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71. 发明授权

US06396692B1 Electronic control unit with integrated cooling module 失效
标题翻译：带集成冷却模块的电子控制单元
公开(公告)号：US06396692B1
公开(公告)日：2002-05-28
申请号：US09627210
申请日：2000-07-27
申请人： Jasmin B. Farshi , Steven E. Larson
发明人： Jasmin B. Farshi , Steven E. Larson
IPC分类号： H05H720
CPC分类号： H05K7/20872 , H05K7/20254
摘要： An electronic control unit (20) comprising a cooling module (36) having at least one fluid channel (32) therein, a substrate (50) configured to define an interior region (52) and having an electronic component (54) mounted thereto, such that the electronic component (54) faces the interior region (52), and a cooling fluid (34) within the fluid channel (32), the cooling fluid (34) having a temperature below an operating temperature of the electronic component (54), wherein the cooling module (36) is positioned within the interior region (52), such that the heat generated by the electronic component (54) is convectively transferred to the cooling module (36). By integrating the cooling module (36) with the substrate (50) and by positioning the cooling module (36) in the interior region (52), the cooling module (36) is able to convectively cool the substrate (50).
摘要翻译：一种电子控制单元（20），包括其中具有至少一个流体通道（32）的冷却模块（36），被配置为限定内部区域（52）并具有安装在其上的电子部件（54）的基板（50）使得电子部件（54）面向内部区域（52）和流体通道（32）内的冷却流体（34），冷却流体（34）的温度低于电子部件（54）的工作温度），其中所述冷却模块（36）定位在所述内部区域（52）内，使得由所述电子部件（54）产生的热量被对流地传递到所述冷却模块（36）。通过将冷却模块（36）与衬底（50）集成并且通过将冷却模块（36）定位在内部区域（52）中，冷却模块（36）能够对流地冷却衬底（50）。

72. 发明授权

US5594199A EMI baffle for electronic control 失效
标题翻译： EMI挡板用于电子控制
公开(公告)号：US5594199A
公开(公告)日：1997-01-14
申请号：US408802
申请日：1995-03-23
申请人： Michael P. Ciaccio
发明人： Michael P. Ciaccio
IPC分类号： H05K7/20 , H05K9/00
CPC分类号： H05K7/20872 , H05K7/20927 , H05K9/0018
摘要： An electronic control module includes an EMI baffle in the form of openings formed in laterally spaced portions of the cold plate supporting the electronic circuits. Preferably, upper and lower plates of the cold plate define a limited access baffle chamber with openings that require rerouted travel of any leakage radiation emanated by terminals or conductors carried by couplers inserted into the cold plate openings or passing through the openings. Preferably, each coupler is inserted through openings having an inlet axis in the cold plate and the module packaging covers are secured to the cold plate between an inlet and an outlet opening in the cold plate. Accordingly, simple gaskets may be used to seal the covers against the cold plates and the couplers against the cold plate. Moreover, the cold plate coolant passage has inlets and outlets that remain exposed exteriorly of the covers to avoid exposure of the internal circuitry to leakage.
摘要翻译：电子控制模块包括形成在支撑电子电路的冷板的横向隔开的部分中的开口形式的EMI挡板。优选地，冷板的上板和下板限定有限制的进入挡板室，其具有开口，其需要由插入到冷板开口中或通过开口的耦合器承载的端子或导体发出的任何泄漏辐射的路线行进。优选地，每个耦合器通过在冷板中具有入口轴线的开口插入，并且模块封装盖在冷板的入口和出口之间固定到冷板。因此，可以使用简单的垫圈将盖抵靠冷板和联接器抵靠冷板密封。此外，冷板冷却剂通道具有保留在盖外部的入口和出口，以避免内部电路暴露于泄漏。

73. 发明申请

US20190208672A1 POWER CONVERSION DEVICE 审中-公开
公开(公告)号：US20190208672A1
公开(公告)日：2019-07-04
申请号：US16321539
申请日：2016-09-20
申请人： Mitsubishi Electric Corporation
发明人： Shota YAMABE , Shogo MIKI , Katsuhisa KODAMA
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H02M7/48 , H05K7/20854 , H05K7/20872 , H05K7/209
摘要： In a power conversion device, a casing main body has a component mounting surface, on which electrical components are mounted, and a refrigerant flow passage surface, which is a back side of the component mounting surface. The refrigerant flow passage surface has a refrigerant flow passage groove. The component mounting surface has a first facing portion, which faces a lid, a second facing portion, which is adjacent to the first facing portion, and faces the lid farther away from the lid than the first facing portion, and aside surface portion, which is formed between the first facing portion and the second facing portion. The refrigerant flow passage groove has a first flow passage portion located on back sides of the first facing portion and the side surface portion, and a second flow passage portion located on a back side of the second facing portion.

