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71. 发明授权

US08202118B2 Differential electrical connector assembly 有权
标题翻译：差动电连接器总成
公开(公告)号：US08202118B2
公开(公告)日：2012-06-19
申请号：US12891198
申请日：2010-09-27
申请人： Thomas S. Cohen , Mark W. Gailus , John R. Dunham
发明人： Thomas S. Cohen , Mark W. Gailus , John R. Dunham
IPC分类号： H01R13/648
CPC分类号： H01R12/716 , H01R12/585 , H01R12/724 , H01R12/727 , H01R13/514 , H01R13/6474 , H01R13/6587 , H01R13/6591 , H05K1/14 , H05K7/1445 , H05K2201/044 , H05K2201/10189 , H05K2203/1572
摘要： A differential connector has a plurality of rows. Each row includes a plurality of signal conductors provided as differential pairs. Each signal conductor has a first contact end connectable to a printed circuit board, a second contact end, and an intermediate portion having a first width. For each differential pair, one first contact end lies along a first line parallel to the plurality of rows and the other first contact end lies along a second line parallel to and spaced from the first line. The differential connector further includes a plurality of ground conductors, with each ground conductor corresponding to a differential pair. Each ground conductor has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion having a second width that is at least twice the first width.
摘要翻译：差分连接器具有多行。每行包括多个作为差分对提供的信号导体。每个信号导体具有可连接到印刷电路板的第一接触端，第二接触端和具有第一宽度的中间部分。对于每个差分对，一个第一接触端沿着平行于多个行的第一线设置，而另一个第一接触端沿着与第一线平行并与之隔开的第二线。差分连接器还包括多个接地导体，每个接地导体对应于差分对。每个接地导体具有可连接到印刷电路板的第一接触端，第二接触端和具有至少为第一宽度的两倍的第二宽度的中间部分。

72. 发明授权

US08188375B2 Multilayer circuit board and method for manufacturing the same 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US08188375B2
公开(公告)日：2012-05-29
申请号：US11603884
申请日：2006-11-22
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： H05K1/16
CPC分类号： H05K3/4652 , H01L23/49822 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/2518 , H01L2224/82039 , H01L2224/82047 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/185 , H05K3/0044 , H05K3/0058 , H05K3/4602 , H05K3/4682 , H05K3/4688 , H05K2201/0358 , H05K2201/09518 , H05K2201/09527 , H05K2201/09563 , H05K2203/0152 , H05K2203/025 , H05K2203/0554 , H05K2203/1105 , H05K2203/1476 , H05K2203/1572 , Y10T29/49128 , Y10T428/24917 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.
摘要翻译：多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

73. 发明授权

US08186043B2 Method of manufacturing a circuit board 有权
标题翻译：制造电路板的方法
公开(公告)号：US08186043B2
公开(公告)日：2012-05-29
申请号：US12891176
申请日：2010-09-27
申请人： Sang-min Lee , Deok-heung Kim , Doc-hwa Na
发明人： Sang-min Lee , Deok-heung Kim , Doc-hwa Na
IPC分类号： H05K3/36
CPC分类号： H05K3/4602 , H01L21/4846 , H01L21/486 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15311 , H05K3/06 , H05K3/4644 , H05K3/465 , H05K2201/09881 , H05K2203/025 , H05K2203/0369 , H05K2203/1476 , H05K2203/1572 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , H01L2224/0401
摘要： A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern.
摘要翻译：提供电路板和制造电路板的方法。该方法包括在导电板的第一侧上形成至少一个突出的凸块，在导电板的形成有至少一个凸块的第一侧上形成电介质层以覆盖至少一个凸块; 并且蚀刻导电板的第二面以便部分地去除所述板以形成图案。

