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    • 2. 发明授权
    • Method of diffusion bonding and laminated heat exchanger formed thereby
    • 由此形成扩散接合和层压热交换器的方法
    • US5038857A
    • 1991-08-13
    • US540276
    • 1990-06-19
    • Michael P. Ciaccio
    • Michael P. Ciaccio
    • B23K20/00B23K33/00F28F3/08
    • B23K33/00B23K20/00F28F3/086Y10S165/36
    • Leakage of fluid from a heat exchanger and fluid mixing in the case of a two fluid compact high intensity cooling heat exchanger are prevented by diffusion bonded areas of the heat exchanger formed using small locally raised borders which extend about the fluid passage or passages of the heat exchanger to form raised contact portions that experience locally high stresses during diffusion bonding thereby insuring material flow and complete bonding. The thickness of the locally raised borders is the same as or slightly greater than the tolerance of the rolled sheet material used to form the laminates of the heat exchanger whereby local deviations in thickness of the thin laminates will not result in non-bonded areas.
    • 在两个流体致密的高强度冷却热交换器的情况下,来自热交换器的流体的泄漏和流体混合被防止了通过使用小的局部凸起的边界形成的热交换器的扩散接合区域,该边缘围绕流体通道或热通道 交换器以形成在扩散接合期间经历局部高应力的凸起接触部分,由此确保材料流动和完全接合。 局部凸起的边界的厚度与用于形成热交换器的层压体的轧制板材的公差相同或略大,因此薄层压板的厚度的局部偏差不会导致非粘合区域。
    • 3. 发明授权
    • Pivotable electrical connection apparatus
    • 数据透视电气连接装置
    • US5276587A
    • 1994-01-04
    • US44918
    • 1993-04-08
    • Michael P. Ciaccio
    • Michael P. Ciaccio
    • H05K7/20
    • H05K7/20509
    • An electrical device to be electrically mounted to a cooling mounting structure so that the electrical device is in intimate physical contact with the mounting structure for cooling the electrical device. The electrical device having a first pivot allowing contact for allowing the electrical device to be pivoted as it is mounted to the cooling mounting structure so that the electrical device is in intimate physical contact with the cooling mounting structure and for providing an electrical connection to the cooling mounting structure and the electrical device further having a second nonpivot allowing contact having a shape for providing electrical contact with the mounting structure when the electrical device is in intimate physical contact with the cooling mounting structure.
    • 一种电气装置,其电气安装到冷却安装结构,使得电气装置与用于冷却电气装置的安装结构紧密地物理接触。 电气装置具有允许接触的第一枢轴,用于允许电气装置在安装到冷却安装结构时枢转,使得电气装置与冷却安装结构紧密物理接触并且用于提供与冷却的电连接 安装结构,并且电气设备还具有允许接触件的第二非枢轴,当电气设备与冷却安装结构紧密物理接触时,该接触件具有用于与安装结构电接触的形状。
    • 4. 发明授权
    • Cooling rack for electronic devices
    • 电子设备冷却架
    • US5177666A
    • 1993-01-05
    • US781886
    • 1991-10-24
    • Timothy J. BlandMichael P. CiaccioR. Scott Downing
    • Timothy J. BlandMichael P. CiaccioR. Scott Downing
    • H05K7/20
    • H05K7/20636H05K1/144
    • A cooling rack is provided for cooperating with a chassis, the chassis having both electrical and fluid connectors, the fluid connectors being interconnected by a manifold for distributing cooling fluid to and from the rack, the rack having a cooling support including at least one electrical component cooling pad, a rack manifold for circulating cooling fluid to the cooling pad, a rack electrical connector, a rack inlet fluid connector in fluid communication with the rack manifold for receiving cooling fluid from the chassis to be circulated through the rack manifold for cooling the cooling pad, and a rack outlet fluid connector in fluid communication with the rack manifold for returning cooling fluid from the rack manifold to the chassis so that the cooling fluid can be recooled, wherein the rack electrical connectors, the rack inlet fluid connector, and the rack outlet fluid connector are arranged so that, when the cooling rack is attached to the chassis, the rack electrical connector, the rack inlet fluid connector, and the rack outlet fluid connector will mate generally in unison with the respective chassis electrical connector and chassis fluid connectors.
