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71. 发明申请

US20060039781A1 Advanced low cost high throughput processing platform 有权
标题翻译：先进的低成本高吞吐量处理平台
公开(公告)号：US20060039781A1
公开(公告)日：2006-02-23
申请号：US11097412
申请日：2005-04-01
申请人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/677
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.
摘要翻译：一种晶片处理系统和方法，其中具有直径的晶片可在负载锁和处理室之间移动。传送室被布置成用于与装载锁和处理室的选择性压力连通。传送室具有横向范围的构造，使得晶片可沿着晶片传送路径移动通过负载锁和处理室之间的传送室，并且横向范围的配置导致具有晶片直径并沿着晶片传送移动的晶片路径，以便沿着晶片传送路径的任何位置干扰负载锁和处理室中的至少一个。晶片包括中心，并且晶片传送路径驾驶室由中心通过传送室的运动限定。描述了可以从起始位置以相反方向独立地移动不同角度的摆动臂。

72. 发明授权

US07001129B2 Loadlock apparatus and structure for creating a seal between an elevator drive shaft and the loadlock chamber thereof 有权
公开(公告)号：US07001129B2
公开(公告)日：2006-02-21
申请号：US10300020
申请日：2002-11-20
申请人： Ho Kim
发明人： Ho Kim
IPC分类号： B65G49/07
CPC分类号： H01L21/67126 , Y10S414/139
摘要： Sealing structure for use in creating a seal between an elevator drive shaft and a loadlock chamber includes a base fastened over a hole in the bottom wall of the loadlock chamber, a fixed member fastened to an upper part of the base, a seal housing spaced above the fixed member, a cap in the form of a flexible bellows having a first end adhered to an upper surface of the fixed member and a second end adhered to a lower surface of the seal housing, one or more support shafts having upper and lower ends pivotally connected to the seal housing and the fixed member outside the cap, a seal seated in the seal housing and having an inner circumferential surface contacting the outer circumferential surface of the elevator drive shaft, and a seal cover fixed to an upper part of the seal housing. According to the present invention, uniform pressure is maintained between the shaft and the seal during assembly and operation of the apparatus. Thus, a seal is always maintained between the elevator drive shaft and the bottom wall of the loadlock chamber.

73. 发明申请

US20060032073A1 Vacuum processing apparatus and operating method therefor 失效
公开(公告)号：US20060032073A1
公开(公告)日：2006-02-16
申请号：US11204171
申请日：2005-08-16
申请人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
发明人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
IPC分类号： F26B13/30 , F26B5/04
CPC分类号： H01L21/67748 , B01J3/006 , B41J2/36 , B41J2/365 , C23C14/564 , H01L21/67028 , H01L21/67167 , H01L21/67253 , H01L21/67736 , Y10S134/902 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

74. 发明授权

US06996453B2 Substrate processing apparatus and method of processing substrate while controlling for contamination in substrate transfer module 失效
标题翻译：基板处理装置和处理基板的方法，同时控制基板传送模块中的污染
公开(公告)号：US06996453B2
公开(公告)日：2006-02-07
申请号：US10684436
申请日：2003-10-15
申请人： Yo-Han Ahn , Ki-Doo Kim , Soo-Woong Lee , Jung-Sung Hwang , Hyeog-Ki Kim
发明人： Yo-Han Ahn , Ki-Doo Kim , Soo-Woong Lee , Jung-Sung Hwang , Hyeog-Ki Kim
IPC分类号： G06F7/00
CPC分类号： H01L21/00 , H01L21/67017 , Y10S414/139
摘要： A substrate processing apparatus for processing substrates prevents the substrates from contaminating as they are transferred. The apparatus includes a container, like a FOUP, for containing substrates, at least one processing chamber where the substrates are processed, a substrate transferring module including a substrate transfer chamber and at least one load port for supporting a container, and a contamination controlling system for the substrate transfer chamber. The contamination controlling system includes a purge gas supply inlet connected to the substrate transfer chamber, and a gas circulating tube for recycling the purging gas to circulate through the chamber. The substrate transfer chamber is purged using the purging gas to remove moisture and contaminating materials from the substrate transfer chamber. The formation of particles on the substrate otherwise caused by a reaction between the moisture and contaminating materials while the substrate is standing by in the container can be prevented.
摘要翻译：用于处理基板的基板处理装置防止基板在被转印时被污染。该装置包括用于容纳衬底的容器，如FOUP，用于处理衬底的至少一个处理室，包括衬底传送室的衬底传送模块和用于支撑容器的至少一个负载端口，以及污染控制系统用于衬底传送室。污染控制系统包括连接到基板传送室的吹扫气体供给入口和用于使净化气体循环通过室的气体循环管。使用净化气体清洗基板传送室，以从基板传送室去除水分和污染材料。可以防止在衬底上的颗粒在容器中待机时由水分和污染物质之间的反应引起的颗粒的形成。