74. 发明申请

US20120125765A1 PLASMA PROCESSING APPARATUS AND PRINTED WIRING BOARD MANUFACTURING METHOD 审中-公开
标题翻译：等离子体加工设备和印刷线路板制造方法
公开(公告)号：US20120125765A1
公开(公告)日：2012-05-24
申请号：US13387789
申请日：2010-07-16
申请人： Tadahiro Ohmi , Tetsuya Goto , Takaaki Matsuoka
发明人： Tadahiro Ohmi , Tetsuya Goto , Takaaki Matsuoka
IPC分类号： C23C14/35
CPC分类号： H05K3/16 , C23C14/022 , C23C14/024 , C23C14/046 , C23C14/165 , C23C14/352 , C23C14/568 , H05K3/381 , H05K3/388 , H05K2203/095 , H05K2203/1572
摘要： It is an object of the present invention to provide a wiring board plasma processing apparatus capable of improving throughput and achieving reduction in running cost while a sputtering process is employed in manufacturing a wiring board. The wiring board plasma processing apparatus of the present invention has, in a same plasma processing chamber, a surface processing portion provided with a plasma source and performing a pretreatment of a board to be processed, and a plurality of sputtering film forming portions forming a seed layer formed of a plurality of films.
摘要翻译：本发明的目的是提供一种能够提高生产能力并且在制造布线板时采用溅射处理来降低运行成本的布线板等离子体处理装置。本发明的布线基板等离子体处理装置在同一等离子体处理室中具有设置有等离子体源的表面处理部，对待处理的基板进行预处理，以及形成种子的多个溅射成膜部层由多个膜形成。

75. 发明申请

US20120080322A1 METHOD, TREATMENT STATION AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED 有权
标题翻译：方法，处理站和组装处理待处理的平面材料
公开(公告)号：US20120080322A1
公开(公告)日：2012-04-05
申请号：US13320522
申请日：2010-05-12
申请人： Henry Kunze
发明人： Henry Kunze
IPC分类号： H05K3/00 , B08B1/02 , B01J19/08 , B08B3/08
CPC分类号： H05K3/0085 , B05C3/09 , B05C11/06 , C25D7/0621 , C25D7/0642 , C25D17/00 , C25D21/10 , H05K2203/0143 , H05K2203/0746 , H05K2203/1509 , H05K2203/1572
摘要： In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).
摘要翻译：为了将待处理的平面材料（10）中的处理液（21）从用于电解或湿化学处理待处理材料（10）的组件中运输，或促进交换提供待处理材料（10）的表面上的材料，具有辊表面（4,14）的辊。辊表面（4,14）相对于待处理材料（10）的输送路径布置，使得间隙（8,18）保留在辊表面（4,14）和材料的有用区域之间待处理（10）与在有用区域上延伸的辊表面（4,14）相对。辊可旋转地驱动，使得在间隙（8,18）处，在辊表面（4,14）和待处理材料（10）之间产生相对速度。

76. 发明申请

US20120057312A1 Flexible printed circuit board and touch screen panel apparatus having the same 有权
标题翻译：柔性印刷电路板和具有相同功能的触摸屏面板装置
公开(公告)号：US20120057312A1
公开(公告)日：2012-03-08
申请号：US12929692
申请日：2011-02-09
申请人： Young-Seok Yoo , Hyun-Wook Cho
发明人： Young-Seok Yoo , Hyun-Wook Cho
IPC分类号： H05K1/00
CPC分类号： H05K1/147 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04111 , H05K1/118 , H05K3/361 , H05K2201/053 , H05K2201/056 , H05K2203/1572 , H05K2203/166
摘要： A flexible printed circuit board (FPCB) simultaneously coupled to both surfaces of a substrate structure, e.g., a touch screen panel is provided. The FPCB includes a main substrate unit having a first pad unit and an auxiliary substrate unit extending from the main substrate unit to one side of the first pad unit. The auxiliary substrate unit includes a first substrate unit positioned parallel with the first pad unit along a first direction, a second substrate unit including a second pad unit, the second substrate unit spaced apart from the first substrate unit in a second direction, orthogonal to the first direction, and a plurality of third substrate units extending along the second direction between the first and second substrate units.
摘要翻译：提供了同时耦合到诸如触摸屏面板的基板结构的两个表面的柔性印刷电路板（FPCB）。 FPCB包括具有第一衬垫单元和从主衬底单元延伸到第一衬垫单元的一侧的辅助衬底单元的主衬底单元。辅助基板单元包括沿着第一方向与第一焊盘单元平行定位的第一基板单元，第二基板单元，包括第二垫单元，第二基板单元在第二方向上与第一基板单元间隔开，与第一基板单元正交第一方向，以及沿第二方向在第一和第二基板单元之间延伸的多个第三基板单元。