74. 发明申请

US20190208666A1 ON-BOARD CHARGER WITH HEAT DISSIPATION STRUCTURE 审中-公开
公开(公告)号：US20190208666A1
公开(公告)日：2019-07-04
申请号：US16234763
申请日：2018-12-28
申请人： Shenzhen Vmax Power Co., Ltd.
发明人： Jun LIU , Yingying Feng , Shun Yao
IPC分类号： H05K7/20 , H05K7/14 , H02J7/00 , B60L53/22
CPC分类号： H05K7/20272 , B60L53/22 , B60L2210/30 , B60L2240/36 , H02J7/0042 , H05K7/1427 , H05K7/20872 , H05K7/20927 , Y02T10/7005
摘要： The present invention discloses an on-board charger with a heat dissipation structure. The on-board charger comprises a casing, and heat generating components, a PCB and a heat dissipation structure which are arranged inside the casing, and is characterized in that the heat dissipation structure is a coolant flow channel; the coolant flow channel is arranged longitudinally with respect to the heat generating components, and is in full contact with each heat generating component; heat is dissipated from the heat generating components by using respective surfaces of the coolant flow channel. The on-board charger with the heat dissipation structure provided by the present invention has the advantages of small size, excellent heat dissipation effect, simple assembly, low cost and light weight.

75. 发明申请

US20190171258A1 Modular Vehicle Computing System Cooling Systems 审中-公开
公开(公告)号：US20190171258A1
公开(公告)日：2019-06-06
申请号：US15892506
申请日：2018-02-09
申请人： Uber Technologies, Inc.
发明人： David Patrick Rice , Thomas Jeffery Watson, JR. , John William Zinn , Robert Henry Doll , Declan Seamus Kelly
IPC分类号： G06F1/20 , H05K7/20 , B60R16/023 , F28D15/02
CPC分类号： G06F1/20 , B60H1/00271 , B60H2001/00307 , B60R16/0231 , B60Y2306/05 , F28D15/0275 , G06F2200/201 , H01L23/427 , H01L23/467 , H01L23/473 , H05K7/20136 , H05K7/20254 , H05K7/20336 , H05K7/20854 , H05K7/20863 , H05K7/20872 , H05K7/20881 , H05K7/20927
摘要： Devices, systems, and methods for cooling an autonomous vehicle computing system are provided. A modular cooling device can include a cooling baseplate and one or more modular heat frames. The cooling baseplate can include at least one planar cooling surface, an inlet configured to receive a cooling fluid, an outlet, and at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the at least one planar cooling surface. Each modular heat frame can be configured to house at least one autonomous vehicle computing system component, be coupled parallel to the at least one planar cooling surface, and transfer heat from the at least one autonomous vehicle computing system component housed by the modular heat frame to the cooling baseplate.

76. 发明申请

US20190132991A1 Liquid Cooling System And Method 审中-公开
公开(公告)号：US20190132991A1
公开(公告)日：2019-05-02
申请号：US16306045
申请日：2016-06-01
申请人： ABB Schweiz AG
发明人： Irene Gardoni , Manfred Kipfer , Erika De-Candido
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , F01P11/028 , H05K7/20218 , H05K7/20627 , H05K7/20763 , H05K7/20872 , H05K7/20927
摘要： A liquid cooling system for cooling an electrical component, the liquid cooling system including a cooling circuit having at least one supply branch for supplying liquid coolant to an electrical component; and a de-aeration line to provide a connection between a high point and a junction point of the cooling circuit to bypass a part of the cooling circuit; wherein the pressure of the liquid coolant is lower in the junction point than in the high point during circulation of the liquid coolant in the liquid cooling system.