75. 发明申请

US20050281638A1 Insertion device, lithographic apparatus with said insertion device and device manufacturing method 失效
标题翻译：插入装置，具有所述插入装置的光刻装置和装置制造方法
公开(公告)号：US20050281638A1
公开(公告)日：2005-12-22
申请号：US10851647
申请日：2004-05-24
申请人： Leo Kuipers , Johannes Franssen
发明人： Leo Kuipers , Johannes Franssen
IPC分类号： B65G1/00 , B65G49/07 , G03F7/20 , H01L21/027 , H01L21/677 , H01L21/68
CPC分类号： G03F7/7075 , H01L21/67742 , Y10S414/136 , Y10S414/139
摘要： A robot arm is presented, which inserts and removes an object from a conditioned environment using a carrier connected to the robot arm. The robot arm is positioned in a conditionable vessel, a wall of which vessel may deform when the interior is conditioned. Since the trajectory of the robot arm needs to be accurate, the robot arm is flexibly coupled to the vessel wall such that an orientation of the robot arm is independent from an orientation of the vessel wall. Further, a docking system is disclosed for use in a device comprising a robot arm having a carrier connected thereto.
摘要翻译：提出了一种机器人臂，其使用连接到机器人手臂的载体从调节环境中插入和移除物体。机器人臂位于可调节的容器中，当内部被调节时，其容器可能会变形。由于机器人手臂的轨迹需要准确，因此机器人手臂能够灵活地联接到血管壁上，使得机器人手臂的取向与血管壁的取向无关。此外，公开了一种用于装置的对接系统，该装置包括具有与其连接的载体的机器人手臂。

76. 发明授权

US06970770B2 Cluster tool and method for controlling transport 有权
标题翻译：集群工具和控制传输的方法
公开(公告)号：US06970770B2
公开(公告)日：2005-11-29
申请号：US10473135
申请日：2002-04-02
申请人： Kiyohito Iljima , Seiichi Kaise , Keiko Takahashi , Akira Obi
发明人： Kiyohito Iljima , Seiichi Kaise , Keiko Takahashi , Akira Obi
IPC分类号： H01L21/677 , H01L21/00 , G06F7/00
CPC分类号： H01L21/67184 , H01L21/67167 , H01L21/67276 , H01L21/67745 , Y10S414/139
摘要： At a time Tp when a wafer W is transferred into either a load lock chamber LL1 or LL2, periods PSL for the load lock chambers LL1 and LL2 to get ready to permit a transfer of a next wafer W thereinto are calculated based on a timing for exchange of wafers W between the load lock chamber LL1 or LL2 and a loader module LM. When the periods PSL are calculated, a loader arm LA1 or LA2 selects a next wafer W having the shortest period to get ready to be transferable into the load lock chamber LL1 or LL2, from load ports LP1 to LP3. This improves transfer delay in a cluster tool provided with the load lock chambers.
摘要翻译：在将晶片W转移到负载锁定室LL1或LL2中的时间Tp，基于负载锁定室LL1和LL2准备好允许下一个晶片W的转移的周期PSL基于在负载锁定室LL 1或LL 2与装载机模块LM之间交换晶片W的时间。当计算周期PSL时，装载臂LA 1或LA 2选择具有最短周期的下一个晶片W，以准备好从负载端口LP1至LP3转移到装载锁定室LL 1或LL 2中。这改善了与装载锁定室一起提供的集群工具中的传输延迟。

77. 发明授权

US06968630B2 Vacuum processing apparatus and operating method therefor 失效
公开(公告)号：US06968630B2
公开(公告)日：2005-11-29
申请号：US10796195
申请日：2004-03-10
申请人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
发明人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
IPC分类号： B01J3/00 , B41J2/36 , B41J2/365 , C23C14/56 , H01L21/00 , H01L21/677 , F26B5/04
CPC分类号： H01L21/67748 , B01J3/006 , B41J2/36 , B41J2/365 , C23C14/564 , H01L21/67028 , H01L21/67167 , H01L21/67253 , H01L21/67736 , Y10S134/902 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