    • 冷却架设置成与底盘配合,底盘具有电连接器和流体连接器,流体连接器通过歧管互连,用于将冷却流体分配到机架和从架子分配冷却流体,该冷却支架包括至少一个电气部件 冷却垫,用于将冷却流体循环到冷却垫的齿条歧管,齿条电连接器,与齿条歧管流体连通的齿条入口流体连接器,用于接收来自底盘的冷却流体,以通过齿条歧管循环以冷却冷却 垫和与齿条歧管流体连通的齿条出口流体连接器,用于将冷却流体从齿条歧管返回到底盘,使得冷却流体可以被重新冷却,其中齿条电连接器,齿条入口流体连接器和齿条 出口流体连接器布置成使得当冷却架附接到机架时,机架电气连接 r,机架入口流体连接器和机架出口流体连接器将大体上与相应的底盘电连接器和底盘流体连接器配合。
    • 5. 发明授权
    • Cold plate for cooling electronics
    • 冷板用于冷却电子
    • US5088005A
    • 1992-02-11
    • US520801
    • 1990-05-08
    • Michael P. Ciaccio
    • Michael P. Ciaccio
    • H05K7/20
    • H05K7/20636
    • A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling the electronic components adjacent the zones, and tailoring a heat exchanger layer of the multi-layered cold plate with different heat exchanger structures in respective cooling zones to provide relatively high and relatively lower efficiency cooling where needed. A coolant flow, jet impingement heat exchange structure formed of alternately stacked orifice plates and spacer plates provides the high efficiency cooling. The heat exchanger layer is the only layer of the cold plate which must be customized for accommodating a particular arrangement of electronic components to be cooled.
    • 多层冷板被定制为通过将冷板分成多个假想冷却区域来冷却多个电子部件以与冷板热连接,确定各冷却区域所需的冷却以冷却 邻近区域的电子部件,并且在相应的冷却区域中使用不同的热交换器结构调整多层冷板的热交换器层,以在需要时提供相对较高和相对较低效率的冷却。 由交替堆叠的孔板和间隔板形成的冷却剂流动,喷射冲击热交换结构提供高效冷却。 热交换器层是冷板的唯一层,其必须被定制以容纳要冷却的电子部件的特定布置。
    • 6. 发明授权
    • EMI baffle for electronic control
    • EMI挡板用于电子控制
    • US5594199A
    • 1997-01-14
    • US408802
    • 1995-03-23
    • Michael P. Ciaccio
    • Michael P. Ciaccio
    • H05K7/20H05K9/00
    • H05K7/20872H05K7/20927H05K9/0018
    • An electronic control module includes an EMI baffle in the form of openings formed in laterally spaced portions of the cold plate supporting the electronic circuits. Preferably, upper and lower plates of the cold plate define a limited access baffle chamber with openings that require rerouted travel of any leakage radiation emanated by terminals or conductors carried by couplers inserted into the cold plate openings or passing through the openings. Preferably, each coupler is inserted through openings having an inlet axis in the cold plate and the module packaging covers are secured to the cold plate between an inlet and an outlet opening in the cold plate. Accordingly, simple gaskets may be used to seal the covers against the cold plates and the couplers against the cold plate. Moreover, the cold plate coolant passage has inlets and outlets that remain exposed exteriorly of the covers to avoid exposure of the internal circuitry to leakage.
    • 电子控制模块包括形成在支撑电子电路的冷板的横向隔开的部分中的开口形式的EMI挡板。 优选地,冷板的上板和下板限定有限制的进入挡板室,其具有开口,其需要由插入到冷板开口中或通过开口的耦合器承载的端子或导体发出的任何泄漏辐射的路线行进。 优选地,每个耦合器通过在冷板中具有入口轴线的开口插入,并且模块封装盖在冷板的入口和出口之间固定到冷板。 因此,可以使用简单的垫圈将盖抵靠冷板和联接器抵靠冷板密封。 此外,冷板冷却剂通道具有保留在盖外部的入口和出口,以避免内部电路暴露于泄漏。