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    • 71. 发明申请
    • ASSEMBLY STRUCTURE OF LIGHT UNIT
    • 轻型装置组装结构
    • US20160209010A1
    • 2016-07-21
    • US14601444
    • 2015-01-21
    • YU-SYUAN CHEN
    • Tien-Lin WUChin-Hsin LEEShih-Ming CHEN
    • F21V21/14F21V29/71F21V29/74
    • F21V29/74F21V21/28F21V21/30F21V23/02F21V29/51F21V29/763F21Y2115/10
    • In an assembly structure of a light unit, two supporting bases individually support two sides of a lighting device. An adjustment frame spans the supporting bases and includes two supporting arms and a supporting plate. The supporting arm has a first axial hole and plural first adjustment holes. The supporting base has a first throughhole and a first lockhole which is aligned to the first adjustment hole. A first fastener passes the first throughhole and is fastened to the first axial hole. An adjustment plate has a second axial hole and plural second adjustment holes. A supporting plate has a second throughhole corresponding to the second axial hole and a second lockhole which is aligned to the second adjustment hole. A second fastener passes the second throughhole and is fastened to the second axial hole. Thus, a multi-angle adjustment of the light unit is made.
    • 在光单元的组装结构中,两个支撑底座分别支撑照明装置的两侧。 调整框架跨过支撑底座,并包括两个支撑臂和支撑板。 支撑臂具有第一轴向孔和多个第一调节孔。 支撑基座具有第一通孔和与第一调节孔对准的第一锁孔。 第一紧固件穿过第一通孔并被紧固到第一轴向孔。 调整板具有第二轴向孔和多个第二调节孔。 支撑板具有对应于第二轴向孔的第二通孔和与第二调节孔对准的第二锁孔。 第二紧固件通过第二通孔并被紧固到第二轴向孔。 因此,进行光单元的多角度调整。
    • 80. 发明申请
    • MODULAR LED HEAT-DISSIPATING DEVICE
    • 模块化LED散热装置
    • US20160061434A1
    • 2016-03-03
    • US14470121
    • 2014-08-27
    • YUJING TECHNOLOGY CO., LTD.
    • Cheng-Feng HUANG
    • F21V29/71F21V17/12F21V23/00
    • F21V29/713F21V17/12F21V23/002F21Y2115/10
    • A modular LED heat-dissipating device includes an LED circuit board, a heat-conducting adhesive layer, a heat-dissipating structure, and a wire terminal module. The LED light source illuminates by power supplied via the wire terminal module. Heat generated from the LED light source is dissipated by the heat-dissipating structure. This device does not dissipate heat by a lamp housing. So the lamp housing can be made of, but not limited to, plastic, thereby decreasing a production cost of the LED lamp. In addition, the modular LED heat-dissipating device can fit various kinds of lamp housings. When the LED light source breaks down, the modular LED heat-dissipating device and the lamp housing can be easily separated to replace or repair the LED light source.
    • 模块化LED散热装置包括LED电路板,导热粘合剂层,散热结构和导线端子模块。 LED光源通过电线端子模块供电。 由LED光源产生的热量由散热结构消散。 该装置不会被灯壳散热。 因此,灯壳体可以由塑料制成,但不限于此,从而降低了LED灯的生产成本。 此外,模块化LED散热装置可以适用于各种灯座。 当LED光源发生故障时,可以轻松分离模块化LED散热装置和灯壳,以更换或修理LED光源。