78. 发明申请

US20050252571A1 Apparatus for replacing gas in storage container and method for replacing gas therewith 失效
标题翻译：用于替换储存容器中的气体的装置和用于替换气体的方法
公开(公告)号：US20050252571A1
公开(公告)日：2005-11-17
申请号：US11109863
申请日：2005-04-20
申请人： Ryuichi Nakano , Yukihiro Hyobu , Yoshihisa Okamoto
发明人： Ryuichi Nakano , Yukihiro Hyobu , Yoshihisa Okamoto
IPC分类号： B65B31/04 , B65D81/20 , H01L21/00 , H01L21/673 , H01L21/677 , B65B1/04
CPC分类号： H01L21/67393 , H01L21/67017 , H01L21/67772 , Y10S414/139 , Y10S414/14
摘要： While gas in a general storage container with no gas inlet and in the storage container with the gas inlet is replaced in a short time, the semiconductor wafer surface is cleaned. In an apparatus for replacing gas in a semiconductor wafer storage container which includes a lid unit and a storage container main body with a gas inlet, the apparatus includes gas introducing means for introducing the gas into the storage container main body, gas evacuating means for evacuating the gas in the storage container main body, and gas circulating means for circulating the gas in the storage container main body through a chemical adsorption filter. Gas introducing means for introducing the gas from a gap between the storage container main body and the lid unit while the lid unit is opened in the storage container mounting means is provided in the storage container with no gas inlet.
摘要翻译：虽然在短时间内更换没有气体入口的一般存储容器和具有气体入口的存储容器中的气体，但是清洁半导体晶片表面。另外，在具有盖单元和具有气体入口的收纳容器主体的半导体晶片收容容器中更换气体的装置中，具备将气体导入储存容器主体的气体导入机构，用于排气的排气装置储存容器主体中的气体，以及通过化学吸附过滤器使气体在储存容器主体中循环的气体循环装置。在储存容器安装装置中打开盖单元时，从存储容器主体和盖单元之间的间隙引入气体的气体引入装置设置在没有进气口的存储容器中。

79. 发明授权

US06960057B1 Substrate transport apparatus 有权
标题翻译：基板运输装置
公开(公告)号：US06960057B1
公开(公告)日：2005-11-01
申请号：US09163844
申请日：1998-09-30
申请人： Christopher A. Hofmeister
发明人： Christopher A. Hofmeister
IPC分类号： B25J9/06 , B25J9/10 , B25J9/16 , B65G49/06 , B65G49/07 , H01L21/677 , H01L21/687 , B25J9/00
CPC分类号： H01L21/67766 , B25J9/06 , B25J9/106 , H01L21/68707 , Y10S414/139 , Y10T74/20305
摘要： A substrate transport apparatus comprising a drive section and a robot transport arm. The robot transport arm is mounted to the drive section. The robot transport arm has a wrist and an end effector to hold the substrate thereon. The end effector is rotatably mounted to the wrist to rotate about the wrist. The rotation of the end effector about the wrist is slaved to the robot transport arm. The robot transport arm is adapted to transport substrates into and out of two general side-by-side orientated substrate holding areas with the drive section being located in only one location relative to the two holding areas.
摘要翻译：一种基板输送装置，包括驱动部和机器人输送臂。机器人传送臂安装在驱动部分。机器人传送臂具有手腕和端部执行器，以将基板保持在其上。端部执行器可旋转地安装到手腕上以绕手腕旋转。端部执行器围绕手腕的旋转被切割到机器人传送臂。机器人传送臂适于将基板输送进和移出两个通常的并排定向的基板保持区域，其中驱动部分仅位于相对于两个保持区域的一个位置。

80. 发明申请

US20050220577A1 Cluster tool and transfer control method 有权
标题翻译：集群工具和传输控制方法
公开(公告)号：US20050220577A1
公开(公告)日：2005-10-06
申请号：US11129327
申请日：2005-05-16
申请人： Kiyohito Iijima , Seiichi Kaise , Keiko Takahashi , Akira Obi
发明人： Kiyohito Iijima , Seiichi Kaise , Keiko Takahashi , Akira Obi
IPC分类号： H01L21/677 , H01L21/00 , B65G1/00
CPC分类号： H01L21/67184 , H01L21/67167 , H01L21/67276 , H01L21/67745 , Y10S414/139
摘要： At a time Tp when a wafer W is transferred into either a load lock chamber LL1 or LL2, periods PSL for the load lock chambers LL1 and LL2 to get ready to permit a transfer of a next wafer W thereinto are calculated based on a timing for exchange of wafers W between the load lock chamber LL1 or LL2 and a loader module LM. When the periods PSL are calculated, a loader arm LA1 or LA2 selects a next wafer W having the shortest period to get ready to be transferable into the load lock chamber LL1 or LL2, from load ports LP1 to LP3. This improves transfer delay in a cluster tool provided with the load lock chambers.
摘要翻译：在将晶片W转移到负载锁定室LL1或LL2中的时间Tp，基于负载锁定室LL1和LL2准备好允许下一个晶片W的转移的周期PSL基于在负载锁定室LL 1或LL 2与装载机模块LM之间交换晶片W的时间。当计算周期PSL时，装载臂LA 1或LA 2选择具有最短周期的下一个晶片W，以准备好从负载端口LP1至LP3转移到装载锁定室LL 1或LL 2中。这改善了与装载锁定室一起提供的集群工具中的传输延迟。

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