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81. 发明授权

US06724632B2 Heat sink assembly with adjustable clip 失效
标题翻译：散热器组件带可调节夹
公开(公告)号：US06724632B2
公开(公告)日：2004-04-20
申请号：US10300232
申请日：2002-11-19
申请人： Hsieh-Kun Lee , Dong-Yun Lee , Zhi-Jie Zhang
发明人： Hsieh-Kun Lee , Dong-Yun Lee , Zhi-Jie Zhang
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2023/405 , H01L2023/4081 , H01L2924/0002 , Y10T24/44017 , Y10T24/44026 , H01L2924/00
摘要： A heat sink assembly includes a back plate (10), a clip (20) and a heat sink (50). The back plate is attached below a motherboard (60) on which a CPU (63) is mounted. The heat sink is attached on the CPU. Two posts (13) of the back plate extend through the motherboard and the heat sink. The heat sink includes a base (51) and fins (55). A longitudinal channel (57) is transversely defined through the fins. The base defines a recess (53) under the channel fittingly receiving an annular disc (58) therein. The clip includes a pressing portion (22) received in the channel, and two locking portions (29) engaging with the corresponding posts. A bolt (40) is screwed through the pressing portion to abut against the disc. By adjusting a depth to which the bolt is screwed, the clip can provide adjustable pressure acting on the heat sink.
摘要翻译：散热器组件包括背板（10），夹子（20）和散热器（50）。背板安装在其上安装有CPU（63）的母板（60）的下方。散热器安装在CPU上。背板的两个支柱（13）延伸穿过主板和散热片。散热器包括基座（51）和散热片（55）。纵向通道（57）通过翅片横向地限定。底座在通道下方限定一个凹槽（53），该凹槽在其内装配有环形盘（58）。夹子包括容纳在通道中的按压部分（22）和与相应柱接合的两个锁定部分（29）。螺栓（40）通过按压部分旋拧以抵靠盘。通过调节螺栓拧入的深度，夹子可以提供作用在散热器上的可调压力。

82. 发明授权

US06321451B1 Method for making a heat sink 失效
标题翻译：制造散热片的方法
公开(公告)号：US06321451B1
公开(公告)日：2001-11-27
申请号：US09414220
申请日：1999-10-06
申请人： Shun-Jung Lee , Hsieh-Kun Lee
发明人： Shun-Jung Lee , Hsieh-Kun Lee
IPC分类号： B23P1526
CPC分类号： H01L23/3672 , F28F3/02 , H01L2924/0002 , Y10T29/4935 , Y10T29/49352 , H01L2924/00
摘要： A heat sink comprises a base plate and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet. A method for making a reliable heat sink includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate thereby integrating the connecting portions with the base plate, forming concave sections in the connecting portions and convex sections on an opposite lower surface of the base plate. The flattening step comprises flattening the convex sections of the base plate to maintain the planarity of the base plate.
摘要翻译：散热器包括基板和从基板向上延伸的多个散热片。每个翅片包括散热部分和通过冲压与基板一体化的连接部分，从而在连接部分中留下凹部。翅片可以通过剪切和弯曲或通过弯曲金属板而形成各种形状。制造可靠散热器的方法包括准备步骤，冲压步骤和扁平化步骤。制备步骤包括制造基板和多个散热片，每个散热片包括连接部分和散热部分。冲压步骤包括将翅片的连接部分冲压到基板上，从而将连接部分与基板结合在一起，在连接部分形成凹部，在基板的相对的下表面上形成凸部。平坦化步骤包括使基板的凸部平坦化，以保持基板的平面度。

83. 发明授权

US6029740A Protective cap for heat conducting medium 有权
标题翻译：导热介质保护帽
公开(公告)号：US6029740A
公开(公告)日：2000-02-29
申请号：US217679
申请日：1998-12-21
申请人： Shun-Jung Lee , Hsieh-Kun Lee
发明人： Shun-Jung Lee , Hsieh-Kun Lee
IPC分类号： H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/3675 , H01L23/40 , H01L23/433 , H01L2924/0002
摘要： A protective cap comprises a cap portion and a mounting bracket attached to the cap portion along its peripheral walls. The mounting bracket includes upper and lower bars connected to opposite peripheral walls of the cap portion. A mounting seat is defined by the vertical beam and portions of the upper and lower bars. An attaching tab is seated within the mounting seat for attaching the protective cap to an under face of a heat sink. A tab extends outward from one of the upper and lower bars serving as a handle.
摘要翻译：保护盖包括盖部分和沿其周壁附接到盖部分的安装支架。安装支架包括连接到帽部分的相对周壁的上下杆。安装座由垂直梁和上下杆的部分限定。安装卡榫安置在安装座内，用于将保护盖连接到散热片的下表面。一个突出部从用作手柄的上下杆之一向外延伸。

84. 发明授权

US07674094B2 Electric fan with sealing lid 有权
标题翻译：电动风扇带密封盖
公开(公告)号：US07674094B2
公开(公告)日：2010-03-09
申请号：US11309687
申请日：2006-09-12
申请人： Chin-Wen Yeh , Chin-Long Ku , Hsieh-Kun Lee
发明人： Chin-Wen Yeh , Chin-Long Ku , Hsieh-Kun Lee
IPC分类号： F04D29/063
CPC分类号： F04D25/062 , F04D25/0626 , F04D29/646 , Y10S384/903
摘要： An electric fan includes a fan base (10), a bearing (40) and a rotor assembly (20). The fan base forms a central tube (11) receiving the bearing therein. The rotor assembly includes a fan hub (22), and a pivot axle (23) joined to the fan hub. The pivot axle pivotably extends into the bearing. A sealing lid (60) is screwedly mounted on a bottom opening of the central tube to prevent lubricant oil contained in the central tube from leaking. The sealing lid abuts against a bottom of the bearing to prevent the bearing from deflection.
摘要翻译：电风扇包括风扇底座（10），轴承（40）和转子组件（20）。风扇底座形成在其中容纳轴承的中心管（11）。转子组件包括风扇轮毂（22）和与风扇轮毂连接的枢轴（23）。枢转轴可枢转地延伸到轴承中。密封盖（60）螺纹地安装在中心管的底部开口上，以防止中心管中容纳的润滑油泄漏。密封盖抵靠轴承的底部，以防止轴承偏转。

