K7/20772 , H01L2924/00
摘要： Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.

88. 发明申请

US20160095261A1 INTERLOCK ASSEMBLY FOR AIR-MOVING ASSEMBLY 有权
公开(公告)号：US20160095261A1
公开(公告)日：2016-03-31
申请号：US14499422
申请日：2014-09-29
申请人： International Business Machines Corporation
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , John J. LOPARCO , Robert K. MULLADY , Donald W. PORTER , Roger R. SCHMIDT , Richard P. SNIDER , John G. TOROK
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： H05K7/20736 , F24F7/04 , H05K7/20172 , H05K7/20727
摘要： Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.

89. 发明申请

US20150351281A1 PUMP-ENHANCED, IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) 有权
标题翻译： PUMP增强型电子元件的浸入式冷却（S）
公开(公告)号：US20150351281A1
公开(公告)日：2015-12-03
申请号：US14826421
申请日：2015-08-14
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： H05K7/20318 , B23P15/26 , B23P2700/10 , H05K7/203 , H05K7/20781 , H05K7/2079 , Y10T29/49361
摘要： Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.
摘要翻译：提供冷却装置及其制造方法，其有助于电子部件的抽吸浸没冷却。所述冷却装置包括具有容纳所述电子部件的隔室的外壳和所述隔室内的介电流体，至少部分地浸没所述电子部件。液体冷却散热器与外壳相关联，以冷却与隔室相关联的至少一个冷却表面，并且便于通过介电流体从电子部件传递到散热器。泵设置在隔室的外部并与其流体连通以便于泵送的介电流体流过隔间。泵送的电介质流体流过隔室增强了通过冷却表面从电子部件到液体冷却的散热器的热传递。在一个实施方案中，泵送介质流体流通过沸腾流向电子部件提供两相冷却。

90. 发明申请

US20150109735A1 PUMP-ENHANCED, IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) 有权
公开(公告)号：US20150109735A1
公开(公告)日：2015-04-23
申请号：US14058530
申请日：2013-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20318 , B23P15/26 , B23P2700/10 , H05K7/203 , H05K7/20781 , H05K7/2079 , Y10T29/49361
摘要： Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式