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    • 84. 发明申请
    • FIN FIELD EFFECT TRANSISTOR WITH VARIABLE CHANNEL THICKNESS FOR THRESHOLD VOLTAGE TUNING
    • 具有用于阈值电压调谐的可变通道厚度的FIN场效应晶体管
    • US20120235247A1
    • 2012-09-20
    • US13050101
    • 2011-03-17
    • Ming CaiDechao GuoChung-hsun LinChun-chen Yeh
    • Ming CaiDechao GuoChung-hsun LinChun-chen Yeh
    • H01L27/088H01L21/32
    • H01L27/0886H01L21/3086H01L21/845H01L27/1211
    • A method of forming an integrated circuit (IC) includes forming a first and second plurality of spacers on a substrate, wherein the substrate includes a silicon layer, and wherein the first plurality of spacers have a thickness that is different from a thickness of the second plurality of spacers; and etching the silicon layer in the substrate using the first and second plurality of spacers as a mask, wherein the etched silicon layer forms a first plurality and a second plurality of fin field effect transistor (FINFET) channel regions, and wherein the first plurality of FINFET channel regions each have a respective thickness that corresponds to the thickness of the first plurality of spacers, and wherein the second plurality of FINFET channel regions each have a respective thickness that corresponds to the thickness of the second plurality of spacers.
    • 一种形成集成电路(IC)的方法包括在基板上形成第一和第二多个间隔物,其中所述基板包括硅层,并且其中所述第一多个间隔件的厚度不同于所述第二 多个间隔物; 并且使用所述第一和第二多个间隔物作为掩模来蚀刻所述衬底中的所述硅层,其中所述蚀刻的硅层形成第一多个和第二多个鳍状场效应晶体管(FINFET)沟道区,并且其中所述第一多个 FINFET通道区域各自具有对应于第一多个间隔物的厚度的相应厚度,并且其中第二多个FINFET沟道区域各自具有对应于第二多个间隔物的厚度的相应厚度。
    • 89. 发明申请
    • IMPLANT FREE EXTREMELY THIN SEMICONDUCTOR DEVICES
    • 嵌入式无限超薄半导体器件
    • US20110115022A1
    • 2011-05-19
    • US12621299
    • 2009-11-18
    • Kangguo ChengBruce B. DorisDechao GuoPranita KulkarniPhilip J. OldigesGhavam G. Shahidi
    • Kangguo ChengBruce B. DorisDechao GuoPranita KulkarniPhilip J. OldigesGhavam G. Shahidi
    • H01L29/786H01L21/336
    • H01L29/66636H01L29/66772H01L29/78621H01L29/78654
    • A semiconductor device and a method of fabricating a semiconductor device are disclosed. In one embodiment, the method comprises providing a semiconductor substrate, epitaxially growing a Ge layer on the substrate, and epitaxially growing a semiconductor layer on the Ge layer, where the semiconductor layer has a thickness of 10 nm or less. This method further comprises removing at least a portion of the Ge layer to form a void beneath the Si layer, and filling the void at least partially with a dielectric material. In this way, the semiconductor layer becomes an extremely thin semiconductor-on-insulator layer. In one embodiment, after the void is filled with the dielectric material, in-situ doped source and drain regions are grown on the semiconductor layer. In one embodiment, the method further comprises annealing said source and drain regions to form doped extension regions in the semiconductor layer. Epitaxially growing the extremely thin semiconductor layer on the Ge layer ensures good thickness control across the wafer. This process could be used for SOI or bulk wafers.
    • 公开了半导体器件和制造半导体器件的方法。 在一个实施例中,该方法包括提供半导体衬底,在衬底上外延生长Ge层,并在Ge层上外延生长半导体层,其中半导体层的厚度为10nm或更小。 该方法还包括去除Ge层的至少一部分以在Si层下形成空隙,并且至少部分地用电介质材料填充空隙。 以这种方式,半导体层成为非常薄的绝缘体上半导体层。 在一个实施例中,在空隙填充有电介质材料之后,在半导体层上生长原位掺杂的源极和漏极区。 在一个实施例中,该方法还包括退火所述源区和漏区以在半导体层中形成掺杂的延伸区。 在Ge层上外延生长极薄的半导体层确保跨晶片的良好的厚度控制。 该工艺可用于SOI或体晶片。