85. 发明授权

US07395851B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07395851B2
公开(公告)日：2008-07-08
申请号：US11344317
申请日：2006-01-30
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Min-Qi Xiao
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Min-Qi Xiao
IPC分类号： F28D15/02
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a plurality of first fins formed on the first base. A second heat sink comprises a second base connecting with the first base and a plurality of second fins formed on the second base. Two heat pipes connect the heat spreader with the first base and the second base via opposite sides of the heat dissipation device. The heat pipes are partly sandwiched between the first base and the second base and transfers heat from the heat spreader to both of the first and the second heat sink.
摘要翻译：散热装置包括用于接触用于吸收热量的电子装置的散热器。在散热器上形成多个散热片。第一散热器与散热器分离，并且包括基本上垂直于散热器的第一基座和形成在第一基座上的多个第一鳍片。第二散热器包括与第一基座连接的第二基座和形成在第二基座上的多个第二翅片。两个热管通过散热装置的相对侧将散热器与第一基座和第二基座连接。热管部分地夹在第一基座和第二基座之间，并将热量从散热器传递到第一和第二散热器。

86. 发明授权

US07342795B2 Heat sink assembly 有权
标题翻译：散热器组件
公开(公告)号：US07342795B2
公开(公告)日：2008-03-11
申请号：US11244916
申请日：2005-10-05
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
摘要翻译：散热器组件包括散热器（10），从扩展器延伸的多个散热片（12），紧固件（20）和固定到紧固件的固定套管（30）。紧固件包括具有螺纹底端（208）的头部（200）和轴（204）。套筒包括圆柱形壁（302），上开口端（304）和下开口端（306）。套筒还具有与壁垂直连接并在下开口端延伸的环形基座（308）。头部被接收在墙壁上并接触基座。轴延伸穿过吊具。压头弹簧（22）在头部和吊具之间提供，用于向下推动吊具以与发热电子装置接合。

87. 发明授权

US07310229B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07310229B2
公开(公告)日：2007-12-18
申请号：US11065387
申请日：2005-02-24
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H01L23/4093 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.
摘要翻译：本发明的散热装置包括散热器（20）和用于固定散热器的两个锁定装置（10）。散热器包括用于接触电子部件的基座（22）。每个锁定装置包括弹簧构件，柱（12）和套筒（18）。弹簧构件弹性地靠在基座上。柱穿过套筒。该柱具有与弹簧构件接合的一端，并且其一端延伸超过套筒以锁定组合。套筒的一端紧紧地抓住柱子，其另一端阻止锁定装置离开散热器。

88. 发明授权

US07286363B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07286363B2
公开(公告)日：2007-10-23
申请号：US11168068
申请日：2005-06-28
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.
摘要翻译：散热组件包括散热器，保持模块和用于将散热器固定到保持模块的夹子。散热器包括用于与发热装置接触的基座。保持模块包括底壁和在其中限定槽并从底壁延伸的第一侧壁。夹具包括可枢转地连接到保持模块的连接部分。散热片搁置在保持模块的底壁上，其一端装配在槽中，其相对端由夹子按压。夹子可以处于释放位置，夹子可枢转，使得散热器可从保持模块移除，以及夹子按压散热器的锁定位置。因此，散热器可以方便地固定到发热装置。

89. 发明授权

US07269012B2 Heat dissipation device for heat-generating electronic component 失效
标题翻译：用于发热电子部件的散热装置
公开(公告)号：US07269012B2
公开(公告)日：2007-09-11
申请号：US11268079
申请日：2005-11-07
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Min-Qi Xiao
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Min-Qi Xiao
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink (10), a second heat sink (20), a pair of heat pipes (30) connecting the first heat sink and the second heat sink and a fan assembly (40) located between the first heat sink and the second heat sink. The first heat sink comprises a base (12), a cover (14) and a plurality of heat dissipating fins (16) sandwiched between the base and the cover. The second heat sink comprises a plurality of cooling fins (22). Each heat pipe comprises three portions, respectively orderly sandwiched between the base and the heat dissipating fins, sandwiched between the cover and the heat dissipating fins and thermally extending in the cooling fins.
摘要翻译：散热装置包括第一散热器（10），第二散热器（20），连接第一散热器和第二散热器的一对热管（30）和位于第一散热器之间的风扇组件（40）散热片和第二个散热片。第一散热器包括基座（12），盖（14）和夹在基座和盖之间的多个散热翅片（16）。第二散热器包括多个散热片（22）。每个热管包括三个部分，分别有序地夹在基部和散热片之间，夹在盖子和散热翅片之间并在散热片中热延伸。

90. 发明授权

US07254029B2 Printed circuit board with a heat dissipation device 失效
公开(公告)号：US07254029B2
公开(公告)日：2007-08-07
申请号：US11265367
申请日：2005-11-01
申请人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
发明人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0203 , H05K1/181 , H05K3/0061 , H05K2201/0209 , H05K2201/09909
摘要： An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.

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