77. 发明授权

US09979320B2 Electronic inverter assembly 有权
公开(公告)号：US09979320B2
公开(公告)日：2018-05-22
申请号：US15248241
申请日：2016-08-26
申请人： Deere & Company
发明人： Brij N. Singh , Christopher J. Schmit
IPC分类号： H02M7/537 , H02M7/00 , H02M1/42 , H01L29/16 , H01L29/20 , H02M1/08 , H05K1/18 , H05K1/14 , H01L25/07 , H05K1/11 , H05K1/16 , H02P27/06 , G01R15/18 , G01R15/20 , H02M1/00
CPC分类号： H02M7/537 , G01R15/18 , G01R15/202 , H01L25/072 , H01L29/1608 , H01L29/2003 , H02M1/08 , H02M7/003 , H02M2001/0009 , H02P27/06 , H05K1/0263 , H05K1/117 , H05K1/144 , H05K1/165 , H05K1/181 , H05K7/1432 , H05K7/20518 , H05K7/20872 , H05K2201/042 , H05K2201/10151 , H05K2201/10166 , H05K2201/10189 , H05K2201/10272
摘要： A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

78. 发明申请

US20170361722A1 CHARGING DEVICE FOR AN ENERGY STORE OF AN ELECTRIC VEHICLE 审中-公开
公开(公告)号：US20170361722A1
公开(公告)日：2017-12-21
申请号：US15622774
申请日：2017-06-14
申请人： Dr. Ing. h.c. F. Porsche Aktiengesellschaft
发明人： David KÖHLER , Volker REBER
IPC分类号： B60L11/18 , H02J7/00 , H05K7/20
CPC分类号： B60L11/1825 , B60L11/1818 , B60L11/1824 , B60L2230/12 , B60Y2200/91 , H02J7/0045 , H05K7/20845 , H05K7/20872 , Y02T10/7005 , Y02T10/7088 , Y02T90/121 , Y02T90/14
摘要： A charging device for an energy store of an electrically driven vehicle, which includes a charging plug for transmitting an electrical charge to the energy store of the motor vehicle, a charging line for connecting the charging plug to a power grid, and a charging pillar with a docking station for receiving the charging plug when it is not in use and for connecting the charging line to the power grid. A cooling device for cooling the charging plug is arranged in the docking station.

79. 发明申请

US20170303445A1 Peristaltic Pump for Power Electronics Assembly 有权
公开(公告)号：US20170303445A1
公开(公告)日：2017-10-19
申请号：US15099989
申请日：2016-04-15
申请人： Ford Global Technologies, LLC
发明人： Brian Joseph Robert , Serdar Hakki Yonak , Alvaro Masias
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H01M2/1083 , H01M10/613 , H01M10/625 , H01M10/637 , H01M10/6568 , H01M2220/20 , H05K7/20872
摘要： A power electronics assembly may include a power electronics device, a packaging assembly, a thermal management system, and an emitter. The packaging assembly supports power electronics device. The thermal management system supports the packaging assembly and includes a thermal plate to deliver coolant for thermally communicating with the device. The thermal plate defines a channel with a wall. The emitter is arranged with the wall to form a peristaltic pump to adjust a cross-sectional area of the channel to control a flow of coolant therethrough. A membrane may be partially secured to the wall and include one of dielectric particles or magnetic particles. The emitter may selectively output one of a voltage, an electric field, or a magnetic field to impart a force on the particles to move the membrane and adjust the cross-sectional area of the channel to control a flow of coolant therethrough.

80. 发明授权

US09769962B2 Motor controller 有权
公开(公告)号：US09769962B2
公开(公告)日：2017-09-19
申请号：US14887303
申请日：2015-10-19
申请人： Zhongshan Broad-Ocean Motor Co., Ltd.
发明人： Fengtai Huang , Bertrand Robert Mohr
IPC分类号： H02P1/00 , H05K7/20
CPC分类号： H05K7/20872 , H05K7/20927
摘要： A motor controller, including: a box body, a capacitor module, and an inverse module. The box body includes a chamber, and a radiator is disposed in the chamber. The radiator divides the chamber to yield a first chamber and a second chamber. The inverse module is disposed on an upper surface of the radiator in the first chamber. The capacitor module is disposed on a lower surface of the radiator in the second chamber. The radiator includes a cooling waterway, and a water inlet and a water outlet that communicate with the cooling waterway. The cooling waterway is adapted to cool the capacitor module and the inverse module.

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