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    • 86. 发明授权
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US06831316B1
    • 2004-12-14
    • US10009826
    • 2002-03-19
    • Hideyuki MatsuokaTakeshi SakataShinichiro KimuraToshiaki YamanakaTsuyoshi KachiTomonori Sekiguchi
    • Hideyuki MatsuokaTakeshi SakataShinichiro KimuraToshiaki YamanakaTsuyoshi KachiTomonori Sekiguchi
    • H01L4700
    • H01L27/108H01L27/10894H01L27/10897
    • An existent DRAM memory cell comprises transistors as a switch and capacitors for accumulating storage charges in which the height of the capacitor has been increased more and more along with micro miniaturization, which directly leads to increase in the manufacturing cost. The invention of the present application provides a semiconductor memory device of a basic constitution in which a memory cell array having plural memory cells disposed on a semiconductor substrate and word lines and data lines for selecting the memory cells and a peripheral circuit at the periphery of the memory cell array wherein the memory cell comprises a multi-layer of a conductive layer, an insulating layer and plural semiconductor layers containing impurities, and a potential can be applied to the insulating layer enabling the tunneling effect. The invention of the present application concerns a memory cell not requiring capacitor and capable of being formed in simple steps.
    • 存在的DRAM存储单元包括作为开关的晶体管和用于累积存储电荷的电容器,其中电容器的高度随着微型化而逐渐增加,这直接导致制造成本的增加。 本申请的发明提供了一种基本结构的半导体存储器件,其中具有设置在半导体衬底上的多个存储单元的存储单元阵列和用于选择存储单元的字线和数据线以及外围电路的外围电路 存储单元阵列,其中存储单元包括导电层的多层,绝缘层和含有杂质的多个半导体层,并且可以将电位施加到能够实现隧道效应的绝缘层。 本申请的发明涉及不需要电容器并能够以简单的步骤形成的存储单元。
    • 87. 发明授权
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US06812540B2
    • 2004-11-02
    • US10298682
    • 2002-11-19
    • Norikatsu TakauraRiichiro TakemuraHideyuki MatsuokaShinichiro KimuraHisao AsakuraRyo NagaiSatoru Yamada
    • Norikatsu TakauraRiichiro TakemuraHideyuki MatsuokaShinichiro KimuraHisao AsakuraRyo NagaiSatoru Yamada
    • H01L2900
    • H01L27/105H01L27/10897
    • A semiconductor integrated circuit device is provided, in which variation in the threshold voltage of a MISFET, for example, a MISFET pair that constitute a sense amplifier, can be reduced. In a logic circuit area over which a logic circuit such as a sense amplifier circuit required to drive a memory cell is formed, n-type active areas having no gate electrode are arranged at both edges of active areas over which a p-channel MISFET pair for constituting a sense amplifier are formed. Assuming that the width between active areas nwp1 and nw1 is L4, the width between active areas nwp2 and nw2 is L6, and the width between active areas nwp1 and nwp2 is L5, (L4−L5), (L6−L5), and (L4−L6) are set equal to almost zero or smaller than twice the minimum processing dimension, so that the variation in shape of the device isolation trenches with the widths L4, L5, and L6 can be reduced, and the threshold voltage difference in the MISFET pair can be reduced.
    • 提供了一种半导体集成电路器件,其中可以减小MISFET的阈值电压的变化,例如构成读出放大器的MISFET对的变化。 在形成驱动存储单元所需的诸如读出放大器电路的逻辑电路的逻辑电路区域中,没有栅电极的n型有源区域被布置在有效区域的两个边缘上,p沟道MISFET对 用于构成读出放大器。 假设有源区域nwp1和nw1之间的宽度为L4,有效区域nwp2和nw2之间的宽度为L6,有效区域nwp1和nwp2之间的宽度为L5(L4-L5),(L6-L5)和( L4-L6)设定为几乎为零或小于最小加工尺寸的两倍,使得可以减小宽度L4,L5和L6的器件隔离沟槽形状的变化,并且可以减小阈值电压差 可以减少MISFET对。