77. 发明授权

US08122598B2 Multilayer printed wiring board and component mounting method thereof 有权
标题翻译：多层印刷电路板及其部件安装方法
公开(公告)号：US08122598B2
公开(公告)日：2012-02-28
申请号：US12468626
申请日：2009-05-19
申请人： Toshihiko Yokomaku
发明人： Toshihiko Yokomaku
IPC分类号： H05K3/34
CPC分类号： H05K3/3463 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/16251 , H05K1/0262 , H05K1/141 , H05K3/341 , H05K3/3415 , H05K3/3457 , H05K3/4602 , H05K2201/045 , H05K2201/10189 , H05K2201/10318 , H05K2201/10424 , H05K2201/10674 , H05K2203/1572 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , H01L2224/05599
摘要： A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.
摘要翻译：多层印刷电路板的部件安装方法包括：多个焊料凸块，用于安装形成在其前后的电子元件，其中当焊料凸块由第一，第二，第三和第四焊料，第一，第二，第三和第四焊料具有不同的熔点，第一，第二，第三和第四焊料的熔点被排列为第一焊料的熔点，第二焊料的熔点，熔化第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用，并且第一，第二，第三和第四焊料依次用于以高熔点的顺序焊接电子部件等。此外，在这种情况下，优选地，具有大体积的焊料凸块应比其它焊料凸块更早地焊接。该多层印刷电路板容易安装组件，工作效率优异或易于再加工的工艺，并且还提供了这种多层印刷线路板的安装方法。

78. 发明申请

US20120037409A1 METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD OBTAINED THEREBY 有权
标题翻译：制造多层印刷线路板和多层布线板的方法
公开(公告)号：US20120037409A1
公开(公告)日：2012-02-16
申请号：US13256114
申请日：2010-03-09
申请人： Norihiro Yamaguchi , Hiroaki Umeda , Ken Yukawa
发明人： Norihiro Yamaguchi , Hiroaki Umeda , Ken Yukawa
IPC分类号： H05K1/09 , H05K3/30
CPC分类号： H05K3/46 , H01B1/22 , H05K1/0298 , H05K1/095 , H05K3/0032 , H05K3/4069 , H05K3/462 , H05K2201/0191 , H05K2201/0272 , H05K2201/0355 , H05K2201/10378 , H05K2203/0278 , H05K2203/0425 , H05K2203/1105 , H05K2203/111 , H05K2203/1194 , H05K2203/1461 , H05K2203/1572 , Y10T29/49117 , Y10T29/49124 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165
摘要： In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.
摘要翻译：在制造多层板的方法中，包括：通过激光束加工形成通孔的钻孔步骤，用含有树脂成分和金属粉末的导电膏填充通孔的步骤，以及步骤在填充的导电糊料上和下方布置图案化板的铜层或铜层部分并对其进行压制，通过使用合金糊作为导电浆料，获得导电性和长期稳定性优异的多层印刷线路板，其中至少使用在进行预热之前，使用比例A / B为10以上的预浸料，将金属粉末的一部分熔融并且彼此相邻的金属粉末合金化，其中A是在拐点处的储能模量，储能模量从增加到减少变化，B是在从60℃升高的温度分布中储能模量从降低到升高的拐点处的储能模量到200℃，并且在钻井步骤之前预热预浸料以将A / B比率降低到10以下。

