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    • 81. 发明授权
    • Low-voltage fast-write PMOS NVSRAM cell
    • 低压快写PMOS NVSRAM单元
    • US09177644B2
    • 2015-11-03
    • US13965031
    • 2013-08-12
    • Hsing-Ya TsaoPeter Wung Lee
    • Hsing-Ya TsaoPeter Wung Lee
    • G11C14/00G11C16/04G11C16/16
    • G11C14/0063G11C14/00G11C16/04G11C16/0433G11C16/16
    • This invention discloses a low-voltage fast-write 12T or 14T PMOS NVSRAM cell structure which comprises a 6T LV SRAM cell and one pairs of two 3T or 4T HV PMOS Flash strings. Due to reverse threshold voltage definition of PMOS and NMOS flash cell, this PMOS NVSRAM cell has the advantage over the NMOS NVSRAM cell to have the same data polarity between SRAM and Flash pairs during the data writing operation. In addition, this PMOS NVSRAM's PMOS Flash cell uses similar low-current FN-tunneling scheme as NMOS NVSRAM, thus the fast data program and erase can be achieved in a big density up to 100 Mb simultaneously. As a result, low power voltage operation of NVSRAM with 1.2V VDD can be much easier to be designed without coupling the FSL line to any VDD level during the flash data loading into SRAM cell during a power-on period.
    • 本发明公开了一种低电压快写12T或14T PMOS NVSRAM单元结构,其包括6T LV SRAM单元和一对两个3T或4T HV PMOS闪存串。 由于PMOS和NMOS闪存单元的反向阈值电压分辨率,该PMOS NVSRAM单元在数据写入操作期间具有超过NMOS NVSRAM单元在SRAM和闪存对之间具有相同数据极性的优势。 此外,该PMOS NVSRAM的PMOS闪存单元使用与NMOS NVSRAM类似的低电流FN隧穿方案,因此快速数据编程和擦除可以同时实现高达100 Mb的大密度。 因此,在上电期间闪存数据加载到SRAM单元期间,具有1.2V VDD的NVSRAM的低功耗电压操作可以轻松设计,无需将FSL线耦合到任何VDD电平。
    • 82. 发明申请
    • NEW 1T1b AND 2T2b FLASH-BASED, DATA-ORIENTED EEPROM DESIGN
    • 新的1T1b和2T2b闪存的基于数据的EEPROM设计
    • US20130182509A1
    • 2013-07-18
    • US13734777
    • 2013-01-04
    • Peter Wung LeeHsing-Ya Tsao
    • Peter Wung LeeHsing-Ya Tsao
    • G11C16/34G11C16/14G11C16/06
    • G11C16/14G11C16/0425G11C16/0458G11C16/0483G11C16/06G11C16/10G11C16/16G11C16/26G11C16/3459G11C2216/14
    • An one-transistor-one-bit (1T1b) Flash-based EEPROM cell is provided along with improved key operation schemes including applying a negative word line voltage and a reduced bit line voltage for perform erase operation, which drastically reduces the high voltage stress on each cell for enhancing the Program/Erase cycles while reducing cell size. An array made by the 1T1b Flash-based EEPROM cells can be operated with Half-page or Full-page divided programming and pre-charging period for each program cycle. Utilizing PGM buffer made of Vdd devices in the cell array further save silicon area. Additionally, a two-transistor-two-bit (2T2b) EEPROM cell derived from the 1T1b cell is disclosed with additional cell size reduction but with the operation of program and erase the same as that for the 1T1b cells with benefits of no process change but much enhanced storage density, superior Program/Erase endurance cycle, and capability for operating in high temperature environment.
    • 提供了一个单晶体管一位(1T1b)基于闪存的EEPROM单元,以及改进的键操作方案,包括施加负字线电压和降低的位线电压用于执行擦除操作,这大大降低了高压应力 每个单元用于增强编程/擦除周期,同时减小单元大小。 由1T1b闪存的EEPROM单元制成的阵列可以在每个程序周期的半页或全页分割编程和预充电周期下进行操作。 在单元阵列中利用由Vdd器件制成的PGM缓冲器进一步节省了硅面积。 另外,公开了从1T1b单元得到的双晶体管二位二位(2T2b)EEPROM单元,其额外的单元尺寸减小,但是编程和擦除操作与1T1b单元的操作相同,有利于没有过程变化, 大大增强了存储密度,卓越的程序/擦除耐久循环,以及在高温环境下运行的能力。