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    • 72. 发明授权
    • Vacuum treatment method
    • 真空处理方法
    • US08263193B2
    • 2012-09-11
    • US12311184
    • 2008-01-30
    • Hiroomi MiyaharaTatsuyuki Nishimiya
    • Hiroomi MiyaharaTatsuyuki Nishimiya
    • C23C16/00C23C16/50
    • H01L31/182C23C16/24C23C16/4557C23C16/509H01J37/32091H01J37/32724H01J2237/2001H01L21/02532H01L21/0262H01L31/075H01L31/076H01L31/1824H01L31/202Y02E10/546Y02P70/521
    • A vacuum treatment method and a vacuum treatment apparatus are provided in which the SiH2/SiH ratio does not increase even when the deposition rate is increased, thereby deterioration in the film quality is prevented and a high level of productivity can be achieved. A vacuum treatment method comprising the steps of heating a substrate (8) disposed inside a deposition chamber (6) under a reduced pressure atmosphere using a heat spreader (a heating device) (5), and supplying electric power to a discharge electrode (3) disposed in a position facing the substrate (8), thereby conducting a deposition on the substrate (8), wherein the deposition is conducted in a state where the temperature difference between the substrate (8) and the discharge electrode (3) is not more than 30° C. The deposition may also be conducted with the gap between the substrate (8) and the discharge electrode (3) set to not more than 7.5 mm.
    • 提供一种真空处理方法和真空处理装置,其中即使沉积速率增加,SiH 2 / SiH比也不增加,从而防止膜质量的劣化并且可以实现高水平的生产率。 一种真空处理方法,其特征在于,包括以下步骤:使用散热器(加热装置)(5)在减压气氛下加热配置在沉积室(6)内部的基板(8),并将电力供给到放电电极 ),设置在与基板(8)相对的位置,从而在基板(8)上进行沉积,其中在基板(8)和放电电极(3)之间的温度差不是的情况下进行沉积 大于30℃。沉积也可以在衬底(8)和放电电极(3)之间的间隙设定为不大于7.5mm的情况下进行。