79. 发明申请

US20120004012A1 DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING 有权
标题翻译：双面触摸敏感面板和柔性电路接合
公开(公告)号：US20120004012A1
公开(公告)日：2012-01-05
申请号：US13235321
申请日：2011-09-16
申请人： Mark Arthur HAMBLIN , Steve Porter HOTELLING
发明人： Mark Arthur HAMBLIN , Steve Porter HOTELLING
IPC分类号： H04W88/02 , H05K3/00 , G06F3/045
CPC分类号： H01R12/62 , G06F3/0416 , G06F2203/04103 , H01H2001/5816 , H01R4/04 , H01R43/205 , H05K3/323 , H05K3/361 , H05K2203/0278 , H05K2203/1121 , H05K2203/1572 , Y10T29/49124 , Y10T29/49155
摘要： A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.
摘要翻译：可以使用在两侧形成的柱和行迹线的基板来创建多点触摸传感器面板。可以使用沿基板边界延伸的金属轨迹将行迹线与列轨迹相同。可以制造单个柔性电路以连接到直接相对侧上的行和列。柔性印刷电路可以通过在粘合另一个基板的同时冷却基板的一侧而与基板的直接相对的附接区域接合。此外，在柔性电路上的直角迹线上延伸的“覆盖层”材料可确保在接合期间导电接合材料被挤出时，这些迹线不会短路。此外，间隔件放置在柔性电路的远端处，以在接合期间在整个柔性电路连接区域上施加均匀的粘结压力。

80. 发明授权

US08050053B2 Electronic circuit arrangement for control purposes 有权
标题翻译：电子电路布置用于控制目的
公开(公告)号：US08050053B2
公开(公告)日：2011-11-01
申请号：US11976891
申请日：2007-10-29
申请人： Bernhard Deck , Ernst Johansen , Bernhard Loher , Franz Zurfluh , Hans-Peter Zueger , Paul Rudolf
发明人： Bernhard Deck , Ernst Johansen , Bernhard Loher , Franz Zurfluh , Hans-Peter Zueger , Paul Rudolf
IPC分类号： H05K1/11
CPC分类号： H05K1/141 , H05K7/1432 , H05K2201/10159 , H05K2201/10189 , H05K2201/10212 , H05K2201/10689 , H05K2203/1572
摘要： The electronic circuit arrangement for controlling a process device comprises a process interface circuitry and a processing circuitry, wherein the process interface circuitry is designed for receiving process signals from the process device and converting the process signals into converted signals and/or digital data, which converted signals and/or digital data are transmitted to the processing circuitry, and wherein the processing circuitry is designed for processing the converted signals and/or digital data and for outputting processed signals and/or digital data, which processed signals and/or digital data are transmitted to the process interface circuitry, and wherein the process interface circuitry is designed for converting the processed signals and/or digital data into control signals, which control signals are transmitted to the process device. The process interface circuitry comprises one or more first printed circuit board assemblies, and the processing circuitry comprises one or more second printed circuit board assemblies, which second printed circuit board assemblies are different from the first printed circuit board assemblies, and wherein each second printed circuit board assembly is electrically connected to at least one of the first printed circuit board assemblies. The circuit arrangement may find applications in high or medium voltage devices, in drives and in power converters.
摘要翻译：用于控制处理装置的电子电路装置包括处理接口电路和处理电路，其中处理接口电路被设计用于从处理装置接收处理信号，并将处理信号转换成转换的信号和/或数字数据，其被转换信号和/或数字数据被发送到处理电路，并且其中处理电路被设计用于处理转换的信号和/或数字数据，并且用于输出经处理的信号和/或数字数据，处理的信号和/或数字数据是被传送到过程接口电路，并且其中过程接口电路被设计用于将处理的信号和/或数字数据转换成控制信号，该控制信号被传送到过程设备。处理接口电路包括一个或多个第一印刷电路板组件，并且处理电路包括一个或多个第二印刷电路板组件，第二印刷电路板组件与第一印刷电路板组件不同，并且其中每个第二印刷电路板组件电连接到第一印刷电路板组件中的至少一个。电路装置可以在高压或中压装置，驱动器和功率转换器中使用。

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