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81. 发明授权

US07417723B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US07417723B2
公开(公告)日：2008-08-26
申请号：US11443222
申请日：2006-05-31
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息具有相应的检查条件。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

82. 发明申请

US20080117415A1 APPARATUS AND METHOD FOR INSPECTING DEFECTS 失效
标题翻译：检查缺陷的装置和方法
公开(公告)号：US20080117415A1
公开(公告)日：2008-05-22
申请号：US11931120
申请日：2007-10-31
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ooshima , Hidetoshi Nishiyama , Tetsuya Watanabe
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ooshima , Hidetoshi Nishiyama , Tetsuya Watanabe
IPC分类号： G01N21/898
CPC分类号： G01N21/9501
摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.
摘要翻译：一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸，，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第第一个方向。

83. 发明授权

US07315366B2 Apparatus and method for inspecting defects 有权
标题翻译：用于检查缺陷的装置和方法
公开(公告)号：US07315366B2
公开(公告)日：2008-01-01
申请号：US11714196
申请日：2007-03-06
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ooshima , Hidetoshi Nishiyama , Tetsuya Watanabe
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ooshima , Hidetoshi Nishiyama , Tetsuya Watanabe
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.
摘要翻译：一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸，，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第第一个方向。

84. 发明授权

US07315363B2 Inspection method and inspection apparatus 有权
标题翻译：检验方法和检验仪器
公开(公告)号：US07315363B2
公开(公告)日：2008-01-01
申请号：US10722531
申请日：2003-11-28
申请人： Akira Hamamatsu , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
发明人： Akira Hamamatsu , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
IPC分类号： G01N21/00
CPC分类号： G01N21/8806 , G01N21/94 , G01N21/9501 , G01N21/95623
摘要： The present invention provides an inspection apparatus and inspection method. The inspection apparatus provided by the present invention comprises an illumination optical system which illuminates light to an object under inspection; a detection optical system which detects light reflected from said object and converts the detected light into an image signal; a spatial filter which is provided in said detection optical system to selectively shield diffracted light pattern coming from a circuit pattern existing on the object by combining light-shielding points of minute dots state; an arithmetic processing system which processes the image signal detected by said detection optical system; and a monitor which observes foreign matters/defects based on a signal processed by said arithmetic processing system.
摘要翻译：本发明提供一种检查装置和检查方法。本发明提供的检查装置包括照明光学系统，其将光照射到被检查物体; 检测光学系统，其检测从所述对象反射的光并将检测到的光转换为图像信号; 设置在所述检测光学系统中的空间滤波器，通过组合微点状态的遮光点来选择性地屏蔽来自存在于物体上的电路图案的衍射光图案; 算术处理系统，处理由所述检测光学系统检测到的图像信号; 以及基于由所述算术处理系统处理的信号来观察异物/缺陷的监视器。

85. 发明授权

US07256412B2 Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
公开(公告)号：US07256412B2
公开(公告)日：2007-08-14
申请号：US11516344
申请日：2006-09-05
申请人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
发明人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
IPC分类号： G01N21/88
CPC分类号： G01N21/4738 , G01N21/8806 , G01N21/93 , G01N21/94 , G01N21/9501 , G01N2015/1486 , G01N2015/1493
摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

86. 发明申请

US20070001132A1 Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
标题翻译：用于检查半导体器件的颗粒或缺陷的方法及其装置
公开(公告)号：US20070001132A1
公开(公告)日：2007-01-04
申请号：US11516344
申请日：2006-09-05
申请人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
发明人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
IPC分类号： G01N21/86
CPC分类号： G01N21/4738 , G01N21/8806 , G01N21/93 , G01N21/94 , G01N21/9501 , G01N2015/1486 , G01N2015/1493
摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.
摘要翻译：通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

87. 发明申请

US20060215153A1 Method of inspecting a semiconductor device and an apparatus thereof 有权
公开(公告)号：US20060215153A1
公开(公告)日：2006-09-28
申请号：US11443222
申请日：2006-05-31
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/88
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

88. 发明授权

US06936835B2 Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
公开(公告)号：US06936835B2
公开(公告)日：2005-08-30
申请号：US10230416
申请日：2002-08-29
申请人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
发明人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
IPC分类号： G01N21/27 , G01N21/47 , G01N21/88 , G01N21/94 , G01N21/95
CPC分类号： G01N21/274 , G01N21/47 , G01N21/4738 , G01N21/8806 , G01N21/94 , G01N21/95 , G01N21/956 , G01N2021/8854
摘要： An apparatus for optically inspecting particles and/or defects correlates sizes of particles and/or defects to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

89. 发明授权

US08638429B2 Defect inspecting method and defect inspecting apparatus 失效
标题翻译：缺陷检查方法和缺陷检查装置
公开(公告)号：US08638429B2
公开(公告)日：2014-01-28
申请号：US13146428
申请日：2009-12-15
申请人： Toshiyuki Nakao , Shigenobu Maruyama , Akira Hamamatsu , Yuta Urano
发明人： Toshiyuki Nakao , Shigenobu Maruyama , Akira Hamamatsu , Yuta Urano
IPC分类号： G01N21/00 , G01J4/00
CPC分类号： G01N21/9501 , G01N21/8806 , G01N2021/8809 , G01N2021/8848 , H01L22/12
摘要： Provided are a defect inspecting method and a defect inspecting apparatus, wherein defect detecting sensitivity is improved and also haze measurement is performed using polarization detection, while suppressing damages to samples. The defect inspecting apparatus is provided with a light source which oscillates to a sample a laser beam having a wavelength band wherein a small energy is absorbed, and two independent detecting optical systems, i.e., a defect detecting optical system which detects defect scattered light generated by a defect, by radiating the laser beams oscillated by the light source, and a haze detecting optical system which detects roughness scattered light generated due to roughness of the wafer surface. Polarization detection is independently performed with respect to the scattered light detected by the two detecting optical systems, and based on the two different detection signals, defect determination and haze measurement are performed.
摘要翻译：提供了一种缺陷检查方法和缺陷检查装置，其中提高了缺陷检测灵敏度，并且在抑制对样本的损害的同时使用偏振检测进行雾度测量。缺陷检查装置具有向样品振荡的光源，其具有吸收小能量的波长带的激光束，以及两个独立的检测光学系统，即检测由通过照射由光源振荡的激光束的缺陷，以及检测由于晶片表面的粗糙度而产生的粗糙度散射光的雾度检测光学系统。相对于由两个检测光学系统检测的散射光独立地进行极化检测，并且基于两个不同的检测信号，执行缺陷确定和雾度测量。

90. 发明授权

US08508727B2 Defects inspecting apparatus and defects inspecting method 有权
标题翻译：缺陷检查设备和缺陷检查方法
公开(公告)号：US08508727B2
公开(公告)日：2013-08-13
申请号：US13529363
申请日：2012-06-21
申请人： Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
发明人： Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
IPC分类号： G01N21/00
CPC分类号： G01N21/00 , G01N21/9501 , G06T7/0004 , G06T2207/30148
摘要： An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.
摘要翻译：一种检查装置和方法，包括：第一和第二照明单元，用于以不同的入射角照射待检查样本的表面;以及第一和第二检测光学单元，其以不同的仰角方向布置在样本的表面上，用于检测样本的图像由第一和第二照明单元照亮。

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